Abstract: The present invention discloses a method for fabricating a light emitting diode (LED) package structure. The method comprises the following steps: a carrier having a substrate and a first protrusion is provided, wherein the first protrusion is disposed on the substrate and has a recess. An adhesion layer and a LED chip are disposed on a bottom of the recess, wherein the adhesion layer is bonded between the carrier and the LED chip, and a ratio between a width of the recess and a width of the LED chip is larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the recess.

Abstract: The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.

Abstract: A scrambling sequence is initialized using at least a cell identifier and an offset, and a physical downlink control information DCI is sent to a user equipment which indicates the offset. In more particular embodiments a user equipment-specific reference signal UE-RS is scrambled using the initialized scrambling sequence, and the scrambled UE-RS is sent to the UE for demodulating a downlink shared channel (PDSCH). In another exemplary embodiment the generated UE-RS is sent in a pilot part of a subframe transmission associated with the PDSCH and is for demodulating at least a data part of that subframe transmission. In a specific embodiment from the UE side, the UE receives the UE-RS and the DCI which indicates the offset, descrambles the UE-RS using a scrambling sequence that is initialized using a cell identifier and the indicated offset; and demodulates the PDSCH using the de-scrambled UE-RS.

Abstract: A light emitting diode (LED) structure, a LED packaging structure, and a method of forming LED structure are disclosed. The LED structure includes a sub-mount, a stacked structure, an electrode, an isolation layer and a conductive thin film layer. The sub-mount has a first surface and a second surface opposite the first surface. The stacked structure has a first semiconductor layer, an active layer and a second semiconductor layer that are laminated on the first surface. The electrode is disposed apart from the stacked structure on the first surface. The isolation layer is disposed on the first surface to surround the stacked structure as well as cover the lateral sides of the active layer. The conductive thin film layer connects the electrode to the stacked structure and covers the stacked structure.

Abstract: A light emitting device with magnetic field includes a light emitting device, a thermal conductive material layer and a magnetic layer. The thermal conductive material layer is coupled with the light emitting device to dissipate heat generated by the light emitting device. The magnetic layer is coupled with thermal conductive material layer to produce a magnetic filed on the light emitting device.

Abstract: An apparatus of generating optical tweezers with momentum is provided for providing optical tweezers with a first momentum on a test piece. The apparatus comprises a laser source, a diffractive optical element (DOE) and a lens. The laser source is for outputting a laser beam. The DOE has a first phase-delay picture, and the laser beam forms a diffraction pattern after passing the first phase-delay picture. The lens is for receiving and focusing the diffraction pattern on the test piece to form the first optical tweezers with the first momentum. The lens has an optical axis intersecting the DOE at an optical intersection point, a geometric center of the phase-delay picture has a displacement vector relative to the optical intersection point and a direction of the first momentum is related to a direction of the displacement vector.

Abstract: A disk structure is disposed in an optical tweezers device including a light source for producing incident laser light. The disk structure includes a first substrate, a second substrate and a reflective layer. The second substrate is disposed with respect to the first substrate. One of the first substrate and the second substrate has at least one flow path. The reflective layer, which is adhered to the second substrate, is disposed between the first substrate and the second substrate. After the incident laser light passes through the first substrate and then reaches the reflective layer, the incident laser light is reflected back as reflective laser light by the reflective layer to form reflective laser light. A tweezers light field is formed in the flow path by both the reflective laser light and the incident laser light.

Abstract: An optical tweezers lifting apparatus is provided. The optical tweezers lifting apparatus includes an optical tweezers and a particle-lifting device. The particle-lifting device includes a substrate and a plurality of electrodes that are disposed on the bottom of a flow path in the substrate. When a dielectrophoresis (DEP) solution with a plurality of floating particles is conducted into the flow path and upon those electrodes and a voltage is applied to these electrodes, these particles would be driven by a negative DEP force to move upward to a specific depth in the flow path. Meanwhile, the optical tweezers of the apparatus is selectively focused at the specific depth in the flow path.

Abstract: An optical tweezers controlling device including a light source, an objective lens and a focus adjusting unit is provided. The focus adjusting unit disposed between the light source and the objective lens includes a mirror set and a zoom lens set. The mirror set has at least a mirror. The mirror is rotatable such that after a light of the light source is projected to the mirror, the reflective direction of the light reflected from the mirror is changeable. The zoom lens set has at least a zoom lens disposed in accordance with the mirror. By rotating the mirror or changing the focal length of the zoom lens, the focusing location of the light changes on the focal plane of the objective lens or in the front or the rear of the focal plane.

Abstract: An apparatus and a method for changing optical tweezers are provided. The apparatus includes a diffractive optical element (DOE), a mask unit and an objective lens. The DOE includes a plurality of phase delay patterns. The mask unit includes a plurality of mask patterns that correspond to the phase delay patterns, respectively, wherein at least a portion of the mask patterns are complementary. A laser beam passing through each phase diffractive pattern correspondingly passes through each mask pattern to generate a compound diffractive pattern. The objective lens receives the compound diffractive pattern and focuses it on an examining object to form an optical tweezers.

Abstract: A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space.

Abstract: A semiconductor structure includes a transistor formed over a substrate. The transistor includes a transistor gate and at least one source/drain region. The semiconductor structure includes a pre-determined region coupled to the transistor. The semiconductor structure further includes a resist protection oxide (RPO) layer formed over the pre-determined region, wherein the RPO layer has a level of nitrogen of about 0.35 atomic % or less.

Abstract: A light emitting diode (LED) structure, a LED packaging structure, and a method of forming LED structure are disclosed. The LED structure includes a sub-mount, a stacked structure, an electrode, an isolation layer and a conductive thin film layer. The sub-mount has a first surface and a second surface opposite the first surface. The stacked structure has a first semiconductor layer, an active layer and a second semiconductor layer that are laminated on the first surface. The electrode is disposed apart from the stacked structure on the first surface. The isolation layer is disposed on the first surface to surround the stacked structure as well as cover the lateral sides of the active layer. The conductive thin film layer connects the electrode to the stacked structure and covers the stacked structure.

Abstract: A manufacturing method of a bubble-type micro-pump is provided. At least a bubble-generating unit is provided on the bubble-generating section. Because of the varied surface energies on the top of the bubble-generating section, the varied backfilling velocities of the fluid of the front end and the rear end cause fluid moving when a bubble vanishes. The top surface of the bubble-generating section is subjected to a particular surface treatment to form a surface energy gradient. Examples of surface treatment include sputtering a thin film with varied densities or thickness, radiating one or multi-layer thin films by a laser beam, etc.

Abstract: An optical tweezers lifting apparatus is provided. The optical tweezers lifting apparatus includes an optical tweezers and a particle-lifting device. The particle-lifting device includes a substrate and a plurality of electrodes that are disposed on the bottom of a flow path in the substrate. When a dielectrophoresis (DEP) solution with a plurality of floating particles is conducted into the flow path and upon those electrodes and a voltage is applied to these electrodes, these particles would be driven by a negative DEP force to move upward to a specific depth in the flow path. Meanwhile, the optical tweezers of the apparatus is selectively focused at the specific depth in the flow path.

Abstract: A light emitting diode (LED) structure, a manufacturing method thereof and a LED module are provided. The LED structure has temperature sensing function. The LED structure comprises a composite substrate and an LED. The composite substrate comprises a diode structure whose P-type semiconductor region or N-type semiconductor region has a predetermined doping concentration. The diode structure is a temperature sensor, and the sensitivity of the temperature sensor is based on the predetermined doping concentration. The LED is disposed on the composite substrate. The diode structure is used for sensing the heat emitted from the LED.

Abstract: A micro flow device and a method for generating a fluid with pH gradient are provided. The micro flow device includes a first and second substrates, an ion exchange membrane, and at least an electrode unit. The second substrate having a second flow path is disposed corresponding to the first substrate that has a first flow path. The ion exchange membrane is disposed between the first substrate and the second substrate to separate an electrolyte solution inside the first and second flow paths. The electrode unit includes at least two electrodes disposed in the first and second flow paths respectively. When the pair of electrodes is driven to electrolyze the electrolyte solution, the ion exchange membrane retards the mixing of an anode product and a cathode product produced by electrolyzing the electrolyte solution, such that a liquid having pH gradient is generated inside the first and second flow paths.

Abstract: A computer-implemented method for a multi-card system is provided. An inserted card detects the operational status of cards of the same type. The inserted card will be in standby status when inserted card finds an active card of the same type. If the inserted card does not find any active card of the same type, the inserted card will send a query to a control card requesting the operational status of the cards of the same type. If the control card accepts the query, the control card will send a signal to the inserted card. The inserted card determines its operational status based on the signal. If the inserted card does not receive the signal in a predetermined amount of time, it will be activated.

Abstract: A light-emitting diode (LED) package having electrostatic discharge (ESD) protection function and a method of fabricating the same adopt a composite substrate to prepare an embedded diode and an LED, and use an insulating layer in the composite substrate to isolate some individual embedded diodes, such that the LED device has the ESD protection.

Abstract: A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.