Abstract: A novel scatterer density-based predictive channel modeling method includes: obtaining channel data with different scenarios scatterer densities through a channel measurement or a simulation; obtaining corresponding channel statistical characteristic parameters through a data preprocessing based on the channel data; constructing a graph dataset by taking scatterer density in different scenarios as main characteristics to enhance a space-time correlation of data; dividing the graph dataset according to a certain proportion, and then using a graph attention network and a gated recurrent unit network to extract correlated channel space-time characteristics and implementing a cross scenario channel prediction. The method can capture channel variations in different scenarios, and obtain channel characteristics under different scatterer densities through high space-time correlated channel characteristics, and has good performance in channel prediction based on scenario.

Abstract: A continuous metal on diffusion edge (CMODE) may be used to form a CMODE structure in a semiconductor device after a replacement gate process that is performed to replace the polysilicon dummy gate structures of the semiconductor device with metal gate structures. The CMODE process described herein includes removing a portion of a metal gate structure (as opposed to removing a portion of a polysilicon dummy gate structure) to enable formation of the CMODE structure in a recess left behind by removal of the portion of the metal gate structure.

Abstract: A method for beam management performed by a UE is provided. The method includes: receiving a DCI format in a first BWP based on a first QCL assumption specific to the first BWP, the DCI format scheduling a PDSCH reception in a second BWP; receiving an RRC configuration that includes a plurality of candidate TCI states associated with a serving cell in which the PDSCH is scheduled; receiving a MAC CE that indicates a subset of the plurality of candidate TCI states for activation in the second BWP; determining a second QCL assumption specific to the second BWP based on one TCI state in the subset; and receiving the PDSCH in the second BWP based on the second QCL assumption.

Abstract: A micromobility transit vehicle may include a wheel, an electric motor associated with the wheel, and a motor controller configured to control a motive force provided by the electric motor to the wheel. The motor controller may include a printed circuit board (PCB), one or more MOSFETs attached to the PCB, and a respective aperture defined through the PCB below each MOSFET. The motor controller may include a thermal assembly associated with each MOSFET and capable of dissipating heat from the MOSFETs to a heat sink. Each thermal assembly may include a heat transfer plug positioned at least partially within an associated aperture of the PCBA to contact an associated MOSFET, and a thermal interface material positioned between the heat transfer plug and the heat sink and capable of dissipating heat from the heat transfer plug to the heat sink.

Abstract: A method performed by a UE is provided. The method includes receiving at least one SL-DRX configuration and a plurality of SL resource pool configurations to be configured on the first UE; performing partial sensing based on at least one of the plurality of SL resource pool configurations when an SL-DRX operation is performed based on the at least one SL-DRX configuration, each of at least one SL resource pool configured by the at least one of the plurality of SL resource pool configurations comprising one or more time slots; and performing SL-CBR measurement associated with each of the at least one SL resource pool in the one or more time slots where the partial sensing is performed.

Abstract: A semiconductor structure includes a source/drain (S/D) feature disposed in a semiconductor layer, a metal gate stack (MG) disposed in a first interlayer dielectric (ILD) layer and adjacent to the S/D feature, a second ILD layer disposed over the MG, and an S/D contact disposed over the S/D feature. The semiconductor structure further includes an air gap disposed between a sidewall of a bottom portion of the S/D contact and the first ILD layer, where a sidewall of a top portion of the S/D contact is in direct contact with the second ILD layer.

Abstract: The present invention provides a metal-nanoparticle-free surface-enhanced Raman scattering substrate, which comprises: an anodic aluminum oxide substrate with three-dimensional cavities, and a metal nano-film on the anodic aluminum oxide substrate. The surface-enhanced Raman scattering substrate of the present invention does not need to use metal nanoparticles, but instead uses a structure of metal nanofilm to generate a surface plasmonic resonance. Therefore, compared with the traditional surface-enhanced Raman scattering substrate with an addition of metal nanoparticles, the surface-enhanced Raman scattering substrate of the present invention has better uniformity, stability and reproducibility. The present invention utilizes an anodic aluminum oxide substrate with three-dimensional cavities, so that the surface-enhanced Raman scattering substrate has high sensitivity, high stability, and high reproducibility.

Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a first movable portion used for connecting an optical element, a fixed portion, a first driving assembly used for driving the first movable portion to rotate relative to the fixed portion, and a guiding assembly having a first intermediate element. The first movable portion is movable relative to the fixed portion. The guiding assembly is used for applying a first stabilized force to the first movable portion for making the first intermediate element be in contact with the first movable portion or the fixed portion. The first movable portion is rotatable relative to the fixed portion.

Abstract: The present invention provides a food detection system including: an extraction equipment, a liquid to be identified, a laser light source, a Raman spectrometer, and a metal-nanoparticle-free surface-enhanced Raman scattering substrate. Without an addition of metal nanoparticles, the surface-enhanced Raman scattering substrate of the present invention has better stability and reproducibility compared to those traditional surface-enhanced Raman scattering substrate with metal nano particles. The present invention utilizes an anodic aluminum oxide substrate with two-dimensional and three-dimensional cavities, so that the surface-enhanced Raman scattering substrate has high sensitivity, high stability, and high reproducibility, and may therefore shorten the detection time and production cost of food detection. The invention also provides a food detection method using the food detection system, which is cheap, fast, stable and reliable.

Abstract: In several aspects for generation of high quality synthetic observability data for computing systems, traces and logs from a system are collected as a seed dataset. Multiple conditional variational autoencoder (VAE) models are trained using the seed dataset for learning association between the traces and the logs. Synthetic traces and logs are generated using the multiple CVAE models while retaining the association between the traces and the logs for the synthetic traces and logs.

Abstract: This disclosure relates to methods, devices and systems for real-time recognition of restoration of spontaneous circulation (ROSC) in cardio-pulmonary resuscitation (CPR) process. Recognition mechanisms in both time domain and frequency domain are provided for the ROSC recognition, where the time-domain recognition logic may detect the ROSC by recognizing envelope features of sampled signals in the time domain, and the frequency-domain recognition logic may detect the ROSC by recognizing spectral peaks at different frequency points continuously or significant variations of amplitude of spectral peaks in the frequency spectrum.

Abstract: Some embodiments relate to a method for forming a vertical cavity surface emitting laser (VCSEL) structure. The method includes forming an optically active layer over a lower reflective layer and forming an upper reflector over the optically active layer. A first spacer is formed along sidewalls of the upper reflector. An oxidation process is performed with the first spacer in place to oxidize a peripheral region of the optically active layer. A first etch process is performed on the lower reflective layer and the oxidized peripheral region, thereby forming a lower reflector and an optically active region.

Abstract: A light-emitting diode (LED) packaging module includes a plurality of LED chips spaced apart from one another, an encapsulating layer that fills in a space among the LED chips, a light-transmitting layer disposed on the encapsulating layer, a wiring assembly disposed on and electrically connected to the LED chips, and an insulation component that covers the encapsulating layer and the wiring assembly. Each of the LED chips includes an electrode assembly including first and second electrodes. The light-transmitting layer includes a light-transmitting layer that has a light transmittance greater than that of the encapsulating layer.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes an interconnect structure disposed over a semiconductor substrate, contact pads disposed on the interconnect structure, a dielectric structure disposed on the interconnect structure and covering the contact pads, bonding connectors covered by the dielectric structure and landing on the contact pads, and a dummy feature covered by the dielectric structure and laterally interposed between adjacent two of the bonding connectors. Top surfaces of the bonding connectors are substantially coplanar with a top surface of the dielectric structure, and the bonding connectors are electrically coupled to the interconnect structure through the contact pads.

Abstract: A method of manufacturing a semiconductor device includes dividing a number of dies along an x axis in a die matrix in each exposure field in an exposure field matrix delineated on the semiconductor substrate, wherein the x axis is parallel to one edge of a smallest rectangle enclosing the exposure field matrix. A number of dies is divided along a y axis in the die matrix, wherein the y axis is perpendicular to the x axis. Sequences SNx0, SNx1, SNx, SNxr, SNy0, SNy1, SNy, and SNyr are formed. p*(Nbx+1)?2 stepping operations are performed in a third direction and first sequence exposure/stepping/exposure operations and second sequence exposure/stepping/exposure operations are performed alternately between any two adjacent stepping operations as well as before a first stepping operation and after a last stepping operation. A distance of each stepping operation in order follows the sequence SNx.

Abstract: Disclosed is an antibody that specifically recognizes and binds to folate receptor ?, also referred to as anti-folate receptor a antibody or anti-FR? antibody. Also disclosed is an antibody-drug conjugate of the anti-FR? antibody. Disclosed are uses of the anti-FR? antibody and the antibody-drug conjugate in the treatment of diseases related to FR? expression.

Abstract: Disclosed are a tricyclic fused heterocyclic compound having a PDE3/4 dual inhibitory effect represented by formula (I), a stereoisomer, a solvate, or a pharmaceutically acceptable salt thereof, and the use thereof in the preparation of a drug for treating/preventing PDE3/4-mediated diseases. Each group in formula (I) is as defined in the description.

Abstract: A resin composition includes a vinyl group-containing resin and a phosphorus-containing compound of Formula (1) or a prepolymer thereof, wherein: relative to 100 parts by weight of the vinyl group-containing resin, the phosphorus-containing compound of Formula (1) is 35 to 60 parts by weight; or relative to 100 parts by weight of the vinyl group-containing resin, the prepolymer of the phosphorus-containing compound of Formula (1) is 50 to 90 parts by weight. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and one or more properties can be improved.

Abstract: A light-emitting diode (LED) packaging module includes light-emitting units arranged in an array having m row(s) and n column(s), an encapsulating layer, and a wiring assembly, where m and n each independently represents a positive integer. Each of the light-emitting units includes LED chips each including a chip first surface, a chip second surface, a chip side surface, and an electrode assembly disposed on the chip second surface. The encapsulating layer covers the chip side surface and fills a space among the LED chips. The wiring assembly is disposed on the chip second surface and is electrically connected to the electrode assembly.