Abstract: According to an exemplary embodiment, a method of forming an isolation layer is provided. The method includes the following operations: providing a substrate; providing a vertical structure having a first layer over the substrate; providing a first interlayer dielectric over the first layer; performing CMP on the first interlayer dielectric; and etching back the first interlayer dielectric and the first layer to form the isolation layer corresponding to a source of the vertical structure.

Abstract: Disclosed is a prism sheet, a prism assembly, and a display device. The prism assembly includes a first prism sheet and a second prism sheet stacked with the first prism sheet. The first prism sheet includes a plurality of first subareas, and each first subarea includes at least one first sub-prism; the second prism sheet includes a plurality of second subareas, and each second subarea includes at least one second sub-prism. An orthographic projection of each first subarea on the second prism sheet corresponds to one of the plurality of second subareas one to one; an extending direction of the at least one first sub-prism in a first subarea is perpendicular to an extending direction of the at least one second sub-prism in a second subarea corresponding to the first subarea.

Abstract: A semiconductor device includes a circuit layer and a nanopore layer. The nanopore layer is formed on the circuit layer and is formed with a pore therethrough. The circuit layer includes a circuit unit configured to drive a biomolecule through the pore and to detect a current associated with a resistance of the nanopore layer, whereby a characteristic of the biomolecule can be determined using the currents detected by the circuit unit.

Abstract: A surface treatment and an apparatus for semiconductor packaging are provided. A surface of a conductive layer is treated to create a roughened surface. In one example, nanowires are formed on a surface of the conductive layer. In the case of a copper conductive layer, the nanowires may include a CuO layer. In another example, a complex compound is formed on a surface of the conductive layer. The complex compound may be formed using, for example, thiol and trimethyl phosphite.

Abstract: A package structure is provided. The package structure includes a first bump structure formed over a substrate, a solder joint formed over the first bump structure and a second bump structure formed over the solder joint. The first bump structure includes a first pillar layer formed over the substrate and a first barrier layer formed over the first pillar layer. The first barrier layer has a first protruding portion which extends away from a sidewall surface of the first pillar layer, and a distance between the sidewall surface of the first pillar layer and a sidewall surface of the first barrier layer is in a range from about 0.5 ?m to about 3 ?m. The second bump structure includes a second barrier layer formed over the solder joint and a second pillar layer formed over the second barrier layer, wherein the second barrier layer has a second protruding portion which extends away from a sidewall surface of the second pillar layer.

Abstract: A FinFET structure with a gate structure having two notch features therein and a method of forming the same is disclosed. The FinFET notch features ensure that sufficient spacing is provided between the gate structure and source/drain regions of the FinFET to avoid inadvertent shorting of the gate structure to the source/drain regions. Gate structures of different sizes (e.g., different gate widths) and of different pattern densities can be provided on a same substrate and avoid inadvertent of shorting the gate to the source/drain regions through application of the notched features.

Abstract: An optical lens includes two lens groups and an aperture stop. A total number of lenses with refractive power of the two lens groups is larger than three, and the two lens groups includes an aspheric lens with negative refractive power. The aperture stop is disposed between the two lens groups. The optical lens satisfies the following condition: 0.05>[y(?)?(EFL*sin ?)]/(EFL*sin ?)>?0.3, where ? denotes a half field of view, y(?) denotes an image height of an image plane for visible light with respect to the half field of view ?, and EFL denotes an effective focal length for visible light of the optical lens.

Abstract: In a method of manufacturing a semiconductor device, a first layer containing an amorphous first material is formed by a deposition process over a semiconductor layer. A second layer containing a metal second material is formed over the first layer. A thermal process is performed to form an alloy layer of the amorphous first material and the metal second material.

Abstract: A package stack structure and a method for fabricating the same are provided. An electronic component is disposed on the topmost one of a plurality of organic material substrates, and no chip is disposed on the remaining organic material substrates. A predefined layer number of circuit layers are disposed in the organic material substrates, and distributes the thermal stress via the organic material substrates. Therefore, the bottommost one of the organic material substrates will not be separated from a circuit board due to CTE mismatch. Also a carrier component is provided.

Abstract: A gaming device includes a self-stabilizing module including a first portion and a second portion, a controller assembly disposed at the second portion, a motion sensor, an operation processing module, and a display screen disposed at the first portion. The operation processing module generates a frame signal to the display screen according to a program. The controller assembly and the second portion rotate about at least one self-stabilizing axis relative to the first portion when the self-stabilizing module is activated. The motion sensor generates a control signal due to the relative rotation of the first and second portions. The operation processing module generates another frame signal corresponding to a movement posture of the controller assembly relative to the display screen according to the control signal and the program. The display screen is not located on a movement track of the controller assembly. A gaming controller is also provided.

Abstract: A hinge module including a first hinge having a first gear, a second hinge having a second gear, and a gear rack is provided. The first and second gears are movably coupled to the gear rack. The first hinge moves on the gear rack via rotation of the first gear, the second hinge moves on the gear rack via rotation of the second gear, and the first hinge and the second hinge move closer or away from each other via rotation. An electronic device is also provided.

Abstract: An augmented reality (AR) device includes a main body, a support element, and a lens module. The main body includes a base, a projector, and a first pivot portion. The projector is pivoted to the base by using the first pivot portion, so that the projector is capable of rotating relative to the base by using the first pivot portion as a first rotation axis. The support element is pivoted to a first end portion of the base and is configured to wear on a head of a user. The lens module is pivoted to a second end portion of the base and the second end portion is opposite to the first end portion. The lens module is capable of rotating relative to the base and being overlapped under the base. Through a rotatable and foldable accommodation structure, the augmented reality device is easier to be carried and accommodated.

Abstract: A method of forming a semiconductor structure includes forming a dummy gate feature over a semiconductive fin; forming a first spacer around the dummy gate feature and a second spacer around the first spacer; replacing the dummy gate feature with a metal gate feature; after replacing the dummy gate feature with the metal gate feature, partially removing the second spacer such that a top of the second spacer is lower than a top of the first spacer; and depositing a capping layer over and in contact with the metal gate feature and the first spacer.

Abstract: The present invention relates to a kinase inhibitor, comprising a compound of Formula I or a pharmaceutically acceptable salt, solvate, ester, acid, metabolite or prodrug thereof. The present invention also relates to a pharmaceutical composition comprising the kinase inhibitor, and to uses and methods for using these compounds and compositions to inhibit the activity of wild-type FLT3, mutant FLT3-ITD, PDGFR? and/or PDGFR? kinase in a cell or a subject, as well as uses and methods of these compounds and compositions to preventing or treating kinase-associated conditions in a subject.

Abstract: A packet processing method, a network node, and a system includes obtaining, by a first network node, a first packet that includes a segment list, where the segment list includes a segment identifier of a network node on a path used to forward the first packet, obtaining, by the first network node, a segment identifier of a second network node from the segment list, where the second network node is a next-hop segment node of the first network node on the path, replacing, by the first network node, a destination address of the first packet with the segment identifier of the second network node, and adding a network performance parameter of the first network node to the segment list to generate a second packet, and sending, by the first network node, the second packet to the second network node.

Abstract: A wireless charging device with a detachable base, which comprises a base and a power supply device detachably connected to the base. The base is provided with a wireless charging module, and the power supply device is internally provided with a power supply and is further provided with a first electrical connection part electrically connected to the power supply. The base is provided with a second electrical connection part which is matched with the first electrical connection part and electrically connected to the wireless charging module. When the base is connected to the power supply device, the first electrical connection part is conductive with the second electrical connection part. The wireless charging device with a detachable can be used to wirelessly charge electronic devices needing different charging powers by means of power supply devices of different specifications.

Abstract: A gaming device including a self-stabilizing module with at least two self-stabilizing axes, a display assembled to the self-stabilizing module, a controller assembly assembled to the self-stabilizing module, a motion sensor, and a processing module is provided. A relative movement of the controller assembly and the display are generated via at least one self-stabilizing axis of the self-stabilizing module. The processing module generates a frame signal to transfer to the display according to a program. When the self-stabilizing module is activated and the relative movement is generated, the motion sensor generates a control signal to the processing module, and the processing module generate another frame signal, which correspondingly depicts a posture of the controller assembly relative to the display, to transfer to the display according to the control signal and the program. A gaming controller is also provided.

Abstract: A system of determining physiological state includes a physiological measuring device configured to measure at least one physiological parameter of a user, a user interface configured to receive at least one physiological information of the user, and a processing unit coupled to the physiological measuring device and the user interface, and configured to determine at least one normal threshold and at least one abnormal threshold of the at least one physiological parameter according to the at least one physiological information, and determine a physiological state of the user is normal or abnormal according to the at least one physiological parameter, the at least one normal threshold and the at least one abnormal threshold.

Abstract: An electronic device including a hinge module, a first body, a first linking assembly, a second body, a second linking assembly, and a flexible display assembled to the first body and the second body is provided. The hinge module includes a first rotating shaft, a second rotating shaft parallel to the first rotating shaft, a first guiding shaft orthogonal to the first rotating shaft, and a second guiding shaft orthogonal to the second rotating shaft. The first body is slidably assembled to the first guiding shaft, the second body is slidably assembled to the second guiding shaft, the first linking assembly slidably assembled to the first guiding shaft connects the first body, and the second linking assembly slidably assembled to the second guiding shaft connects the second body. A deformation of the flexible display drives the first and second bodies to move close to or away from the hinge module.

Abstract: A semiconductor package structure includes a redistribution (RDL) layer, a first chip, at least one second chip, an encapsulant and a third chip. The redistribution layer has a first surface and a second surface opposite to each other. The first chip is over the first surface of the redistribution layer and electrically connected to the redistribution layer. The second chip is over the first surface of the redistribution layer. The second chip includes a plurality of through via structures. The encapsulant is over the first surface of the distribution layer, wherein the encapsulant surrounds the first chip and the second chip. The third chip is over the encapsulant and electrically connected to the first chip through the through via structures of the second chip and the redistribution layer.