Patents by Inventor Cheng Chen

Cheng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124844
    Abstract: The present disclosure provides a method for preparing a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors, the composition prepared by the method, and use of the composition for treating arthritis. The composition of the present disclosure achieves the effect of treating arthritis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 18, 2024
    Inventors: Chia-Hsin Lee, Po-Cheng Lin, Yong-Cheng Kao, Ming-Hsi Chuang, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20240123511
    Abstract: A cutting tool with through coolant has an elongated shank and a cutting portion. The cutting portion is configured to remove material from a workpiece by cutting. An outer peripheral surface of the shank is configured to be surrounded and tightly held by a hole-wall defined by a tool-fixing hole of a machine tool. At least one coolant-guiding recess is formed in the outer peripheral surface of the shank and extends along a lengthwise direction of the shank. Each coolant-guiding recess forms a coolant channel together with the hole-wall of the tool-fixing hole. An end of the coolant channel is connected to a coolant-supply system. The coolant channel formed by the coolant-guiding recess enables coolant from the coolant-supply system to be jetted toward the cutting portion. The cutting tool provides through coolant without drilled holes, thereby saving cost.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 18, 2024
    Applicant: YIH TROUN ENTERPRISE CO., LTD.
    Inventor: Li-Cheng CHEN
  • Publication number: 20240126633
    Abstract: A method for responding to a command is adapted for a storage device. The method for responding to a command includes following steps of: sequentially receiving a first command and a second command by a bridge of the storage device from a host; executing the first command and the second command to generate a status completion signal or a status error signal by the bridge; and detecting an error state of at least one of the first command and the second command to execute a response mode or an idle mode by the bridge according to the error state so as to respond to the host.
    Type: Application
    Filed: August 14, 2023
    Publication date: April 18, 2024
    Inventors: Yi Cheng TSAI, Sung-Kao LIU, Cheng-Yuan HSIAO, Po-Hao CHEN
  • Publication number: 20240128211
    Abstract: Some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. The stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. The stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. The one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. Relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.
    Type: Application
    Filed: April 27, 2023
    Publication date: April 18, 2024
    Inventors: Chih-Wei WU, An-Jhih SU, Hua-Wei TSENG, Ying-Ching SHIH, Wen-Chih CHIOU, Chun-Wei CHEN, Ming Shih YEH, Wei-Cheng WU, Der-Chyang YEH
  • Publication number: 20240127000
    Abstract: A computer-implemented method is provided for model training performed by a processing system. The method comprises determining a set of first weights based on a first matrix associated with a source model, determining a set of second weights based on the set of first weights, forming a second matrix associated with a target model based on the set of first weights and the set of second weights, initializing the target model based on the second matrix, and training the target model.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 18, 2024
    Inventors: Yichun Yin, Lifeng Shang, Cheng Chen, Xin Jiang, Xiao Chen, Qun Liu
  • Patent number: 11963300
    Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: April 16, 2024
    Assignee: Au Optronics Corporation
    Inventors: Chun-Yueh Hou, Hao-An Chuang, Fan-Yu Chen, Hsi-Hung Chen, Yun Cheng, Wen-Chang Hsieh, Chih-Wen Lu
  • Patent number: 11959238
    Abstract: A system for a sandy soil landfill solid waste polluted river channel, includes a ground water interception and diversion system and a river channel ecological remediation system. The ground water interception and diversion system includes a water intake well arranged upstream of ground water in a landfill area, a buffer pool communicated with the water intake well, and a wastewater treatment system communicated with the buffer pool. The water intake well, the buffer pool, and the wastewater treatment system are communicated through a wastewater pipe. An electric wastewater valve and a variable frequency water pump are arranged on the wastewater pipe in sequence. The river channel ecological remediation system includes an impermeable layer arranged at a bottom of a river channel and ecological bank protections arranged on both sides of a river channel slope.
    Type: Grant
    Filed: November 24, 2023
    Date of Patent: April 16, 2024
    Assignee: Nanjing Institute of Environmental Sciences, MEE
    Inventors: Houhu Zhang, Xiaofei Yan, Jinglong Liu, Lichen Liang, Congcong Sun, Xiang Chen, Cheng Zhang
  • Patent number: 11959137
    Abstract: Disclosed herein, inter alia, are compounds, compositions, and methods of use thereof in the sequencing of a nucleic acid.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: April 16, 2024
    Assignee: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK
    Inventors: Jingyue Ju, Xiaoxu Li, Xin Chen, Zengmin Li, Shiv Kumar, Shundi Shi, Cheng Guo, Jianyi Ren, Min-Kang Hsieh, Minchen Chien, Chuanjuan Tao, Ece Erturk, Sergey Kalachikov, James J. Russo
  • Patent number: 11961554
    Abstract: A device includes a first power rail for a first power domain and a second power rail for a second power domain. A first circuit block is connected to the first power rail and a second circuit block is connected to the second power rail. The first and second circuit blocks are both connected to a virtual VSS terminal. A footer circuit is connected between the virtual VSS terminal and a ground terminal, and the footer circuit is configured to selectively control a connection between the virtual VSS terminal and the ground terminal.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hidehiro Fujiwara, Kao-Cheng Lin, Wei Min Chan, Yen-Huei Chen
  • Patent number: 11960332
    Abstract: An electronic device including a hinge module, a first body, a second body, and a flexible display assembled to the first body and the second body is provided. Each of the first body and the second body is pivoted and slidably connected to the hinge module, and a cover of the hinge module is exposed out of the first body and the second body. The first body and the second body are rotated relatively via the hinge module to bend or flatten the flexible display, when the flexible display is bending from a flat state, a bending portion of the flexible display leans against the cover and pushes the cover away from the first body and the second body.
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: April 16, 2024
    Assignee: Acer Incorporated
    Inventors: Yi-Ta Huang, Cheng-Nan Ling, Wu-Chen Lee, Wen-Chieh Tai, Kun-You Chuang
  • Patent number: 11961777
    Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung-Wei Cheng, Tsung-Ding Wang, Yu-Hsiang Hu, Sih-Hao Liao
  • Patent number: 11963295
    Abstract: Provided are a circuit apparatus, a manufacturing method thereof, and a circuit system. The circuit apparatus includes a flexible circuit board, a flexible packaging material layer and an electronic device. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner region and a peripheral region surrounding the inner region, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is disposed in the at least one hollow pattern. The electronic device is disposed on the first surface of the flexible circuit board and electrically connected with the flexible circuit board.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: April 16, 2024
    Assignee: Industrial Technology Research Institute
    Inventors: Hung-Hsien Ko, Yi-Cheng Lu, Heng-Yin Chen, Hao-Wei Yu, Te-Hsun Lin
  • Patent number: 11961791
    Abstract: A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A conductive region is disposed in the polymer region and electrically coupled to the redistribution line. The conductive region includes a second flat top surface not higher than the first flat top surface.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo
  • Patent number: 11962847
    Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.
    Type: Grant
    Filed: November 9, 2022
    Date of Patent: April 16, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chia-Hao Chang, You-Tsai Jeng, Kai-Wen Yeh, Yi-Cheng Chen, Te-Chuan Wang, Kai-Wen Cheng, Chin-Lung Lin, Tai-Lai Tung, Ko-Yin Lai
  • Patent number: 11962225
    Abstract: A fan braking structure includes a fan including a frame having an upright bearing cup, and a fan impeller having a vertical rotating shaft pivotally received in the bearing cup and provided at a free end with a groove; a braking structure located at a lower part of the bearing cup and including a brake plate and an electromagnet, and the brake plate being provided at one side with a protruded brake pin and at another side with a magnetic member; and an elastic element disposed between and pressed against a top of the shell and the brake plate. When the fan is inactive, the electromagnet is energized to produce magnetic poles that repel the magnetic member and compress the elastic element, such that the brake pin is magnetically pushed toward the rotating shaft to engage with the groove, causing the fan to brake and stop rotating inertially.
    Type: Grant
    Filed: April 24, 2023
    Date of Patent: April 16, 2024
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Chih-Cheng Tang., Hao-Yu Chen, Hsu-Jung Lin
  • Publication number: 20240121935
    Abstract: Methods for fabricating semiconductor structures are provided. An exemplary method includes forming a first transistor structure and a second transistor structure over a substrate, wherein each transistor structure includes at least one nanosheet. The method further includes depositing a metal over each transistor structure and around each nanosheet; depositing a coating over the metal; depositing a mask over the coating; and patterning the mask to define a patterned mask, wherein the patterned mask lies over a masked portion of the coating and the second transistor structure, and wherein the patterned mask does not lie over an unmasked portion of the coating and the first transistor structure. The method further includes etching the unmasked portion of the coating and the metal over the first transistor structure using a dry etching process with a process pressure of from 30 to 60 (mTorr).
    Type: Application
    Filed: January 18, 2023
    Publication date: April 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Y.L. Cheng, Tzu-Wen Pan, Yu-Hsien Lin, Ryan Chia-Jen Chen
  • Publication number: 20240121722
    Abstract: An example device is to monitor communications throughput rates and select modulation and coding protocols in order to minimize specific absorption rates experienced by users of the devices by minimizing or reducing transmission power settings.
    Type: Application
    Filed: March 12, 2021
    Publication date: April 11, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: I-Chen Lin, Chung-Chun Chen, Cheng-Fang Lin, Hung-Wen Cheng, Isaac Lagnado, Leo Joseph Gerten
  • Publication number: 20240118352
    Abstract: A method for determining a road type includes measuring, for a preset period, a magnetic field of an environment in which an electronic device is located to obtain a plurality of magnetic field values, calculating an absolute value of a difference between every two adjacent magnetic field values among the magnetic field values sorted in chronological order, calculating an average of the absolute values related to the magnetic field values to serve as a variation value for the environment, determining whether the variation value is smaller than a predetermined threshold value, determining that the environment is a surface road when the determination result is affirmative, and determining that the environment is a non-surface road when the determination result is negative.
    Type: Application
    Filed: November 23, 2022
    Publication date: April 11, 2024
    Inventors: Chia-Cheng WANG, Jyh-Cheng CHEN, Yu-Xin XIAO
  • Publication number: 20240116655
    Abstract: Disclosed are a system and a method for capturing a space target. The system includes a plurality of capturing devices, a delivery device, a launching device, and a deceleration and recovery device, each of the plurality of capturing devices is configured to be launched into a target orbit to capture a defunct space target, the delivery device is configured to deliver, along a preset delivery trajectory, each of the plurality of capturing devices to a first preset location in the launching device, the launching device is configured to launch each of the plurality of capturing devices located at the first preset location into the target orbit to capture the defunct space target, and the deceleration and recovery device is configured to decelerate each of the plurality of capturing devices after it is launched and flies a preset distance.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 11, 2024
    Applicant: Harbin Institute of Technology
    Inventors: Jinsheng GUO, Fan WU, Shi QIU, Jian CHEN, Cheng WEI, Hongxu WANG
  • Publication number: 20240115616
    Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang