Patents by Inventor Cheng Huang

Cheng Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11949051
    Abstract: A wavelength conversion member includes a substrate, a phosphor layer, and a ventilated blade. The substrate is configured to rotate based on an axis. The phosphor layer is disposed on the substrate. The ventilated blade is disposed on the substrate and has a pore density between 10 ppi and 500 ppi or a volume porosity between 5% and 95%.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: April 2, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yen-I Chou, Jih-Chi Li, Wen-Cheng Huang
  • Patent number: 11948987
    Abstract: A semiconductor device according to the present disclosure includes a source feature and a drain feature, a plurality of semiconductor nanostructures extending between the source feature and the drain feature, a gate structure wrapping around each of the plurality of semiconductor nanostructures, a bottom dielectric layer over the gate structure and the drain feature, a backside power rail disposed over the bottom dielectric layer, and a backside source contact disposed between the source feature and the backside power rail. The backside source contact extends through the bottom dielectric layer.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: April 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Lung-Kun Chu, Mao-Lin Huang, Chung-Wei Hsu, Jia-Ni Yu, Kuo-Cheng Chiang, Kuan-Lun Cheng, Chih-Hao Wang
  • Patent number: 11948016
    Abstract: Embodiments of the present invention relate to a method, system and computer program product for application programming interface (API) management. According to the method, in response to a first response from an API provider indicating a failure of a first API request initiated by an API requestor, a second API request is generated at least based on the first API request. The second API request is transmitted to the API provider. A second response to the second API request is received from the API provider. A third response is provided to the API requestor based on the second response.
    Type: Grant
    Filed: May 19, 2021
    Date of Patent: April 2, 2024
    Assignee: International Business Machines Corporation
    Inventors: Yun Fei Yuan, Qun Pan, Zhun Huang, Xiang Juan Meng, Cheng Fang Wang
  • Patent number: 11948581
    Abstract: A smart interpreter engine is provided. The smart interpreter engine includes a speech to text converter, a natural language processing module and a translator. The speech to text converter is utilized for converting speech data corresponding to a first language into text data corresponding to the first language. The natural language processing module is utilized for converting the text data corresponding to the first language into glossary text data corresponding to the first language according to a game software. The translator is utilized for converting the glossary text data corresponding to the first language into text data corresponding to a second language.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: April 2, 2024
    Assignee: ACER INCORPORATED
    Inventors: Gianna Tseng, Shih-Cheng Huang, Shang-Yao Lin, Szu-Ting Chou
  • Publication number: 20240105546
    Abstract: A module device on a first substrate includes a power module, a housing, a pair of locking structures. The housing covers the power module. The locking structures are installed on a pair of opposite sides of the housing, and the locking structure includes a main body, a locking ring, a pair of ribs and anchoring portions. The locking ring extends from a side toward an inner side of the main body, and is a double-ring structure, which includes an inner and an outer ring. A first side of the outer ring is connected to the main body, a second side of the outer ring is connected to the inner ring. The ribs extend along a normal direction of the top surface of the main body. The anchoring portions are disposed at the end of the ribs, and an extending direction is perpendicular to an extending direction of the rib.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 28, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Ji-Yuan Syu, Yuan-Cheng Huang, Yu-Chih Wang
  • Publication number: 20240102959
    Abstract: An IC structure includes a biologically sensitive field-effect transistor (BioBET) in a semiconductor substrate, and a dielectric layer over a backside surface of the semiconductor substrate. The dielectric layer has a sensing well extending through the dielectric layer to a channel region of the BioFET. The IC structure further includes a biosensing film, a plurality of fluid channel walls, and a first heater. The biosensing film lines the sensing well in the dielectric layer. The fluid channel walls are over the biosensing film and define a fluid containment region over the sensing well of the dielectric layer. The first heater is in the semiconductor substrate. The first heater has at least a portion overlapping with the fluid containment region.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 28, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tung-Tsun CHEN, Yi-Hsing HSIAO, Jui-Cheng HUANG, Yu-Jie HUANG
  • Publication number: 20240106040
    Abstract: A cover plate of a cylindrical battery and the cylindrical battery are provided by the present application. The cover plate of the cylindrical battery includes a pole column. A bottom of the pole column is connected with a current collecting plate. The pole column is sleeved with a sealing ring. A first insulating element and a cover slip are sequentially sleeved on an outside of the sealing ring along a vertical direction. The first insulating element insulates the current collecting plate from the cover slip.
    Type: Application
    Filed: October 21, 2022
    Publication date: March 28, 2024
    Applicant: EVE POWER CO., LTD.
    Inventors: Haixu Lu, He Zhao, Liming Huang, Cheng Yang, Yuebin Xu, Wei He
  • Patent number: 11938405
    Abstract: An electronic device and a method for detecting abnormal device operation are provided. The method includes: obtaining multiple action events of a movable input device, and each action event including a relative coordinate and a time stamp of the movable input device; generating multiple absolute coordinates based on the relative coordinate of each action event; estimating multiple speed vectors based on the absolute coordinates and the time stamp of each action event; estimating multiple acceleration vectors based on the speed vectors and the time stamp of each action event; and estimating a probability of abnormal operation based on the speed vectors and the acceleration vectors.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: March 26, 2024
    Assignee: Acer Incorporated
    Inventors: Tien-Yi Chi, Wei-Chieh Chen, Shih-Cheng Huang, Tzu-Lung Chuang
  • Patent number: 11942478
    Abstract: A semiconductor device structure, along with methods of forming such, are described. The structure includes a first source/drain epitaxial feature, a second source/drain epitaxial feature disposed adjacent the first source/drain epitaxial feature, a first dielectric layer disposed between the first source/drain epitaxial feature and the second source/drain epitaxial feature, a first dielectric spacer disposed under the first dielectric layer, and a second dielectric layer disposed under the first dielectric layer and in contact with the first dielectric spacer. The second dielectric layer and the first dielectric spacer include different materials.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jui-Chien Huang, Kuo-Cheng Chiang, Chih-Hao Wang, Shi Ning Ju, Guan-Lin Chen
  • Patent number: 11942377
    Abstract: A semiconductor device includes a semiconductor substrate; a plurality of channel regions, including a p-type channel region and an n-type channel region, disposed over the semiconductor substrate; and a gate structure. The gate structure includes a gate dielectric layer disposed over the plurality of channel regions and a work function metal (WFM) structure disposed over the gate dielectric layer. The WFM structure includes an n-type WFM layer over the n-type channel region and not over the p-type channel region and further includes a p-type WFM layer over both the n-type WFM layer and the p-type channel region. The gate structure further includes a fill metal layer disposed over the WFM structure and in direct contact with the p-type WFM layer.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Lung-Kun Chu, Mao-Lin Huang, Wei-Hao Wu, Kuo-Cheng Chiang
  • Patent number: 11940412
    Abstract: A biosensor system includes an array of biosensors with a plurality of electrodes situated proximate the biosensor. A controller is configured to selectively energize the plurality of electrodes to generate a DEP force to selectively position a test sample relative to the array of biosensors.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Jie Huang, Jui-Cheng Huang, Yi-Hsing Hsiao
  • Patent number: 11942513
    Abstract: The present disclosure provides a semiconductor structure, including a substrate having a front surface, a first semiconductor layer proximal to the front surface, a second semiconductor layer over the first semiconductor layer, a gate having a portion between the first semiconductor layer and the second semiconductor layer, a spacer between the first semiconductor layer and the second semiconductor layer, contacting the gate, and a source/drain (S/D) region, wherein the S/D region is in direct contact with a bottom surface of the second semiconductor layer, and the spacer has an upper surface interfacing with the second semiconductor layer, the upper surface including a first section proximal to the S/D region, a second section proximal to the gate, and a third section between the first section and the second section.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Guan-Lin Chen, Kuo-Cheng Chiang, Chih-Hao Wang, Shi Ning Ju, Jui-Chien Huang
  • Publication number: 20240092665
    Abstract: A method for treating wastewater containing ertriazole compounds is provided. Hypochlorous acid (HOCl) having a neutral to slightly acidic pH value is added to the wastewater containing triazole compounds for reaction, thereby effectively reacting more than 90% of triazole compounds.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 21, 2024
    Inventors: KUO-CHING LIN, YUNG-CHENG CHIANG, SHR-HAN SHIU, MENG-CHIH CHUNG, YI-SYUAN HUANG
  • Publication number: 20240093373
    Abstract: A method for preparing antibacterial stainless steel by surface alloying includes the steps of coating an infiltration promoter layer on a stainless steel surface, coating an antibacterial metal layer on a surface of the infiltration promoter layer, and performing heat treatment of the stainless steel to diffuse an antibacterial metal into the stainless steel. This method can be applied to various types of stainless steel, and the antibacterial metal can be diffused and quenched into the stainless steel, such that the finally formed surface of the stainless steel has an antibacterial alloy layer with a specific thickness to provide better corrosion resistance and antibacterial ability without changing the advantages and properties of the antibacterial metal or stainless steel substrate, and the thickness and concentration of the antibacterial metal layer, and the parameters for heat treatment can be adjusted to control the chemical composition and thickness of the antibacterial alloy layer.
    Type: Application
    Filed: November 16, 2022
    Publication date: March 21, 2024
    Inventors: WEN-TA TSAI, BERNARD HAOCHIH LIU, ZHI-YAN CHEN, CHONG-CHENG HUANG
  • Publication number: 20240096642
    Abstract: Some embodiment structures and methods are described. A structure includes an integrated circuit die at least laterally encapsulated by an encapsulant, and a redistribution structure on the integrated circuit die and encapsulant. The redistribution structure is electrically coupled to the integrated circuit die. The redistribution structure includes a first dielectric layer on at least the encapsulant, a metallization pattern on the first dielectric layer, a metal oxide layered structure on the metallization pattern, and a second dielectric layer on the first dielectric layer and the metallization pattern. The metal oxide layered structure includes a metal oxide layer having a ratio of metal atoms to oxygen atoms that is substantially 1:1, and a thickness of the metal oxide layered structure is at least 50 ?. The second dielectric layer is a photo-sensitive material. The metal oxide layered structure is disposed between the metallization pattern and the second dielectric layer.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Jing-Cheng Lin, Cheng-Lin Huang
  • Publication number: 20240097323
    Abstract: In some examples, a device can include an antenna to emit waves in a radiation pattern having a first beamwidth, a directional radiation control device located in a path of the waves, where the directional radiation control device is to receive the waves from the antenna and is shaped to cause the waves to be directed in a different radiation pattern having a second beamwidth that is larger than the first beamwidth.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 21, 2024
    Inventors: Chin-Hung Ma, Pai-Cheng Huang, Po Chao Chen, Shih-Huang Wu
  • Publication number: 20240094419
    Abstract: A seismic quantitative prediction method for shale total organic carbon (TOC) based on sensitive parameter volumes is as follows. A target stratum for a TOC content to be measured is determined, logging curves with high correlations with TOC contents are analyzed, the logging curves are found as sensitive parameters; sample data are constructed using the sensitive parameters; a radial basis function (RBF) neural network is trained with the sample data as an input and the TOC content at a depth corresponding to the sample data as an output to obtain a RBF neural network prediction model; sensitive parameter volumes are obtained by using the sensitive parameters and post stack three-dimension seismic data to invert; prediction samples are constructed using the sensitive parameter volumes; the predicted samples are input to the RBF neural network prediction model to calculate corresponding TOC values, thereby the TOC content of the target stratum is predicted.
    Type: Application
    Filed: June 27, 2023
    Publication date: March 21, 2024
    Inventors: Chaorong Wu, Cheng Liu, Kaixing Huang, Yong Li, Yizhen Li, Junxiang Li, Yuexiang Hao
  • Publication number: 20240093668
    Abstract: A turbine of a power generating system includes a rotary shaft, blades, stoppers and elastic members. Each of the blades includes a connecting side and an active side opposite to the connecting side, and the blades are disposed on the rotary shaft at intervals by a predetermined distance, in which the blades are pivotally connected to the rotary shaft through the connecting sides. The stoppers respectively correspond to the blades and are disposed over the rotary shaft for limiting expansion angles of the blades. Each of the elastic members includes a fixed end and a moving end opposite to the fixed end, and the fixed ends attach to the rotary shaft, and the moving ends respectively attach to the blades. Each of the blades pivots between an expanded position and a closed position.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Inventor: Ching-Cheng HUANG
  • Publication number: 20240096997
    Abstract: Embodiments of the present disclosure provide semiconductor device structures and methods of forming the same. The structure includes a first source/drain region disposed in a PFET region and a second source/drain region disposed in an NFET region. The second source/drain region comprises a dipole region. The structure further includes a first silicide layer disposed on and in contact with the first source/drain region, a second silicide layer disposed on and in contact with the first silicide layer, and a third silicide layer disposed on and in contact with the dipole region of the second source/drain region. The first, second, and third silicide layers include different materials. The structure further includes a first conductive feature disposed over the first source/drain region, a second conductive feature disposed over the second source/drain region, and an interconnect structure disposed on the first and second conductive features.
    Type: Application
    Filed: January 15, 2023
    Publication date: March 21, 2024
    Inventors: Po-Chin Chang, Lin-Yu Huang, Li-Zhen Yu, Yuting Cheng, Sung-Li Wang, Pinyen Lin
  • Patent number: D1020049
    Type: Grant
    Filed: November 11, 2022
    Date of Patent: March 26, 2024
    Inventors: Dongjun Ding, Cheng Gong, Weifeng Huang, Wenlong Wu