Abstract: The present disclosure is directed to anchor structures and methods for forming anchor structures such that planarization and wafer bonding can be uniform. Anchor structures can include anchor layers formed on a dielectric layer surface and anchor pads formed in the anchor layer and on the dielectric layer surface. The anchor layer material can be selected such that the planarization selectivity of the anchor layer, anchor pads, and the interconnection material can be substantially the same as one another. Anchor pads can provide uniform density of structures that have the same or similar material.

Abstract: Provided is an image sensor and a method of forming the same. The image sensor includes a first substrate having a first surface and a second surface opposite to each other; a plurality of photodetectors, disposed in the first substrate; and a plurality of color filters, disposed on the second surface of the first substrate and respectively corresponding to the plurality of photodetectors. The plurality of color filters are composed of a plurality of PIN diodes, and the plurality of PIN diodes are configured to absorb light of different wavelength ranges by applying different bias voltages.

Abstract: A one-piece dental implant guide pack based on photocuring molding includes: a guide socket for receiving a photosensitive resin at an outer edge of the guide socket, adjusting and positioning the guide socket by the photosensitive resin which is curable by light; a guide slot formed at a side edge of the guide socket, and having a receiving portion at the bottom; a positioning shaft, having a positioning part and a shaft, and the positioning part being socketed into the guide socket, and the shaft penetrating to the bottom of the guide socket; and at least one positioning part, with an end connected to the guide socket and another end connected to and positioning the positioning shaft. This disclosure facilitates the drilling process of subsequent operations and improves the convenience and accuracy of the implant guide plate and the accuracy of the dental implant surgery.

Abstract: The invention provides an optical pressure sensor. The light-emitting module emits a detection light, and the light-receiving module receives a reflected light reflected by an object. When the distance between the object and the light-receiving module changes due to external pressure, the intensity of reflected light changes. The control module compares the intensity difference of the signal to determines the pressing state.

Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a barrier layer on the buffer layer; forming a hard mask on the barrier layer; removing the hard mask to form a first recess for exposing the barrier layer; removing the hard mask adjacent to the first recess to form a second recess; and forming a p-type semiconductor layer in the first recess and the second recess.

Abstract: Some implementations of the disclosure are directed to a method, comprising: receiving a sheet of graphite comprising a first surface and a second surface opposite the first surface; and perforating the sheet in a first plurality of locations from the first surface through the second surface to form a first plurality of perforations through the sheet and a first plurality of protrusions of the graphite oriented outward from the second surface, the first plurality of protrusions configured to conduct heat away from a plane of the sheet. Further implementations comprise perforating the sheet in a second plurality of locations from the second surface through the first surface to form a second plurality of perforations through the sheet and a second plurality of protrusions of graphite material oriented outward from the first surface, wherein the second plurality of protrusions are configured to conduct heat away from the plane of the sheet.

Abstract: A pixel array may include air gap reflection structures under a photodiode of a pixel sensor to reflect photons that would otherwise partially refract or scatter through a bottom surface of a photodiode. The air gap reflection structures may reflect photons upward toward the photodiode so that the photons may be absorbed by the photodiode. This may increase the quantity of photons absorbed by the photodiode, which may increase the quantum efficiency of the pixel sensor and the pixel array.

Abstract: A method for fabricating an image sensor device is provided. The method includes forming a plurality of photosensitive pixels in a substrate; depositing a dielectric layer over the substrate; etching the dielectric layer, resulting in a first trench in the dielectric layer and laterally surrounding the photosensitive pixels; and forming a light blocking structure in the first trench, such that the light blocking structure laterally surrounds the photosensitive pixels.

Abstract: An image sensor includes a photosensitive sensor, a floating diffusion node, a reset transistor, and a source follower transistor. The reset transistor comprises a first source/drain coupled to the floating diffusion node and a second source/drain coupled to a first voltage source. The source follower transistor comprises a gate coupled to the floating diffusion node and a first source/drain coupled to the second source/drain of the reset transistor. A first elongated contact contacts the second source/drain of the reset transistor and the first source/drain of the source follower transistor. The first elongated contact has a first dimension in a horizontal cross-section and a second dimension in the horizontal cross-section. The second dimension is perpendicular to the first dimension, and the second dimension is less than the first dimension.

Abstract: A method for manufacturing a circuit board structure with a waveguide is provided. The method includes: providing a plate including a top wall and sidewalls disposed on the top wall, an opening being defined between ends of two adjacent sidewalls away from the top wall; forming a conductive layer on the plate to obtain a conductive plate; providing a circuit board, the circuit board comprising an outer circuit layer; mounting the conductive plate on the outer circuit layer, causing the outer circuit layer to be disposed on the opening. The two adjacent sidewalls, the top wall between the two adjacent sidewalls, and the circuit board between the two adjacent sidewalls cooperatively constitutes a tube body of the waveguide, and the conductive layer and the outer circuit layer on an inner surface of the tube body cooperatively constitute a shielding of the waveguide.

Abstract: A back cover with an antenna element includes a cover body having a main portion, and an antenna element. A periphery of the main portion protrudes frontward to form a peripheral wall. The cover body is further equipped with a magnetic part. The antenna element is assembled in the cover body. The antenna element has a base portion, a connecting portion, a first extension portion and a second extension portion extended upward from the base portion. The first extension portion is disposed adjacent to one side of the peripheral wall of the cover body. The second extension portion is adjacent to the first extension portion. A length of the first extension portion is longer than a length of the second extension portion. A connecting portion is connected between the first extension portion and a top end of the second extension portion.

Abstract: A packaging structure and a circuit board having the packaging structure are provided. The packaging structure includes a power chip, a wire, a grid terminal, a first soldering layer, a second soldering layer, a first frame, a second frame, and a packaging body. The power chip has a grid electrode, a source electrode, and a drain electrode. The grid terminal is connected to the grid electrode through the wire. The first frame is connected to the source electrode through the first soldering layer. The second frame is connected to the drain electrode through the second soldering layer. The packaging body covers the power chip, the grid terminal, the first frame, the second frame, the wire, the first soldering layer and the second soldering layer.

Abstract: Apparatus and methods for sensing long wavelength light are described herein. A semiconductor device includes: a carrier; a device layer on the carrier; a semiconductor layer on the device layer, and an insulation layer on the semiconductor layer. The semiconductor layer includes isolation regions and pixel regions. The isolation regions are or include a first semiconductor material. The pixel regions are or include a second semiconductor material that is different from the first semiconductor material.

Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.

Abstract: A locking mechanism comprises a main body, an ejector rod, a guide rod assembly, a carrier plate and a fixing assembly. The carrier plate comprises a center hole and a plurality of annular strip holes. The fixing assembly comprises a rotary disc. The center hole and the annular strip holes can lock the rotary disc in different rotation angles. The guide rod assembly limits the rotation tolerance of the carrier plate, and makes the carrier plate move up and down in the vertical direction. The rotary disc with limited rotational freedom is fixedly connected with the ejector rod, so that the locking mechanism can not only realize the linear lifting motion of the ejector rod, but also reduce the rotation angle error between the carrier plate and the ejector rod. A rotating lifting platform is also provided.

Abstract: A method of forming a semiconductor device includes forming photodiodes extending from a front-side surface of a semiconductor layer into the semiconductor layer; forming transistors on the front-side surface of the semiconductor layer; forming an interconnect structure over the transistors, the interconnect structure comprising an inter-metal dielectric and metal lines in the inter-metal dielectric; etching first regions of a backside surface of the semiconductor layer to form trenches in the semiconductor layer and non-overlapping the photodiodes; after forming the trenches, etching second regions of the backside surface of the semiconductor layer to form pits in the semiconductor layer and overlapping the photodiodes; and depositing a dielectric material in the trenches and the pits.

Abstract: A cable with a non-circular ground wire is provided, including two wires, two ground wires, and an insulating tape; wherein the inner sides of the wires are in contact with each other; the ground wires are respectively arranged on two opposite sides of the wires; each ground wire at least includes a first side surface, a second side surface, and a third side surface; the first and second side surfaces respectively contact the outer surfaces of the two wires, and the shapes of the first side surface and the second side surface respectively correspond to the shapes of the outer surfaces of the two wires; the insulating tape covers the outer surfaces of the wires and the third sides of the ground wires. Thereby, the mechanical properties of the cable of the present invention, such as small impedance variation of high-frequency signal transmission, transmission stability, structural flexibility and bending, can be significantly improved.

Abstract: Exemplary embodiments for redistribution layers of integrated circuits are disclosed. The redistribution layers of integrated circuits of the present disclosure include one or more arrays of conductive contacts that are configured and arranged to allow a bonding wave to displace air between the redistribution layers during bonding. This configuration and arrangement of the one or more arrays minimize discontinuities, such as pockets of air to provide an example, between the redistribution layers during the bonding.

Abstract: A semiconductor device includes a first wafer and a second wafer. The semiconductor device includes a seal ring structure comprising a first metal structure in a body of the first wafer, a second metal structure in the body of the first wafer, a third metal structure in a body of the second wafer, and a metal bonding structure including a first set of metal elements coupling the first metal structure and the third metal structure through an interface between the first wafer and the second wafer, and a second set of metal elements coupling the second metal structure and the third metal structure through the interface between the first wafer and the second wafer.

Abstract: A rotary device with automatic reset function for precise stopping and holding of a viewable rotating element without free play or slop remaining includes a conversion assembly, and a power assembly with output element and sensing assembly. The conversion assembly comprises a light-shielding structure with the light-shielding structure on the extension part. The power assembly with output element can drive the extension part to rotate synchronously with the light-shielding structure. The detachable sensing assembly overlaps the rotation path of the light-shielding structure, and the conversion assembly rotates at different angles so that the light-shielding structure and the sensing assembly will match at certain angles, so as to trigger a sensing signal and call up the output element. A display screen includes the rotary device with automatic reset function and a display assembly.