Abstract: A microscope module includes a housing, a convex lens and a light guide element. The housing has a sample inspecting surface located on one side of the housing opposite to an image capturing module. The convex lens is disposed in the housing, and the shortest distance between the sample inspecting surface and the convex lens ranges from 0.1 mm to 3.0 mm. The light guide element is disposed on an external portion of the housing and has a light input portion and a light output portion. The light output portion is located between the image capturing module and the convex lens. The light input portion receives a light, and the light is outputted through the light output portion to the convex lens. The light passes through the convex lens and then reaches the sample inspecting surface. A microscope device including the microscope module is also disclosed.

Abstract: A microscope module includes a light source assembly, a sampling assembly and a diffusing element. The light source assembly includes a light source and a light guide element. The light source is disposed close to the light incidence end of the light guide element. The sampling assembly includes a cover and a base. The cover and the base are combined to define a sample accommodating space, which is located at the light exit end of the light guide element. The diffusing element is disposed between the light source and the sample accommodating space. The light emitted from the light source passes through the diffusing element and then enters the sample accommodating space. A microscope device containing the microscope module is also disclosed.

Abstract: The present invention discloses a portable microscope device which can be installed on the smartphone capable of capturing image. By combing these devices, users can observe the detection sample and capture the image of the sample instantly without environment limitation. Moreover, during operation, the user can observe the whole image of the sample by substituting the microscope lens of different magnification ratio or by shifting the position of the sample.

Abstract: An apparatus for mounting a pellicle onto a mask is provided. In one embodiment, the apparatus comprises a base provided with a track; a dummy plate holder coupled to the base, the dummy plate holder for receiving a dummy plate having an elevated portion on one side thereof; a mask holder for receiving a mask, the mask holder slidably coupled to the base; a pellicle holder for receiving a pellicle frame, the pellicle holder slidably coupled to the base; and drive means being adapted to drive the pellicle holder along the track towards the dummy plate holder, wherein during operation when the pellicle frame is mounted onto the mask causing the mask to contact the dummy plate, the mounting pressure in the mask is distributed by way of the elevated portion in the dummy plate, thus reducing distortion in the mask.

Abstract: A microscope apparatus is disclosed. The microscope apparatus comprises a microscope module and an image capture device. The microscope module comprises a housing, a lens element, a sampling assembly, and a light guide element. The lens element is mounted on the housing. The sampling assembly is accommodated in the housing. The light guide element is mounted in the sampling assembly. The sampling assembly is configured to sample a specimen and comprises a cover body and a base body received in the cover body. The cover body has a first top plate and a first anchoring structure connected to the top plate. The base body has a second opt plate and a second anchoring structure connected to the second top plate. The second top plate faces the first top plate to define a holding space for the specimen.

Abstract: A method of manufacturing a semiconductor device comprising forming an active region in a device substrate using a first phase shift mask (PSM) having a first patterned light shielding layer formed thereon, forming a polysilicon feature on the device substrate over the active region using a second PSM having a second patterned light shielding layer formed thereon, forming a contact feature on the polysilicon feature using a third PSM having a third patterned light shielding layer formed thereon, and forming a metal feature on the contact feature using a fourth PSM having a fourth patterned light shielding layer formed thereon, wherein at least one of the third and fourth patterned light shielding layers is patterned substantially similarly to at least one of the first and second patterned light shielding layers.

Abstract: The present disclosure provides a lithography apparatus. The lithography apparatus includes a radiation source providing a radiation energy with a wavelength selected from the group consisting of 193 nm, 248 nm, and 365 nm; a lens system configured approximate to the radiation source; a mask chamber proximate to the lens system, configured to hold a mask and operable to provide a single atom gas to the mask chamber; and a substrate stage configured to hold a substrate and receive the radiation energy through the lens system and the mask during an exposing process.

Abstract: The present disclosure provides a mask and a method of determining etching times for etching the mask. In one embodiment, values for a main etching time and an over-etching time are determined simultaneously based on a desired critical dimension (CD) parameter and a desired phase parameter for the mask.

Abstract: A method for improving critical dimension uniformity of a substrate is provided. An equation based on a proximity trend of a pattern on a first substrate is determined. The equation is applied in a regression model to determine a parameter value of a second substrate. A recipe of an exposure equipment is adjusted based on the parameter value for exposure of the second substrate. Also, a system for controlling critical dimension of a pattern on a substrate is provided. The system includes an advance process control system for collecting exposure data of the substrate, and a regression model within the advance process control system for analyzing the exposure data and determining a parameter value of a recipe of the exposure tool. The regression model is operable to determine an equation based on a proximity trend of the substrate.

Abstract: A method for reducing a critical dimension error of a substrate is provided. A first function is identified for correlating a critical dimension error with a first effect. A second function is identified for correlating a critical dimension error with a scan speed. An optimal scan speed for minimizing the critical dimension error is identified by substantially equating the first function and the second function. The substrate may be a mask or a wafer.

Abstract: An apparatus for mounting a pellicle onto a mask is provided. In one embodiment, the apparatus comprises a base provided with a track; a dummy plate holder coupled to the base, the dummy plate holder for receiving a dummy plate having an elevated portion on one side thereof; a mask holder for receiving a mask, the mask holder slidably coupled to the base; a pellicle holder for receiving a pellicle frame, the pellicle holder slidably coupled to the base; and drive means being adapted to drive the pellicle holder along the track towards the dummy plate holder, wherein during operation when the pellicle frame is mounted onto the mask causing the mask to contact the dummy plate, the mounting pressure in the mask is distributed by way of the elevated portion in the dummy plate, thus reducing distortion in the mask.

Abstract: A mask for manufacturing a semiconductor device comprises a transparent substrate. A metal-containing layer overlies the transparent substrate in a first region. A capping layer overlies and is coextensive with the metal-containing layer without wrapping around side edges of the metal-containing layer. The capping layer is substantially free of nitride. The transparent substrate has a second region separate from the first region. The transparent substrate is exposed in the second region.

Abstract: A method of fabricating a photomask is provided. A masking layer (e.g., chrome) is deposited on a substrate. A plasma treatment may be performed on the chrome layer. A photoresist layer may be formed on the treated chrome layer. In an embodiment, the plasma treatment roughens the chrome layer. In an embodiment, the plasma treatment forms a barrier film on the chrome layer. The photoresist layer may be used to pattern a sub-resolution assist feature.

Abstract: Provided is a method of fabricating a memory device. A substrate including an array region and a peripheral region is provided. A first feature and a second feature are formed in the array region. The first feature and the second feature have a first pitch. A plurality of spacers abutting each of the first feature and the second feature are formed. The plurality of spacers have a second pitch. A third feature in the peripheral region and a fourth and fifth feature in the array region are formed concurrently. The forth and fifth feature have the second pitch.

Abstract: The present invention relates to a MEMS-based micro-oscillator which can generate specific vortical pattern in a micro-channel. The micro-vortex generator is composed of a suspended bridge with a gold-plated, rectangular flat-plate as the primary structure. When an AC current passed through the gold leads under an external magnetic field, the plate will oscillate due to Lorenz force, thereby generating micro-vortices.

Abstract: A method of manufacturing a semiconductor device comprising forming an active region in a device substrate using a first phase shift mask (PSM) having a first patterned light shielding layer formed thereon, forming a polysilicon feature on the device substrate over the active region using a second PSM having a second patterned light shielding layer formed thereon, forming a contact feature on the polysilicon feature using a third PSM having a third patterned light shielding layer formed thereon, and forming a metal feature on the contact feature using a fourth PSM having a fourth patterned light shielding layer formed thereon, wherein at least one of the third and fourth patterned light shielding layers is patterned substantially similarly to at least one of the first and second patterned light shielding layers.

Abstract: A solar-powered photoelectric apparatus comprises a solar cell panel, a rechargeable battery and one or more photoelectric devices. The solar cell panel absorbs light to generate electricity and the electricity is stored in the photoelectric device. The photoelectric device uses power from the rechargeable battery to generate light. In consideration of times of insufficient light to the solar-powered photoelectric apparatus, the photoelectric apparatus may further comprise a USB connector as an interface for charging the rechargeable battery.

Abstract: A phase-shifting mask is fabricated using two separate exposure processes. The mask includes a substrate and a device pattern area above the substrate. The mask has a mask pattern defining boundaries of the device pattern area and an administrative pattern area defining boundaries of the mask pattern.

Abstract: The present disclosure provides a mask. The mask includes a transparent substrate, a main feature, and an assistant feature. The main feature includes attenuating material and is disposed on the substrate. The assistant feature includes a sub-resolution feature providing a phase shift. The assistant feature is spaced a distance from the main feature. The assistant feature includes a trench defined by the substrate. The present disclosure further provides a method of fabricating the mask.

Abstract: The present disclosure provides a mask and a method of determining etching times for etching the mask. In one embodiment, values for a main etching time and an over-etching time are determined simultaneously based on a desired critical dimension (CD) parameter and a desired phase parameter for the mask.