Abstract: A coater includes a chuck, a source of a coating material, a dispensing head, an exhaust system, and a liner. The chuck is configured to support a wafer. The dispensing head is configured to dispense the coating material onto the wafer. The exhaust system is configured to exhaust the excess coating material. The liner is present at least partially on an inner surface of the exhaust system. The liner has a stick resistance to the coating material, and the stick resistance of the liner is greater than a stick resistance of the inner surface of the exhaust system.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a gate stack and a conductive layer over a semiconductor substrate. The semiconductor substrate has a first region and a second region isolated from each other by an isolation structure in the semiconductor substrate. The gate stack is formed over the first region. The method includes forming a negative photoresist layer over the first region and a first portion of the conductive layer over the isolation structure to cover the gate stack. The method includes forming a mask layer over the negative photoresist layer and the conductive layer. The mask layer has trenches over a second portion of the conductive layer. The method includes removing the second portion through the trenches. The method includes removing the mask layer. The method includes removing the negative photoresist layer.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate. The semiconductor device structure includes a first gate stack over the semiconductor substrate. The first gate stack includes a first gate and a second gate over the first gate, and the first gate and the second gate are electrically isolated from each other. The semiconductor device structure includes a ring structure surrounding the first gate stack. The ring structure is made of a conductive material.

Abstract: Disclosed is a double-drum type curtain drum module, comprising a shell base having two compartments, a first guide wheel, a second guide wheel, an auxiliary cord rotator installed in a first compartment, and two cord drums installed in a second compartment. At least two reinforcing bars in parallel are formed in the first compartment. A plurality of first wheel-connecting grooves are formed on the reinforcing bars for installing the first guide wheel. The second compartment has a plurality of second wheel-connecting grooves formed on a bottom surface of the shell base for installing the second guide wheel. A connecting channel is formed between the reinforcing bars and exposed from the bottom surface of the shell base. The connecting channel extends into the second compartment for coupling the first wheel-connecting grooves and the second wheel-connecting grooves.

Abstract: A coater includes a chuck, a source of a coating material, a dispensing head, an exhaust system, and a liner. The chuck is configured to support a wafer. The dispensing head is configured to dispense the coating material onto the wafer. The exhaust system is configured to exhaust the excess coating material. The liner is present at least partially on an inner surface of the exhaust system. The liner has a stick resistance to the coating material, and the stick resistance of the liner is greater than a stick resistance of the inner surface of the exhaust system.

Abstract: Disclose is a control device for liberally stopping a cordless blind, comprising a force-return mechanism, a shaft connector, and a braking buffer mechanism to allow lifting/lowering or open/close operation of the cordless blind to be stopped at any position according to user's requirements. The force-return mechanism includes a base, a force-return wheel installed inside the base, and an elastic element. The shaft connector and the braking buffer mechanism are installed in a housing. And the shaft connector has a trigger and a brake. The shaft connector has an inserting hole exposed from the housing. The braking buffer mechanism includes a friction ring and an impeding spring. The impeding spring is tightly inserted into a wear-proof annular inwall of the friction ring and has an extrusion to impede the rotation of the shaft connector.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate. The semiconductor device structure includes a first gate stack over the semiconductor substrate. The first gate stack includes a first gate and a second gate over the first gate, and the first gate and the second gate are electrically isolated from each other. The semiconductor device structure includes a ring structure surrounding the first gate stack. The ring structure is made of a conductive material.

Abstract: Disclosed is a control device for a cordless blind with willful stop at any positions according to user needs during switching operation. The control device primarily comprises a force-return mechanism, a shaft connector, and a braking buffer mechanism which are all installed inside a same housing. The force-return mechanism has a flat spring bevel gear and an elastic element. One end of the shaft connector is a transmission bevel gear meshed with the flat spring bevel gear. The braking buffer mechanism includes a friction ring and an impeding spring where the friction ring is immovably fixed inside the housing with a wear-proof annular inwall. The impeding spring is tightly plugged into the friction ring with an extrusion to prevent the rotation of the transmission bevel gear. Specifically, the shaft connector has a trigger to change the friction between the impeding spring and the friction ring.

Abstract: Disclosed is a control device for a cordless blind with willful stop at any positions according to user needs during switching operation. The control device primarily comprises a force-return mechanism, a shaft connector, and a braking buffer mechanism which are all installed inside a same housing. The force-return mechanism has a flat spring bevel gear and an elastic element. One end of the shaft connector is a transmission bevel gear meshed with the flat spring bevel gear. The braking buffer mechanism includes a friction ring and an impeding spring where the friction ring is immovably fixed inside the housing with a wear-proof annular inwall. The impeding spring is tightly plugged into the friction ring with an extrusion to prevent the rotation of the transmission bevel gear. Specifically, the shaft connector has a trigger to change the friction between the impeding spring and the friction ring.

Abstract: A computer-implemented method to perform context-sensitive incremental design rule checking (DRC) for an integrated circuit (IC). An incremental DRC engine checks design rule violations between a set of environment shapes and a set of active shapes. If no design rule violations are found, the set of active shapes will be added into the set of environment shapes. Furthermore, the incremental DRC engine can be embedded into placement tools, routing tools, or interactive layout editing tools to check design rule violations and help generate DRC error free layouts.

Abstract: A new method of depositing PE-oxide or PE-TEOS. An HDP-oxide is provided over a pattern of polysilicon. An etch back is performed to the deposited HDP-oxide, a layer of plasma-enhanced SiN is deposited. This PE-SiN is etched back leaving SiN spacers on the sidewalls of the poly pattern, further leaving a deposition of HDP-oxide on the top surface of the poly pattern. The profile of the holes within the poly pattern in such that the final layer of PE-oxide or PE-TEOS is deposited without resulting in the formation of keyholes in this latter layer.

Abstract: A method for reducing peeling of a cross-linked polymer passivation layer in a solder bump formation process including providing a multi-level semiconductor device formed on a semiconductor process wafer having an uppermost surface comprising a metal bonding pad in electrical communication with underlying device levels; forming a layer of resinous pre-cursor polymeric material over the process surface said resinous polymeric material having a glass transition temperature (Tg) upon curing; subjecting the semiconductor process wafer to a pre-curing thermal treatment temperature below Tg for a period of time; and, subjecting the semiconductor process wafer to at least one subsequent thermal treatment temperature above Tg for a period of time to form an uppermost passivation layer.

Abstract: A method for reducing peeling of a cross-linked polymer passivation layer in a solder bump formation process including providing a multi-level semiconductor device formed on a semiconductor process wafer having an uppermost surface comprising a metal bonding pad in electrical communication with underlying device levels; forming a layer of resinous pre-cursor polymeric material over the process surface said resinous polymeric material having a glass transition temperature (Tg) upon curing; subjecting the semiconductor process wafer to a pre-curing thermal treatment temperature below Tg for a period of time; and, subjecting the semiconductor process wafer to at least one subsequent thermal treatment temperature above Tg for a period of time to form an uppermost passivation layer.

Abstract: A method for developing a photo-exposed photoresist layer to improve a critical dimension uniformity (CDU) for a semiconductor device manufacturing process including providing a semiconductor process wafer having a process surface comprising a photoresist layer photo-exposed according to an exposure pattern; dispensing a predetermined amount of developer solution over a stationary semiconductor process wafer to form a film of developer solution covering the process surface; partially developing the exposed portions of the photoresist layer comprising maintaining the semiconductor process wafer in a stationary position for a predetermined time period; rotating the semiconductor process wafer for a predetermined period of time to remove a portion of the developer solution; and, repeating the steps of dispensing, partially developing, and rotating, for a predetermined number of repetition cycles to complete a photoresist development process.

Abstract: Removing photoresist from alignment marks on a semiconductor wafer using a wafer edge exposure process is disclosed. The alignment marks on the wafer are covered by photoresist used in conjunction with semiconductor processing of one or more layers deposited on the semiconductor wafer. One or more parts of the edge of the wafer are exposed to remove the photoresist from these parts and thus reveal alignment marks on the wafer. The exposure of the one or more parts of the wafer is accomplished without performing a photolithographic clear out process. Rather, a wafer edge exposure (WEE) process is inventively utilized. Once the WEE process is performed, subsequent layers may be deposited by aligning them using the revealed alignment marks.

Abstract: A reticle for holding a mask thereon with reduced particle contamination problem is described. The reticle is constructed by a base plate that is formed of an optically transparent material such as quartz and has a recessed slot in a top surface to enclose an area at least the size of a mask formed on the base plate. An adhesive partially fills the recessed slot such that a top surface of the adhesive is at least 0.5 mm below the top surface of the base plate. A pellicle frame is mounted in the recessed slot with a bottom end of the frame encased in the adhesive and a thin film covering the top end of the pellicle frame to from a hermetically sealed cavity for protecting the mask.