Patents by Inventor Cheng Shih

Cheng Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230107596
    Abstract: Liquid-cooled notebook computer and power supply device thereof, includes a power supply line set including AC power supply line, transformer device set in adapter and electrically connected to AC power supply line and DC power supply line electrically connected to the other side of transformer device, a water cooling device installed in adapter, and a notebook computer with infusion inlet and infusion outlet thereof respectively connected to water outlet and water inlet of water cooling device. The infusion inlet and the infusion outlet are connected to the internal chip surface of notebook computer through infusion pipeline, and a heat conduction source is attached to the chip surface. After the water pump in water cooling device is actuated, the heat conduction source transports the heat generated by the chip from the notebook computer to water cooling device for circulating exchange of cold and hot liquids for heat dissipation.
    Type: Application
    Filed: June 7, 2022
    Publication date: April 6, 2023
    Inventors: Chih-Hsien CHEN, Pon-Chung CHIEN, Yu-Cheng SHIH
  • Patent number: 11614110
    Abstract: A demountable assembly structure includes a first body, second body, and engaging component. The first body has a first sliding surface and a slide switch recess positioned proximate to the first sliding surface. The second body has a second sliding surface and an engaging channel positioned proximate to the second sliding surface. The engaging channel is opposite the slide switch recess. The engaging component has a slide switch and a resilient element. The resilient element has a basal portion fixedly disposed in the slide switch recess and a resilient engaging arm extended from the basal portion to the engaging channel and engaged inside the engaging channel. The resilient engaging arm has a guide surface opposite the engaging channel. When the first sliding surface slides onto the second sliding surface, the resilient engaging arm gets engaged inside the engaging channel by having the guide surface slid along the engaging channel.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: March 28, 2023
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventor: Cheng-Shih Peng
  • Publication number: 20230030628
    Abstract: An electronic device (10) with a liquid cooling mechanism includes an electronic device body (1), a heat dissipation module (2) and a liquid cooling module (3). The electronic device body (1) includes a housing (11) and at least one heat generating element (12) installed in the housing (11). The heat dissipation module (2) is contained in the housing (11) and attached to the heat generating element (12). The liquid cooling module (3) includes a liquid cooling pipe (31) contained in the housing (11) and attached to the heat dissipation module (2), and two ends of the liquid cooling pipe (31) have two interface portions (311) exposed from the housing (11). In this way, the liquid cooling pipe (31) is used for water cooling to achieve a desirable cooling efficiency for the electronic device (10).
    Type: Application
    Filed: May 17, 2022
    Publication date: February 2, 2023
    Inventors: Chih-Hsien CHEN, Yu-Cheng SHIH, Pon-Chung CHIEN
  • Publication number: 20230013609
    Abstract: An interactive image marking method is introduced. The interactive image marking method includes the following steps, displaying a target image and at least one marked region in the target image; receiving an interactive signal, where the interactive signal corresponds to a first pixel of the target image; calculating a correlation between the first pixel and pixels of the target image, and determining a correlation range in the target image according to the correlation; editing the marked region according to the correlate range; and displaying the edited marked region. In addition, an electronic device and a recording medium using the method are also introduced.
    Type: Application
    Filed: December 23, 2021
    Publication date: January 19, 2023
    Inventors: YI-SHAN TSAI, CHENG-SHIH LAI, CHAO-YUN CHEN, MENG-JHEN WU, YUN-CHIAO WU, HSIN-YI FENG, PO-TSUN KUO, KAI-YI WANG, WEI-CHENG SU
  • Publication number: 20230021110
    Abstract: An image segmentation method includes the following steps: obtaining a target image; inputting the target image into a machine learning model to obtain an image segmentation parameter value corresponding to the target image; executing an image segmentation algorithm on the target image according to the image segmentation parameter value to obtain an image segmentation result, wherein the image segmentation result is segmenting the target image into object regions; and displaying the image segmentation result. In addition, an electronic device and storage medium using the method are also provided.
    Type: Application
    Filed: December 23, 2021
    Publication date: January 19, 2023
    Inventors: YI-SHAN TSAI, CHENG-SHIH LAI, CHAO-YUN CHEN, MENG-JHEN WU, YUN-CHIAO WU, HSIN-YI FENG, PO-TSUN KUO, KAI-YI WANG, WEI-CHENG SU
  • Publication number: 20230016073
    Abstract: A foldable electronic device includes a first casing, a second casing, a hinge structure and a foldable display. The hinge structure connects the first casing and the second casing, and includes a plurality of supporting blocks, a plurality of first hinge blocks and a plurality of second hinge blocks. The supporting blocks are arranged side by side between the first casing and the second casing. The first hinge blocks and the second hinge blocks are respectively arranged at two sides of the supporting blocks. One of the first hinge blocks connects two of the supporting blocks adjacent to each other. One of the second hinge blocks connects two of the supporting blocks adjacent to each other. The foldable display includes a first bonding portion secured to the first casing, a second bonding portion secured to the second casing and a foldable portion aligned to the hinge structure.
    Type: Application
    Filed: September 27, 2022
    Publication date: January 19, 2023
    Applicant: Acer Incorporated
    Inventors: Hui-Ping Sun, Wei-Chih Wang, Chun-Hung Wen, Yu-Cheng Shih, Yen-Chou Chueh, Chi-Tai Ho, Kuan-Lin Chen, Chun-Hsien Chen, Chih-Heng Tsou
  • Publication number: 20230011249
    Abstract: A pet toy includes a bar and a hollow casing. The bar includes a first-end portion and a second-end portion. The hollow casing is mounted to the first end portion. The hollow casing has an internal wall that defines an accommodation space. The hollow casing includes multiple apertures in communication with the accommodation space. The pet toy is applicable to the interaction between an owner and a pet and is also suitable for being played by the pet itself.
    Type: Application
    Filed: July 11, 2022
    Publication date: January 12, 2023
    Inventors: Yun-Pei LEE, Tsung-Cheng SHIH
  • Publication number: 20220398722
    Abstract: The present disclosure provides an operating method of a brain imaging neurological abnormality prediction system, which includes steps as follows. The T1-weighted image and the diffusion-weighted image of the patient are acquired; the image process is performed on the T1-weighted image and the diffusion-weighted image to obtain a smoothed brain standard space infarction image; the smoothed brain standard space infarction image is multiplied by and a weighted image for a post-processing to obtain a post-weight image; the post-weight image is inputted to the deep learning cross validation classification model of transfer learning to predict whether the neurological abnormality occurs within a predetermined period after the patient's brain disease.
    Type: Application
    Filed: May 10, 2022
    Publication date: December 15, 2022
    Inventors: Syu-Jyun PENG, Chien-Chen CHOU, Yen-Cheng SHIH, Hsu-Huai CHIU
  • Publication number: 20220398732
    Abstract: The present disclosure provides an operation method of a PET (positron emission tomography) quantitative localization system, which includes steps as follows. The PET image and the MRI (magnetic resonance imaging) of the patient are acquired; the nonlinear deformation is performed on the MRI and the T1 template to generate deformation information parameters; the AAL (automated anatomical labeling) atlas is deformed to an individual brain space of the patient, so as to generate an individual brain space AAL atlas, where the AAL atlas and the T1 template are in a same space; lateralization indexes of the ROIs of the individual brain space AAL atlas corresponding to the PET image normalized through the gray-scale intensity are calculated; the lateralization indexes are inputted into one or more machine learning models to analyze the result of determining a target.
    Type: Application
    Filed: October 26, 2021
    Publication date: December 15, 2022
    Inventors: Syu-Jyun PENG, Hsiang-Yu YU, Yen-Cheng SHIH, Tse-Hao LEE
  • Publication number: 20220375989
    Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.
    Type: Application
    Filed: September 9, 2021
    Publication date: November 24, 2022
    Applicant: Au Optronics Corporation
    Inventors: Hsin-Hung Li, Wei-Syun Wang, Chih-Chiang Chen, Yu-Cheng Shih, Cheng-Chan Wang, Chia-Hsin Chung, Ming-Jui Wang, Sheng-Ming Huang
  • Publication number: 20220367355
    Abstract: An integrated circuit structure includes a first low-k dielectric layer having a first k value, and a second low-k dielectric layer having a second k value lower than the first k value. The second low-k dielectric layer is overlying the first low-k dielectric layer. A dual damascene structure includes a via with a portion in the first low-k dielectric layer, and a metal line over and joined to the via. The metal line includes a portion in the second low-k dielectric layer.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 17, 2022
    Inventors: Chao-Chun Wang, Chung-Chi Ko, Po-Cheng Shih
  • Patent number: 11503728
    Abstract: A foldable electronic device includes a first casing, a second casing, a hinge structure and a foldable display. The hinge structure connects the first casing and the second casing, and includes a plurality of supporting blocks, a plurality of first hinge blocks and a plurality of second hinge blocks. The supporting blocks are arranged side by side between the first casing and the second casing. The first hinge blocks and the second hinge blocks are respectively arranged at two sides of the supporting blocks. One of the first hinge blocks connects two of the supporting blocks adjacent to each other. One of the second hinge blocks connects two of the supporting blocks adjacent to each other. The foldable display includes a first bonding portion secured to the first casing, a second bonding portion secured to the second casing and a foldable portion aligned to the hinge structure.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: November 15, 2022
    Assignee: Acer Incorporated
    Inventors: Hui-Ping Sun, Wei-Chih Wang, Chun-Hung Wen, Yu-Cheng Shih, Yen-Chou Chueh, Chi-Tai Ho, Kuan-Lin Chen, Chun-Hsien Chen, Chih-Heng Tsou
  • Publication number: 20220359412
    Abstract: A method for manufacturing an extra low-k (ELK) inter-metal dielectric (IMD) layer includes forming a first IMD layer including a plurality of dielectric material layers over a substrate. An adhesion layer is formed over the first IMD layer. An ELK dielectric layer is formed over the adhesion layer. A protection layer is formed over the ELK dielectric layer. A hard mask is formed over the protection layer and is patterned to create a window. Layers underneath the window are removed to create an opening. The removed layers include the protection layer, the ELK dielectric layer, the adhesion layer, and the first IMD layer. A metal layer is formed in the opening.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 10, 2022
    Inventors: Po-Cheng SHIH, Chia Cheng CHOU, Li Chun TE
  • Patent number: 11487331
    Abstract: An electronic device includes a first body, a second body pivoted to the first body and a magnetic force mechanism. The first body includes a driving portion. The second body includes a casing, a flexible display and a supporting mechanism movably disposed in the casing. The flexible display is attached to the supporting mechanism. The magnetic force mechanism is disposed in the casing, wherein a portion of the magnetic force mechanism is exposed from the casing and abuts against the driving portion. The magnetic force mechanism is magnetically coupled to the supporting mechanism, wherein the magnetic force mechanism generates a magnetic attraction force or a magnetic repulsion force to the supporting mechanism by the second body rotating relative to the first body.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: November 1, 2022
    Assignee: Acer Incorporated
    Inventors: Chun-Hung Wen, Wei-Chih Wang, Chi-Tai Ho, Yu-Cheng Shih, Hui-Ping Sun, Chun-Hsien Chen, Kuan-Lin Chen, Chih-Heng Tsou, Yen-Chou Chueh
  • Patent number: 11482493
    Abstract: An integrated circuit structure includes a first low-k dielectric layer having a first k value, and a second low-k dielectric layer having a second k value lower than the first k value. The second low-k dielectric layer is overlying the first low-k dielectric layer. A dual damascene structure includes a via with a portion in the first low-k dielectric layer, and a metal line over and joined to the via. The metal line includes a portion in the second low-k dielectric layer.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: October 25, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD
    Inventors: Chao-Chun Wang, Chung-Chi Ko, Po-Cheng Shih
  • Publication number: 20220334398
    Abstract: A head-mounted display includes a display host, a head belt base, a first lateral head belt, a second lateral head belt, an auxiliary head belt, a knob, a first driving component and a second driving component. The head belt base is connected to the display host through the first and second lateral head belts and the auxiliary head belt. The knob is pivoted to the head belt base, and the knob is coupled to the first and second lateral head belts through the first driving component and is coupled to the auxiliary head belt through the second driving component. The knob synchronously drives the first and second driving components, to drive the first and second lateral head belts through the first driving component and drive the auxiliary head belt through the second driving component. Alternatively, the knob drives one of the first driving component and the second driving component.
    Type: Application
    Filed: May 17, 2021
    Publication date: October 20, 2022
    Applicant: Acer Incorporated
    Inventors: Yu-Cheng Shih, Chih-Heng Tsou, Yen-Chou Chueh, Wei-Chih Wang, Hui-Ping Sun, Chun-Hsien Chen
  • Publication number: 20220328690
    Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.
    Type: Application
    Filed: June 27, 2022
    Publication date: October 13, 2022
    Inventors: Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih, Jun-Yi Ruan
  • Publication number: 20220260903
    Abstract: A method of manufacturing a reticle includes: disposing the reticle in a reticle pod, the reticle pod forming a sealed space to accommodate the reticle, and the reticle pod comprising a window arranged on an upper surface of the reticle pod and configured to allow a radiation at a predetermined wavelength to pass through; and performing an inspection operation on the reticle through the window.
    Type: Application
    Filed: April 25, 2022
    Publication date: August 18, 2022
    Inventors: WANG CHENG SHIH, HAO-MING CHANG, CHUNG-YANG HUANG, CHENG-MING LIN
  • Patent number: 11417602
    Abstract: A method for manufacturing an extra low-k (ELK) inter-metal dielectric (IMD) layer includes forming a first IMD layer including a plurality of dielectric material layers over a substrate. An adhesion layer is formed over the first IMD layer. An ELK dielectric layer is formed over the adhesion layer. A protection layer is formed over the ELK dielectric layer. A hard mask is formed over the protection layer and is patterned to create a window. Layers underneath the window are removed to create an opening. The removed layers include the protection layer, the ELK dielectric layer, the adhesion layer, and the first IMD layer. A metal layer is formed in the opening.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: August 16, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Cheng Shih, Chia Cheng Chou, Li Chun Te
  • Publication number: 20220246473
    Abstract: A method of forming a semiconductor device includes: forming a fin protruding above a substrate; forming a metal gate over the fin, the metal gate being surround by a dielectric layer; etching the metal gate to reduce a height of the metal gate, where after the etching, a recess is formed over the metal gate between gate spacers of the metal gate; lining sidewalls and a bottom of the recess with a semiconductor material; filling the recess by forming a dielectric material over the semiconductor material; forming a mask layer over the metal gate, where a first opening of the mask layer is directly over a portion of the dielectric layer adjacent to the metal gate; removing the portion of the dielectric layer to form a second opening in the dielectric layer, the second opening exposing an underlying source/drain region; and filling the second opening with a conductive material.
    Type: Application
    Filed: November 12, 2021
    Publication date: August 4, 2022
    Inventors: Jian-Hong Lu, Tsai-Jung Ho, Bor Chiuan Hsieh, Po-Cheng Shih, Tze-Liang Lee