Patents by Inventor Cheng Tai

Cheng Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153970
    Abstract: The invention provides a display device and a display panel. The display device includes the display panel and a reading circuit. The display panel includes an upper substrate, a lower substrate, a thin-film transistor (TFT) layer, and a photosensitive circuit. The TFT layer is disposed between the upper substrate and the lower substrate. A plurality of TFTs of a pixel array of the display panel are disposed in the TFT layer. The photosensitive circuit is disposed in the TFT layer to sense an ambient light. The reading circuit is coupled to the photosensitive circuit to read a sensing result.
    Type: Application
    Filed: January 18, 2023
    Publication date: May 9, 2024
    Applicant: Novatek Microelectronics Corp.
    Inventors: Ya-Hsiang Tai, Yi-Cheng Yuan, Chen-Yu Lin
  • Patent number: 11977274
    Abstract: An optical photographing lens assembly includes seven lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. Each of the seven lens elements of the optical photographing lens assembly has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The object-side surface of the first lens element is concave in a paraxial region thereof. The object-side surface of the first lens element is aspheric and has at least one critical point in an off-axis region thereof.
    Type: Grant
    Filed: November 2, 2022
    Date of Patent: May 7, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Cheng-Chen Lin, Yu-Tai Tseng, Tzu-Chieh Kuo
  • Patent number: 11975421
    Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Lung Lai, Cheng-Ping Chen, Shih-Chung Chen, Sheng-Tai Peng, Rong-Long Hung
  • Publication number: 20240142833
    Abstract: An electronic device includes a substrate, a driving element, a first insulating layer, a pixel electrode layer, and a common electrode layer. The driving element is disposed on the substrate. The first insulating layer is disposed on the driving element. The pixel electrode layer is disposed on the first insulating layer. The first insulating layer comprises a hole, and the pixel electrode layer is electrically connected to the driving element through the hole. The common electrode layer is disposed on the pixel electrode layer. The common electrode layer comprises a slit, and the slit has an edge, and the edge is disposed in the hole.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 2, 2024
    Applicant: Innolux Corporation
    Inventors: Wei-Yen Chiu, Ming-Jou Tai, You-Cheng Lu, Yi-Shiuan Cherng, Yi-Hsiu Wu, Chia-Hao Tsai, Yung-Hsun Wu
  • Patent number: 11959101
    Abstract: A cell activation reactor and a cell activation method are provided. The cell activation reactor includes a body, a rotating part, an upper cover, a microporous film, and multiple baffles. The body has an accommodating space, which is suitable for accommodating multiple cells and multiple magnetic beads. The rotating part is disposed in the accommodating space and includes multiple impellers. The microporous film is disposed in the accommodating space and covers multiple holes of the accommodating space. The baffles are disposed in the body. When the rotating part is driven to rotate, the interaction between the baffles and the impellers separates the cells and the magnetic beads.
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: April 16, 2024
    Assignee: Industrial Technology Research Institute
    Inventors: Ting-Hsuan Chen, Kuo-Hsing Wen, Ya-Hui Chiu, Nien-Tzu Chou, Ching-Fang Lu, Cheng-Tai Chen, Ting-Shuo Chen, Pei-Shin Jiang
  • Publication number: 20240096400
    Abstract: A memory device includes a memory bank with a memory cell connected to a local bit line and a word line. A first local data latch is connected to the local bit line and has an enable terminal configured to receive a first local clock signal. A word line latch is configured to latch a word line select signal, and has an enable terminal configured to receive a second local clock signal. A first global data latch is connected to the first local data latch by a global bit line, and the first global data latch has an enable terminal configured to receive a global clock signal. A global address latch is connected to the word line latch and has an enable terminal configured to receive the global clock signal. A bank select latch is configured to latch a bank select signal, and has an enable terminal configured to receive the second local clock signal.
    Type: Application
    Filed: January 23, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Yuan CHEN, Hau-Tai SHIEH, Cheng Hung LEE
  • Publication number: 20240094094
    Abstract: A pump health analysis method and a pump health analysis device using the same are provided. A standard vibration curve of a standard pump is obtained. The standard vibration curve is converted from a time domain to a frequency domain to obtain a first frequency distribution curve. A sample vibration curve of a sample pump is obtained. The sample vibration curve is converted from the time domain to the frequency domain to obtain a second frequency distribution curve. The first frequency distribution curve is compared with the second frequency distribution curve by using a cosine similarity algorithm to obtain a health index of the sample pump.
    Type: Application
    Filed: November 9, 2022
    Publication date: March 21, 2024
    Inventors: Wei-Chen WU, Cheng-Tai PENG, Chih-Chung KUO
  • Publication number: 20240088307
    Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Publication number: 20240084787
    Abstract: A concentrated solar power storage system and method convert water into water vapor by the solar thermal energy, and the water vapor further operates a hydroelectric power generation system with a water storage (or an energy storage capsule) through a repeated conversion process.
    Type: Application
    Filed: September 12, 2023
    Publication date: March 14, 2024
    Inventors: LIEN CHUN DING, CHIH CHENG TAI
  • Patent number: 11929318
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 11919126
    Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Lung Lai, Cheng-Ping Chen, Shih-Chung Chen, Sheng-Tai Peng
  • Publication number: 20240071330
    Abstract: A display device includes a display panel. The display panel has a functional display area. The functional display area includes a plurality of display pixels and a plurality of light transmitting regions. The plurality of display pixels are around by the plurality of the light transmitting regions. A boundary between one of the plurality of display pixels and one of the plurality of light transmitting regions comprises an arc segment.
    Type: Application
    Filed: November 3, 2023
    Publication date: February 29, 2024
    Applicant: Innolux Corporation
    Inventors: Chia-Hao Tsai, Ming-Jou Tai, Yi-Shiuan Cherng, Yu-Shih Tsou, You-Cheng Lu, Yung-Hsun Wu
  • Publication number: 20240071981
    Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.
    Type: Application
    Filed: November 1, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo-Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo, Yu-Chia Lai, Chih-Hsuan Tai
  • Publication number: 20240071428
    Abstract: A device is disclosed and includes an input stage circuit, a switching circuit, and a first latch circuit. The input stage circuit generates a first input signal having a first voltage and a second input signal based on a third input signal. The switching circuit operates in response to a first control signal, and adjusts a voltage level of a first data line according to the first input signal and a voltage level of a second data line according to the second input signal. The first latch circuit is coupled to the switching circuit by the first data line and the second data line. The first latch circuit latches a data in response to the first control signal and a second control signal, and adjusts the voltage level of the first data line based on a second voltage different from the first voltage.
    Type: Application
    Filed: November 8, 2023
    Publication date: February 29, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hua-Hsin YU, Hung-Jen LIAO, Cheng-Hung LEE, Hau-Tai SHIEH
  • Patent number: 11915695
    Abstract: A Wireless Interface Device and System (WIDS) is used as a bridge device for transmitting, translating, transporting and/or transforming a first emergency aid seeking signal to a second emergency aid seeking signal recognizable by a smart voice commendable device (e.g., AMAZON® ECHO®). The first emergency aid seeking signal can be generated from a Personal Emergency Response Systems (PERS), a fall sensor (e.g., a senior fall sensor), home security monitoring device, or any other emergency aid requesting devices.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: February 27, 2024
    Assignee: INSTANT CARE, INC.
    Inventors: Richard Allen Darling, Fong-Min Chang, Chih-Cheng Tai
  • Patent number: 11915743
    Abstract: A latch formed from a memory cell includes a clock input terminal configured to receive a clock signal, complementary first and second data terminals, and a latch circuit. The latch circuit has first and second inverters. The first inverter has an input terminal coupled to the first data terminal, and the second inverter has an input terminal coupled to the second data terminal. A first pass gate transistor is coupled between an output terminal of the second inverter and the first data terminal. A second pass gate transistor is coupled between an output terminal of the first inverter and the second data terminal. The first and second pass gate transistors each have a gate terminal coupled to the clock input terminal. The input terminal of the first inverter is not directly connected to the output terminal of the second inverter, and the input terminal of the second inverter is not directly connected to the output terminal of the first inverter.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hua-Hsin Yu, Cheng Hung Lee, Hung-Jen Liao, Hau-Tai Shieh
  • Patent number: 11904263
    Abstract: A connection assembly includes a manifold configured to attach a removable cartridge and a connector pipe with a flange. The flange is disposed between an upper plate and a lower plate of the manifold and has a width that prevents tilting of the connector pipe at greater than a maximum tilt angle. The connector pipe is configured to be inserted into a port of the removable cartridge in which an O-ring is compressed between the connector and the port. A filter assembly includes a manifold, a filter removably attached to the manifold, a connector pipe with a flange disposed between an upper plate and a lower plate of the manifold, and an O-ring. The O-ring is compressed between the connector pipe and the port.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: February 20, 2024
    Assignee: ENTEGRIS, INC.
    Inventors: Junya Takahashi, Cheng-Tai Wang
  • Publication number: 20240035620
    Abstract: An energy storage apparatus includes a energy storage for storing water and compressed gas; a concrete layer surrounded the energy storage; an inner protection layer arranged on an inner surface of the energy storage.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 1, 2024
    Inventors: LIEN CHUN DING, CHIH CHENG TAI, TSENG-CHUNG TSAI
  • Patent number: 11884912
    Abstract: A cell culture device includes a culture unit, a gas supply unit, a first pressure unit, at least one inspecting unit and a control unit. The culture unit contains a cell culture liquid. The gas supply unit, connected with the culture unit, is used for transmitting a culture gas into the culture unit. The first pressure unit, connected with the culture unit, is used for applying a pressure to the cell culture liquid in the culture unit. The at least one inspecting unit, connected with the culture unit, is used for receiving the cell culture liquid for inspection. The control unit, electrically coupled with the culture unit, the first pressure unit, the gas supply unit and the at least one inspecting unit, is used for monitoring corresponding condition parameters to determine respective operations. In addition, a cell culture method for the cell culture device is also provided.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: January 30, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuo-Hsing Wen, Ting-Hsuan Chen, Cheng-Tai Chen, Chien-An Chen, Su-Fung Chiu, Yung-Chi Chang, Nien-Jen Chou, Ping-Jung Wu, Shaw-Hwa Parng, Pei-Shin Jiang
  • Patent number: 11870253
    Abstract: An energy storage system includes at least one heterogeneous pressure media and interactive actuation module (“module”), a liquid source, a pump, a converter, a first pipeline, and a second pipeline. The module includes a first container storing an initial gas and a second container storing an initial liquid. The liquid source stores a working liquid. The pump regulates the working liquid from the liquid source into the module. The initial liquid is driven by the working liquid to continuously compress the initial gas so that the first container stores a first pressure energy, and the initial gas is continuously expanded to drive the initial liquid to convert the first pressure energy into a second pressure energy. The second pressure energy through the first pipe drives the converter to generate an electrical energy, and the working liquid after driving the converter is returned to the liquid source through the second pipeline.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: January 9, 2024
    Assignee: POWER8 TECH INC.
    Inventors: Lien Chun Ding, Qiu Shui Su, Song Yuan Lin, Chih Cheng Tai