Abstract: A slim linear LED lighting device is provided, including: a printed circuit board on which a connecting circuit is provided, at least one power input component, and a plurality of LED Bars. The LED Bar is formed by a plurality of the same kind of LED chips, and has a slim strip-shaped condensing lens structure integrally formed in the LED Bar packaging process by molding process to control the beam angle of the LED Bar and therefore the light distribution of the slim linear LED lighting device. The LED Bar's condensing lens has a small cross-sectional dimension; therefore the effective utilization factor of the light is improved as the slim linear LED lighting device is applied to a linear automotive lamp designed with a thin light blade structure.

Abstract: An integrated circuit structure includes a package component, which further includes a non-porous dielectric layer having a first porosity, and a porous dielectric layer over and contacting the non-porous dielectric layer, wherein the porous dielectric layer has a second porosity higher than the first porosity. A bond pad penetrates through the non-porous dielectric layer and the porous dielectric layer. A dielectric barrier layer is overlying, and in contact with, the porous dielectric layer. The bond pad is exposed through the dielectric barrier layer. The dielectric barrier layer has a planar top surface. The bond pad has a planar top surface higher than a bottom surface of the dielectric barrier layer.

Abstract: A method of and apparatus for wirelessly collecting and transmitting environmental condition information received from one or more environmental monitoring sensors located in and around a property of homes, buildings or structures. The environmental monitoring sensors communicates the conditions to a Property Management Communication Hub (e.g., a signal hub). The systems, apparatuses, and methods are Self-Contained Property Management System (‘SCPMS’). In one embodiment, a property management method is performed/executed by one or more algorithm implemented processor within the Property Management Communication Hub. The method comprises receiving an encoded event alert from a wireless sensor, encoding the event information, and transmitting the encoded event information to a remote location by a communication module configured to communicate using a wireless communication method.

Abstract: Methods of and devices for automatically reducing and/or eliminating false alarms to the call centers are disclosed. The method of reducing a false alarm notification to a call center can comprise receiving a triggered event notification on a mobile device, requesting a user to unlock the mobile device, and requesting the user to confirm a triggered alarm or dismiss the trigger notification using the mobile device using a non-GUI based user interface.

Abstract: A method of forming a memory device is provided. In some embodiments, a memory cell is formed over a substrate, and a sidewall spacer layer is formed along the memory cell. A lower etch stop layer is formed on the sidewall spacer layer, and an upper dielectric layer is formed on the lower etch stop layer. A first etching process is performed to etch back the upper dielectric layer using the lower etch stop layer as an etch endpoint.

Abstract: An integrated circuit structure includes a package component, which further includes a non-porous dielectric layer having a first porosity, and a porous dielectric layer over and contacting the non-porous dielectric layer, wherein the porous dielectric layer has a second porosity higher than the first porosity. A bond pad penetrates through the non-porous dielectric layer and the porous dielectric layer. A dielectric barrier layer is overlying, and in contact with, the porous dielectric layer. The bond pad is exposed through the dielectric barrier layer. The dielectric barrier layer has a planar top surface. The bond pad has a planar top surface higher than a bottom surface of the dielectric barrier layer.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming first and second well regions with different conductivity types in a semiconductor substrate. A well interface is formed between the first and second well regions. The method also includes patterning the semiconductor substrate to form a first fin structure in the first well region, a second fin structure in the second well region, and a first trench between the first and second fin structures. The first trench exposes the well interface in the semiconductor substrate. The method further includes forming insulating spacers on opposite sidewalls of the first trench and etching the semiconductor substrate below the first trench using the insulating spacers as an etch mask, to form a second trench below the first trench. In addition, the method includes filling the first and second trenches with an insulating material.

Abstract: The present disclosure relates to a method and apparatus for controlling an artificial intelligent smart illumination device, such as a light bulb, LED light, or the like. In one embodiment, a switching circuit for providing switchable power to the illumination device, and a processing circuit coupled to the switching circuit, for detecting one or more power toggles of the power received by the male base, and for controlling illumination of the illumination device based on the detection of one or more detected toggles (e.g., switches) is disclosed. The disclosure includes an artificial intelligent system, which can determine a lighting status based on the user's preference, living behaviors, time of a day, energy efficiency, energy costs, and any other light using conditions and factors.

Abstract: A slim linear LED lighting device is provided, including: a printed circuit board on which a connecting circuit is provided, at least one power input component, and a plurality of LED Bars. The LED Bar is formed by a plurality of the same kind of LED chips, and has a slim strip-shaped condensing lens structure integrally formed in the LED Bar packaging process by molding process to control the beam angle of the LED Bar and therefore the light distribution of the slim linear LED lighting device. The LED Bar's condensing lens has a small cross-sectional dimension; therefore the effective utilization factor of the light is improved as the slim linear LED lighting device is applied to a linear automotive lamp designed with a thin light blade structure.

Abstract: A storage container includes a container body and a lid that has a first lid portion, a second lid portion, and a hinge portion between the first and second lid portions. Two sides of the hinge portion are formed with a first inclined surface connected to the first lid portion and a second inclined surface connected to the second lid portion, respectively. The first inclined surface is provided with at least one first engaging unit. An outer wall surface of the first engaging unit has a first stopper. The first stopper is parallel to or perpendicular to a horizontal plane of the lid. The second inclined surface is provided with at least one second engaging unit. An inner wall surface of the second engaging unit has a second stopper. The second stopper is perpendicular to or parallel to the horizontal plane, and is perpendicular to the first stopper.

Abstract: A method of and apparatus for wirelessly collecting and transmitting environmental condition information received from one or more environmental monitoring sensors located in and around a property of homes, buildings or structures. The environmental monitoring sensors communicates the conditions to a Property Management Communication Hub (e.g., a signal hub) The systems, apparatuses, and methods are Self-Contained Property Management System (‘SCPMS’) In one embodiment, a property management method is performed/executed by one or more algorithm implemented processor within the Property Management Communication Hub. The method comprises receiving an encoded event alert from a wireless sensor, encoding the event information, and transmitting the encoded event information to a remote location by a communication module configured to communicate using a wireless communication method.

Abstract: A memory cell with an etch stop layer is provided. The memory cell comprises a bottom electrode disposed over a substrate. A switching dielectric is disposed over the bottom electrode and having a variable resistance. A top electrode is disposed over the switching dielectric. A sidewall spacer layer extends along sidewalls of the bottom electrode, the switching dielectric, and the top electrode and an upper surface of a lower dielectric layer. A lower etch stop layer is disposed over the lower dielectric layer and lining an outer sidewall of the sidewall spacer layer. The the sidewall spacer layer separates the lower etch stop layer from the lower dielectric layer.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate including a first well region and a second well region that have different conductivity types and are adjacent to each other. A first fin structure protrudes from the semiconductor substrate and is formed in the first well region. A second fin structure protrudes from the semiconductor substrate and is formed in the second well region and adjacent to the first fin structure. A first multi-step isolation structure that includes a first isolation portion is formed between the first fin structure and the second fin structure. A second isolation portion extends from the bottom surface of the first isolation portion. The second isolation portion has a top width that is narrower than the bottom width of the first isolation portion.

Abstract: An integrated circuit structure includes a package component, which further includes a non-porous dielectric layer having a first porosity, and a porous dielectric layer over and contacting the non-porous dielectric layer, wherein the porous dielectric layer has a second porosity higher than the first porosity. A bond pad penetrates through the non-porous dielectric layer and the porous dielectric layer. A dielectric barrier layer is overlying, and in contact with, the porous dielectric layer. The bond pad is exposed through the dielectric barrier layer. The dielectric barrier layer has a planar top surface. The bond pad has a planar top surface higher than a bottom surface of the dielectric barrier layer.

Abstract: A backlight module includes a transparent substrate, a plurality of light sources on a surface of the transparent substrate, a reflective sheet on a side of the transparent substrate adjacent to the plurality of light sources, and at least one supporting member between the transparent substrate and the reflective sheet. The light sources are configured for emitting light. The reflective sheet is configured for reflecting light toward the transparent substrate. The at least one supporting member is configured for separating the plurality of light sources from the reflective sheet.

Abstract: A memory cell with an etch stop layer is provided. The memory cell comprises a bottom electrode disposed over a substrate. A switching dielectric is disposed over the bottom electrode and having a variable resistance. A top electrode is disposed over the switching dielectric. A sidewall spacer layer extends upwardly along sidewalls of the bottom electrode, the switching dielectric, and the top electrode. A lower etch stop layer is disposed over the lower dielectric layer and lining an outer sidewall of the sidewall spacer layer. The lower etch stop layer is made of a material different from the sidewall spacer layer and protects the top electrode from damaging during manufacturing processes.

Abstract: A cell culture device includes a culture unit, a gas supply unit, a first pressure unit, at least one inspecting unit and a control unit. The culture unit contains a cell culture liquid. The gas supply unit, connected with the culture unit, is used for transmitting a culture gas into the culture unit. The first pressure unit, connected with the culture unit, is used for applying a pressure to the cell culture liquid in the culture unit. The at least one inspecting unit, connected with the culture unit, is used for receiving the cell culture liquid for inspection. The control unit, electrically coupled with the culture unit, the first pressure unit, the gas supply unit and the at least one inspecting unit, is used for monitoring corresponding condition parameters to determine respective operations. In addition, a cell culture method for the cell culture device is also provided.

Abstract: A bandgap reference circuit and method of using the same are provided. The bandgap reference circuit includes a startup component; an output component; and a bandgap core component coupled there-between. The bandgap core component includes a reference point having a voltage associated with an output signal of the output component. A controller is configured for controlling the bandgap core component and the output component to switch between a low power consumption mode and a normal operation mode based on the voltage at the reference point. When the bandgap core component and the output component operate in the normal operation mode, the bandgap reference circuit outputs a stable voltage and has a first power consumption. When the bandgap core component and the output component operate in the low power consumption mode, the bandgap reference circuit has a second power consumption less than the first power consumption.

Abstract: A flavonoid combination solution, and a manufacturing method and applications thereof for plant growth development are provided. The flavonoid combination solution contains flavonoids of flavonol glycosides/acetylated glycosides, saponins, flavones, and flavonol. The flavonoid combination solution also contains fatty acids, carboxylic acids, and anti-oxidants. The solution is effective in promoting plant growth, enhancing a seed germination rate, reducing pathogens, and reducing/eliminating stunting effects of a herbicide.

Abstract: Some embodiments relate to a memory device. The memory device includes a memory cell overlying a substrate, the memory cell includes a data storage structure disposed between a lower electrode and an upper electrode. An upper interconnect wire overlying the upper electrode. A first inter-level dielectric (ILD) layer surrounding the memory cell and the upper interconnect wire. A second ILD layer overlying the first ILD layer and surrounding the upper interconnect wire. A sidewall spacer laterally surrounding the memory cell. The sidewall spacer has a first sidewall abutting the first ILD layer and a second sidewall abutting the second ILD layer.