Abstract: The disclosure provides an environment perception device and method of a mobile vehicle. The environment perception device includes a camera module, a LiDAR module, a database and a processing circuit. The camera module photographs a field near the mobile vehicle to generate a three-dimensional (3D) image frame. The LiDAR module scans the field to generate a 3D scanned frame. The processing circuit fuses the 3D image frame and the 3D scanned frame to generate 3D object information. The processing circuit compares the 3D object information with a 3D map in the database to determine whether an object is a static object. The processing circuit performs an analysis and calculation on the 3D object information to obtain movement characteristics of the object when the object is not the static object, and skips the analysis and calculation on the 3D object information when the object is the static object.

Abstract: A UV (ultraviolet) curing apparatus for a contact-lens polymerization process is provided. A UV curing module is equipped for the mold cavities of contact-lens curing molds, including a plurality of first UV light sources arranged above the mold cavities and a plurality of second UV light sources arranged below the mold cavities. A plurality of light output areas of a first light guide device guides the light beams emitted by the first UV light sources to illuminate upper light receiving surfaces of the molds. A plurality of reflecting plates of a second light guide device reflects and scatters the light beams emitted by the second UV light sources to lower light receiving surfaces of the molds. Thereby, the contact-lens polymer inside the molds is uniformly cured, and the yield is raised.

Abstract: Some embodiments relate to a semiconductor structure. The semiconductor structure includes a conductive structure over a semiconductor substrate. A first dielectric layer is over the conductive structure. A second dielectric layer is over the first dielectric layer. An interconnect structure is over the conductive structure and disposed in the first and second dielectric layers. The interconnect structure has a protrusion in direct contact with a sidewall of the conductive structure. The interconnect structure comprises an interconnect liner surrounding a conductive interconnect body.

Abstract: The present disclosure provides a method for performing identity recognition on a to-be-recognized object, an electronic device, and a non-transitory computer-readable storage medium. The method includes: acquiring, by the infrared camera, and in response to an infrared camera turn-on condition being met, a first image of a to-be-recognized target, and performing target detection on the first image, the to-be-recognized target being a finger and/or a palm; acquiring, by the visible light camera, and in response to a visible light camera turn-on condition being met, a second image of the to-be-recognized target, and performing identifier code recognition on the second image; performing, in response to the to-be-recognized target being detected from the first image, identity recognition based on a third image, and determining an identity recognition result of the to-be-recognized object, the third image being at least one image among the first image in which the to-be-recognized target is detected.

Abstract: A method includes forming a semiconductor fin extending a first height above a substrate, forming a dummy dielectric material over the semiconductor fin and over the substrate, forming a dummy gate material over the dummy dielectric material, the dummy gate material extending a second height above the substrate, etching the dummy gate material using multiple etching processes to form a dummy gate stack, wherein each etching process of the multiple etching processes is a different etching process, wherein the dummy gate stack has a first width at the first height, and wherein the dummy gate stack has a second width at the second height that is different from the first width.

Abstract: The problem of forming top electrode vias that provide consistent results in devices that include resistance switching RAM cells of varying heights is solved using a dielectric composite that fills areas between resistance switching RAM cells and varies in height to align with the tops of both the taller and the shorter resistance switching RAM cells. An etch stop layer may be formed over the dielectric composite providing an equal thickness of etch-resistant dielectric over both taller and shorter resistance switching RAM cells. The dielectric composite causes the etch stop layer to extend laterally away from the resistance switching RAM cells to maintain separation between the via openings and the resistance switching RAM cell sides even when the openings are misaligned.

Abstract: A method of detecting a biological sample includes the following steps. A magnetic sensor chip is provided, wherein the magnetic sensor chip includes a substrate and a magnetic sensing layer located on the substrate. Probes are connected to the magnetic sensor chip. A sample solution containing biological samples labeled with a first marker is provided on the magnetic sensor chip, so that the biological samples labeled with the first marker are hybridized with the probes. Magnetic beads labeled with a second marker are provided on the magnetic sensor chip, so that the magnetic beads labeled with the second marker are bound onto the biological samples labeled with the first marker. A signal sensed by the magnetic sensing layer is detected by a magnetic sensor.

Abstract: A method includes determining a target etching depth for etching a plurality of dielectric regions in a wafer. The wafer includes a plurality of protruding semiconductor fins and the plurality of dielectric regions between the plurality of protruding semiconductor fins. The method further includes etching the plurality of dielectric regions, projecting a light beam on the wafer, and generating a spectrum from a reflected light reflected from the wafer, determining an end point for etching based on the spectrum. The end point is an expected time point. The plurality of dielectric regions are etched to the target etching depth. The etching of the plurality of dielectric regions is stopped at the end point.

Abstract: A device and a method for contactless fingerprint acquisition is provided. The contactless fingerprint acquisition device includes a housing including a finger scanning area for at least one finger; at least two image capturing devices located in the housing and arranged in a predetermined baseline distance, each image capturing device having an optical axis in a predetermined angle with the vertical direction; and, a lighting unit in the housing for illuminating the at least one finger. The at least two image capturing devices are operable to acquire a plurality of partial fingerprint images of the at least one finger, and the plurality of partial fingerprint images correspond to different portions of the at least one finger.

Abstract: A method of and device for reducing energy consumption of a motion sensing device by reducing or avoid using function of device's internal GPS system when a predetermined condition is senses. The predetermined condition includes a predetermined state of motion or no-motion sensed. The motion sensing device includes Personal Emergency Response Systems.

Abstract: An integrated circuit structure includes a package component, which further includes a non-porous dielectric layer having a first porosity, and a porous dielectric layer over and contacting the non-porous dielectric layer, wherein the porous dielectric layer has a second porosity higher than the first porosity. A bond pad penetrates through the non-porous dielectric layer and the porous dielectric layer. A dielectric barrier layer is overlying, and in contact with, the porous dielectric layer. The bond pad is exposed through the dielectric barrier layer. The dielectric barrier layer has a planar top surface. The bond pad has a planar top surface higher than a bottom surface of the dielectric barrier layer.

Abstract: Technologies relating to device for personal emergency response system are disclosed. An example wearable device includes a wearable transmitter having a button and an enclosure having an enclosure body, an opening on a rear side of the wearable device, and a window on a front side of the wearable device. The wearable transmitter is secured into the enclosure and the button is configured to be pressed via the opening.

Abstract: One or more predetermined combination of human use (e.g., including animals) probiotics and specific ranges of ratio of anti-obesity human use probiotics compositions and their preparation methods and uses are provided. Particularly, the Present Disclosure provides a specific composition of food-grade probiotics been shaped by germ-free or antibiotics-treated dual-specificity phosphatase 6 (Dusp6) deficient mammal, which is effective in altering a relative abundance of gut microbiota and also useful in reducing body weight, fat mass, and/or size of adipocytes and increasing oxygen consumption and/or energy expenditure and thus can be used to treat or prevent obesity, manage blood glucose level, or their associated metabolic disorders or conditions in a subject in need.

Abstract: A UV (ultraviolet) curing apparatus for a contact-lens polymerization process is provided. A UV curing module is equipped for the mold cavities of contact-lens curing molds, including a plurality of first UV light sources arranged above the mold cavities and a plurality of second UV light sources arranged below the mold cavities. A plurality of light output areas of a first light guide device guides the light beams emitted by the first UV light sources to illuminate upper light receiving surfaces of the molds. A plurality of reflecting plates of a second light guide device reflects and scatters the light beams emitted by the second UV light sources to lower light receiving surfaces of the molds. Thereby, the contact-lens polymer inside the molds is uniformly cured, and the yield is raised.

Abstract: A UV (ultraviolet) curing apparatus for a contact-lens polymerization process is provided. A UV curing module is equipped for the mold cavities of contact-lens curing molds, including a plurality of first UV light sources arranged above the mold cavities and a plurality of second UV light sources arranged below the mold cavities. A plurality of first light output areas of a first light guide device guides the light beams emitted by the first UV light sources to illuminate upper light receiving surfaces of the molds. A plurality of second light output areas of a second light guide device guides the light beams emitted by the second UV light sources to illuminate lower light receiving surfaces of the molds. Thereby, the contact-lens polymer inside the molds is uniformly cured, and the yield is raised.

Abstract: A tissue scaffold for use in a tendon and/or ligament is provided, which includes a weave formed by interlacing warp yarns and weft yarns, wherein the warp yarns include a plurality of fibers with an alternative shaped cross section structure, and the weave includes: a main body area with a bioactive component formed on the fiber surface, and a fixed area comprises the weft yarn having a bioceramic material. The tissue scaffold prepared in the present disclosure has the characteristics of stimulating the growth of tissues and inducing tissue repair, effectively improving the ability of tissue regeneration and bone healing, and is beneficial to the reconstruction of the tendon and/or ligament.

Abstract: An integrated circuit structure includes a package component, which further includes a non-porous dielectric layer having a first porosity, and a porous dielectric layer over and contacting the non-porous dielectric layer, wherein the porous dielectric layer has a second porosity higher than the first porosity. A bond pad penetrates through the non-porous dielectric layer and the porous dielectric layer. A dielectric barrier layer is overlying, and in contact with, the porous dielectric layer. The bond pad is exposed through the dielectric barrier layer. The dielectric barrier layer has a planar top surface. The bond pad has a planar top surface higher than a bottom surface of the dielectric barrier layer.

Abstract: A detection method of multiple analytes includes the following. A microparticle is provided. The microparticle is coupled with at least one first ligand, and includes a body and a plurality of first protrusions formed on a surface of the body. Next, the microparticle is mixed with a variety of analytes to form a first complex. Thereafter, the first complex is mixed with a variety of second ligands carrying a variety of first labels, such that the variety of second ligands bind to the variety of analytes in the first complex and form a second complex. Lastly, the variety of first labels in the variety of second ligands in the second complex are detected.

Abstract: A method of forming a memory device is provided. In some embodiments, a memory cell is formed over a substrate, and a sidewall spacer layer is formed along the memory cell. A lower etch stop layer is formed on the sidewall spacer layer, and an upper dielectric layer is formed on the lower etch stop layer. A first etching process is performed to etch back the upper dielectric layer using the lower etch stop layer as an etch endpoint.

Abstract: A method of and apparatus for wirelessly collecting and transmitting environmental condition information received from one or more environmental monitoring sensors located in and around a property of homes, buildings or structures. The environmental monitoring sensors communicates the conditions to a Property Management Communication Hub (e.g., a signal hub). The systems, apparatuses, and methods are Self-Contained Property Management System (‘SCPMS’). In one embodiment, a property management method is performed/executed by one or more algorithm implemented processor within the Property Management Communication Hub. The method comprises receiving an encoded event alert from a wireless sensor, encoding the event information, and transmitting the encoded event information to a remote location by a communication module configured to communicate using a wireless communication method.