Abstract: A listening device includes a housing and a circuit board assembly. The housing includes at least one sound outlet. The circuit board assembly is disposed on the housing and includes a microphone, a proximity sensing chip, and a proximity sensing pattern. The microphone and the proximity sensing chip are close to each other and are disposed in a first area of the circuit board assembly. The proximity sensing pattern is disposed in a second area of the circuit board assembly. The second area is connected to the first area. The proximity sensing pattern surrounds and is staggered with the at least one sound outlet.

Abstract: A full-area touch device includes a linkage unit disposed between a base unit and a touch control unit to drive a trigger switch of the touch control unit to be triggered by the base unit. The linkage unit is symmetrical relative to the trigger switch and includes an outer frame, an inner frame, linkage members fixed between the outer and inner frames, and a left plate and a right plate fixed to the base unit in the inner frame. A left front linkage member and a left rear linkage member are fixed between the left plate and the inner frame. A right front linkage member and a right rear linkage member are fixed between the right plate and the inner frame. A portion of an outer frame space not occupied by the base unit, the inner frame, the left plate and the right plate is defined as a floating chamber.

Abstract: An actuator device includes a base unit, a sliding unit, and a scraping unit. The base unit includes a base seat defining a receiving space, two magnets mounted to the base seat, and a steel belt that covers the receiving space and that is attracted to the magnets. The sliding unit is disposed on the base unit, and includes a sliding table that has a pass channel through which the steel belt extends. A nut seat is connected to the sliding table. The scraping unit is mounted to the sliding unit, and includes a scraping member that abuts against the steel belt. A threaded shaft is connected to a nut seat, such that a driving member is operable to drive rotation of the threaded shaft to thereby move the sliding unit along the threaded shaft relative to the base unit.

Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.

Abstract: Provided is a pharmaceutical composition comprising: (a) a cabazitaxel prodrug represented by Formula 1 or a pharmaceutical acceptable salt thereof, and (b) a cyclodextrin wherein R—O— is an ester group. Also provided is a method of treating a tumor in a subject in need thereof, comprising administering to the subject a therapeutically effective amount of the pharmaceutical composition.

Abstract: An actuator device includes a base body that defines a receiving space. A first end subunit has a ventilation hole, a first oil injection hole, and a first oil injection nozzle extending from the first oil injection hole into the receiving space. A second end subunit is connected to the base body. A sliding unit is slidable relative to the base body, and has a slide table, a nut seat connected to the slide table, and a connection hole connected to the slide table and the base body. A pressure relief unit is mounted in the ventilation hole for allowing air to be discharged from the receiving space to an external environment. A driving unit is operable for driving movement of the sliding unit.

Abstract: An actuator device includes a base unit, a sliding unit, and a scraping unit. The base unit includes a base seat defining a receiving space, two magnets mounted to the base seat, and a steel belt that covers the receiving space and that is attracted to the magnets. The sliding unit is disposed on the base unit, and includes a sliding table that has a pass channel through which the steel belt extends. A nut seat is connected to the sliding table. The scraping unit is mounted to the sliding unit, and includes a scraping member that abuts against the steel belt. A threaded shaft is connected to a nut seat, such that a driving member is operable to drive rotation of the threaded shaft to thereby move the sliding unit along the threaded shaft relative to the base unit.

Abstract: Described herein are prediction models based on the transcriptomic, exomic, and/or radiological analyses on tissue samples to predict the likelihood of the original cancer (such as Hepatocellular carcinoma (HCC)) recurrence into the liver transplant. An example computer implemented method for predicting the likelihood of liver cancer recurrence 5 into a liver transplant includes receiving gene expression data related to a liver tissue sample for a subject having a liver cancer, inputting the gene expression data into a trained machine learning model, and predicting, using the trained machine learning model, a risk of recurrence of the liver cancer in the subject after liver transplantation.

Abstract: A manufacturing method of a semiconductor package includes the following steps. A semiconductor die set is placed adjacent to a lower conductive via. The semiconductor die set and the lower conductive via are at least laterally encapsulated with a lower encapsulating material to form a lower encapsulated semiconductor device. A lower redistribution structure is formed over the lower encapsulated semiconductor device. A sensor die is placed adjacent to an upper conductive via, wherein the sensor die has a pad and a sensing region. The sensor die and the upper conductive via are encapsulated with an upper encapsulating material to form an upper encapsulated semiconductor device. An upper redistribution structure is formed over the upper encapsulated semiconductor device, wherein the upper redistribution structure is connected to the pad and reveals the sensing region of the sensor die.

Abstract: This document describes systems and techniques directed at a machine-learning-based greedy optimization mechanism for reducing radio-frequency (RF) tests in production. In aspects, a process capability index is disclosed, the process capability index used to refine a test-set. The test-set includes tests configured to be performed on an electronic device. The process capability index is configured based on upper specification limits and lower specification limits of the electronic device for each test in the test-set, as well as results for each of the tests in the test-set. The process capability index is further configured based on a new upper specification limit and a new lower specification limit of the electronic device for a new test not in the test-set, as well as results for the new test.

Abstract: An air-floating guide rail device includes a guide rail unit, a slider unit, and a linear motor unit. The guide rail unit includes a guide rail body and two air-floating block sets made of a material different from that of the guide rail body and each including top and side air-floating blocks. The slider unit includes a main sliding seat and two lateral sliding seats connected integrally to the main sliding seat and each having first and second guiding surfaces transverse to each other and disposed respectively adjacent to corresponding top and side air-floating blocks, and first and second air guiding passages connecting the first and second guiding surfaces to the external environment. The linear motor unit includes a stator and a mover mounted fixedly to the main sliding seat and movable relative to the stator for driving linear movement of the slider unit relative to the guide rail unit.

Abstract: A package structure including at least one semiconductor die and a redistribution structure is provided. The semiconductor die is laterally encapsulated by an encapsulant, and the redistribution structure is disposed on the semiconductor die and the encapsulant and electrically connected with the semiconductor die. The redistribution structure includes signal lines and a pair of repair lines. The signal lines include a pair of first signal lines located at a first level, and each first signal line of the pair of first signal lines has a break that split each first signal line into separate first and second fragments. The pair of repair lines is located above the pair of first signal lines and located right above the break. Opposite ending portions of each repair line are respectively connected with the first and second fragments with each repair line covering the break in each first signal line.

Abstract: A semiconductor package includes a lower encapsulated semiconductor device, a lower redistribution structure, an upper encapsulated semiconductor device, and an upper redistribution structure. The lower redistribution structure is disposed over and electrically connected to the lower encapsulated semiconductor device. The upper encapsulated semiconductor device is disposed over the lower encapsulated semiconductor device and includes a sensor die having a pad and a sensing region, an upper encapsulating material at least laterally encapsulating the sensor die, and an upper conductive via extending through the upper encapsulating material and connected to the lower redistribution structure. The upper redistribution structure is disposed over the upper encapsulated semiconductor device. The upper redistribution structure covers the pad of the sensor die and has an opening located on the sensing region of the sensor die.

Abstract: A waterproof click pad device includes a click pad, a frame and a waterproof unit. The frame surrounds the click pad and surrounds an axis passing through the click pad. The waterproof unit is transverse to the axis and is in sheet form. The waterproof unit includes a frame adhesive member surrounding the axis and adhered to the frame, a first non-adhesive member surrounding the axis, connected to an inner periphery of the frame adhesive member and spaced apart from and located above the frame, a second non-adhesive member surrounding the axis, connected to an inner periphery of the first non-adhesive member and spaced apart from and located above the click pad and the frame, and an plate adhesive member connected to an inner periphery of the second non-adhesive member and adhered to the click pad.

Abstract: A package structure including a first redistribution layer, a semiconductor die, through insulator vias, an insulating encapsulant and a second redistribution layer. The first redistribution layer includes a dielectric layer, a conductive layer, and connecting portions electrically connected to the conductive layer. The dielectric layer has first and second surfaces, the connecting portions has a first side, a second side, and sidewalls joining the first side to the second side. The first side of the connecting portions is exposed from and coplanar with the first surface of the dielectric layer. The semiconductor die is disposed on the second surface of the dielectric layer. The through insulator vias are connected to the conductive layer. The insulating encapsulant is disposed on the dielectric layer and encapsulating the semiconductor die and the through insulator vias. The second redistribution layer is disposed on the semiconductor die and over the insulating encapsulant.

Abstract: An image processing circuit performs super-resolution (SR) operations. The image processing circuit includes memory to store multiple parameter sets of multiple artificial intelligence (AI) models. The image processing circuit further includes an image guidance module, a parameter decision module, and an SR engine. The image guidance module operates to detect a representative feature in an image sequence including a current frame and past frames within a time window. The parameter decision module operates to adjust parameters of one or more AI models based on a measurement of the representative feature. The SR engine operates to process the current frame using the one or more AI models with the adjusted parameters to thereby generate a high-resolution image for display.

Abstract: A package structure including at least one semiconductor die and a redistribution structure is provided. The semiconductor die is laterally encapsulated by an encapsulant, and the redistribution structure is disposed on the semiconductor die and the encapsulant and electrically connected with the semiconductor die. The redistribution structure includes signal lines and a pair of repair lines. The signal lines include a pair of first signal lines located at a first level, and each first signal line of the pair of first signal lines has a break that split each first signal line into separate first and second fragments. The pair of repair lines is located above the pair of first signal lines and located right above the break. Opposite ending portions of each repair line are respectively connected with the first and second fragments with each repair line covering the break in each first signal line.

Abstract: A sliding table device includes a base unit, a sliding unit and a cover plate. The sliding unit includes two rails, two sliding blocks disposed respectively and slidably on the rails and each having an oil inlet, and a sliding seat mounted co-movably on the sliding blocks. The sliding seat includes a main portion having a flow passage and an insertion hole that interconnects the flow passage and external environment, two fixed portions mounted respectively to the sliding blocks and each having a connecting passage that communicates with the flow passage, and two guiding portions formed respectively on the fixed portions and each having a guiding passage that communicates with the corresponding connecting passage and the corresponding oil inlet. The cover plate covers a portion of the main portion, and the insertion hole is not covered by the cover plate.

Abstract: An air-floating guide rail device includes a guide rail unit, a slider unit, and a linear motor unit. The guide rail unit includes a guide rail body and two air-floating block sets made of a material different from that of the guide rail body and each including top and side air-floating blocks. The slider unit includes a main sliding seat and two lateral sliding seats connected integrally to the main sliding seat and each having first and second guiding surfaces transverse to each other and disposed respectively adjacent to corresponding top and side air-floating blocks, and first and second air guiding passages connecting the first and second guiding surfaces to the external environment. The linear motor unit includes a stator and a mover mounted fixedly to the main sliding seat and movable relative to the stator for driving linear movement of the slider unit relative to the guide rail unit.