Abstract: A common-mode noise filter is provided, and comprises a first transmission structure and a second transmission structure. At least one first transmission unit is connected between a first signal input end and a first signal output end of the first transmission structure in series. At least one second transmission unit is connected between a second signal input end and a second signal output end of the second transmission structure in series. Two first capacitors are connected between the first signal input end and the second signal input end in series, and connected at a first node together. A first common-mode noise suppression unit is connected between the first node and a reference potential, and comprises a second capacitor and a first lossy element connected to the second capacitor in series or parallel. The first common-mode noise suppression unit can absorb a common-mode noise via the first lossy element.

Abstract: A pressing device includes a base board, an upper board unit that is disposed over the base board, and an intermediate unit that is disposed between the base board and the upper board unit. The upper board unit includes a panel, a circuit board, and a tact switch. The intermediate unit includes a middle portion that corresponds in position to the tact switch, a surrounding frame member, and a plurality of interconnecting board members. When the upper board unit is pressed, at least one of the interconnecting board members is deformed, and the middle portion is driven to convert the tact switch from an initial state to a triggered state.

Abstract: A pressing device includes a base board, an upper board unit that is disposed over the base board, and an intermediate unit that is disposed between the base board and the upper board unit. The upper board unit includes a panel, a circuit board, and a tact switch. The intermediate unit includes a middle portion that corresponds in position to the tact switch, a surrounding frame member, and a plurality of interconnecting board members. When the upper board unit is pressed, at least one of the interconnecting board members is deformed, and the middle portion is driven to convert the tact switch from an initial state to a triggered state.

Abstract: A pressing device for a touchpad includes a base unit, an upper board unit, and an intermediate unit. The upper board unit includes a trigger switch aligned with the abutment portion of the base unit. The intermediate unit has a surrounding frame member, two positioning members, two connecting members, and a actuating member that are interconnected by a plurality of linking ribs. When the upper board is pressed at a position above one of the surrounding frame member and the connecting members, one of the connecting members is moved relative to the actuating member by virtue of the linking ribs, and the actuating member provides a force to convert the trigger switch from an initial state to a triggered state.

Abstract: A pressing device for a touchpad includes a base unit, an upper board unit, and an intermediate unit. The upper board unit includes a trigger switch aligned with the abutment portion of the base unit. The intermediate unit has a surrounding frame member, two positioning members, two connecting members, and a actuating member that are interconnected by a plurality of linking ribs. When the upper board is pressed at a position above one of the surrounding frame member and the connecting members, one of the connecting members is moved relative to the actuating member by virtue of the linking ribs, and the actuating member provides a force to convert the trigger switch from an initial state to a triggered state.

Abstract: A riser bracket for supporting a riser board and a computer card inserted into the riser board is disclosed. The riser bracket includes a first riser bracket piece, a first latch, a second riser bracket piece, and a second latch. The computer card and the riser board are positioned on a motherboard. The first riser bracket piece is configured to be coupled to the riser board. The first latch is configured to the first riser bracket piece to a first mounting point of the motherboard, and to move between a latched position and an unlatched position. The second riser bracket piece is coupled to the first riser bracket piece. The second latch is configured to couple the second riser bracket piece to a second mounting point of the motherboard, and move between a latched position and an unlatched position.

Abstract: A carrier device includes a base bracket, a device bracket, a lever, and a cable holder. The device bracket is coupled to the base bracket and is movable between an initial device bracket position and a final device bracket position. The lever is coupled to the base bracket and is movable between an initial lever position and a final lever position. The lever is configured to move from the initial lever position toward the final lever position in response to the device bracket moving from the initial device bracket position to the final device bracket position. The cable holder is coupled to the base bracket and the lever. The cable holder is configured to hold one or more cables. The cable holder is further configured to move from an initial cable holder position to a final cable holder position, in response to the lever moving to the final lever position.

Abstract: A pressing device includes a base board unit including at least two coupling members, an upper board unit including a trigger switch and at least two engaging members, and two interlocking members disposed between the upper board unit and the base board unit. Each interlocking member has at least one coupling portion coupled with a respective coupling member, at least one engaging portion coupled with a respective engaging member, and at least one locking set. The locking set of one interlocking member is coupled with the locking set of the other interlocking member. When the upper board unit is pressed, the interlocking members are pivoted and the trigger switch is converted from an initial state to a triggered state.

Abstract: A carrier for different electronic components for installation in an expansion card for a computing device is disclosed. The carrier conforms to M.2 standards such as an M.2 22110 form factor. The carrier has a top heat sink and a bottom heat sink. A circuit board includes the electronic device. The circuit board is seated between the top heat sink and the bottom heat sink. A side clip includes a top panel and a bottom panel. The side clip has an open position and a closed position. When the side clip is in the closed position, the top panel of the side clip contacts the top heat sink, and the bottom panel of the side clip contacts the bottom heat sink, to hold the top heat sink to the bottom heat sink.

Abstract: A coil assembly includes coil units connected to a coil base. Each coil unit includes top, intermediate and bottom coil modules, each of which has spaced-apart first and second interaction sides, and two non-interaction sides connected to the first and second interaction sides to form an accommodating space. The first interaction sides of the intermediate and bottom coil modules are juxtaposed with each other in the accommodating space of the top coil module. The second interaction sides of the top and intermediate coil modules are juxtaposed with each other in the accommodating space of the bottom coil module. An ironless motor includes a magnetic rail assembly and the aforesaid coil assembly.

Abstract: The present disclosure relates to a gripper device which comprises: a belt pulley driven by a power-driven motor; a belt and another belt pulley driven by the above belt pulley; a ball screw driven and rotated by the belt pulley; nut brackets driven to be shifted along two rigid guideways by two reverse threads at both sides of the ball screw, respectively; a plurality of steel balls, which are installed between a nut bracket and a rigid guideway and sustain more stresses when a workpiece is clamped between two upper slide on the nut brackets.

Abstract: A node sled is for installation into an electronics chassis. The node sled includes a housing that contains electronic components. The housing includes a front bracket and a catch mechanism. The node sled further includes a lever having an engagement arm, an actuation arm, and a mounting portion. The mounting portion is pivotably mounted to the housing. The actuation arm is manually moveable between a first position in which the engagement arm locks the node sled into the electronics chassis, and a second position in which the engagement arm is released from the electronics chassis. The actuation arm has a latch that engages the catch mechanism in response to the actuation arm being in the first position.

Abstract: A clip for securing one or more cables in a cable aisle of a computing device comprises a housing portion and a sliding portion. The housing portion has a first sidewall and a second sidewall that are coupled via a base. A cable channel is defined between the first sidewall and the second sidewall. The cable channel is configured to accommodate the one or more cables. The sliding portion is coupled to the first sidewall of the housing portion. The sliding portion has a lifting member extending across the cable channel from the first sidewall to the second sidewall. The sliding portion is configured to be moveable between a lowered position and a raised position. The lifting member moves from a first end of the cable channel to a second end of the cable channel, when the sliding portion moves from the lowered position to the raised position.

Abstract: A node sled is for installation into an electronics chassis. The node sled includes a housing that contains electronic components. The housing includes a front bracket and a catch mechanism. The node sled further includes a lever having an engagement arm, an actuation arm, and a mounting portion. The mounting portion is pivotably mounted to the housing. The actuation arm is manually moveable between a first position in which the engagement arm locks the node sled into the electronics chassis, and a second position in which the engagement arm is released from the electronics chassis. The actuation arm has a latch that engages the catch mechanism in response to the actuation arm being in the first position.

Abstract: A semiconductor package includes a lower encapsulated semiconductor device, a lower redistribution structure, an upper encapsulated semiconductor device, and an upper redistribution structure. The lower redistribution structure is disposed over and electrically connected to the lower encapsulated semiconductor device. The upper encapsulated semiconductor device is disposed over the lower encapsulated semiconductor device and includes a sensor die having a pad and a sensing region, an upper encapsulating material at least laterally encapsulating the sensor die, and an upper conductive via extending through the upper encapsulating material and connected to the lower redistribution structure. The upper redistribution structure is disposed over the upper encapsulated semiconductor device. The upper redistribution structure covers the pad of the sensor die and has an opening located on the sensing region of the sensor die.

Abstract: A clip for securing one or more cables in a cable aisle of a computing device comprises a housing portion and a sliding portion. The housing portion has a first sidewall and a second sidewall that are coupled via a base. A cable channel is defined between the first sidewall and the second sidewall. The cable channel is configured to accommodate the one or more cables. The sliding portion is coupled to the first sidewall of the housing portion. The sliding portion has a lifting member extending across the cable channel from the first sidewall to the second sidewall. The sliding portion is configured to be moveable between a lowered position and a raised position. The lifting member moves from a first end of the cable channel to a second end of the cable channel, when the sliding portion moves from the lowered position to the raised position.

Abstract: A riser bracket for supporting a riser board and a computer card inserted into the riser board is disclosed. The riser bracket includes a first riser bracket piece, a first latch, a second riser bracket piece, and a second latch. The computer card and the riser board are positioned on a motherboard. The first riser bracket piece is configured to be coupled to the riser board. The first latch is configured to the first riser bracket piece to a first mounting point of the motherboard, and to move between a latched position and an unlatched position. The second riser bracket piece is coupled to the first riser bracket piece. The second latch is configured to couple the second riser bracket piece to a second mounting point of the motherboard, and move between a latched position and an unlatched position.

Abstract: A semiconductor package includes a first wafer, a second wafer, and an interconnect. The first wafer includes a first die, a first encapsulating material encapsulating the first die, and a first redistribution structure disposed over the first die and the first encapsulating material. The second wafer includes a second die, a second encapsulating material encapsulating the second die, and a second redistribution structure disposed over the second die and the second encapsulating material, wherein the second redistribution structure faces the first redistribution structure. The interconnect is disposed between the first wafer and the second wafer and electrically connecting the first redistribution structure and the second redistribution structure, wherein the interconnect includes a substrate and a plurality of through vias extending through the substrate for connecting the first redistribution structure and the second redistribution structure.

Abstract: An image processing circuit stores a training database and models in memory. The image processing circuit includes an attribute identification engine to identify an attribute from an input image according to a model stored in the memory. By enhancing the input image based on the identified attribute, a picture quality (PQ) engine in the image processing circuit generates an output image for display. The image processing circuit further includes a data collection module to generate a labeled image based on the input image labeled with the identified attribute, and to add the labeled image to the training database. A training engine in the image processing circuit then re-trains the model using the training database.

Abstract: A package structure including a semiconductor die, an insulating encapsulant, and a redistribution layer is provided. The semiconductor die includes a semiconductor substrate, a plurality of metallization layers disposed on the semiconductor substrate, and a passivation layer disposed on the plurality of metallization layers. The passivation layer has a first opening that partially expose a topmost layer of the plurality of metallization layers. The insulating encapsulant is encapsulating the semiconductor die. The redistribution layer includes at least a first dielectric layer and a first conductive layer stacked on the first dielectric layer. The first dielectric layer has a second opening that overlaps with the first opening, and a width ratio of the second opening to the first opening is in a range of 2.3:1 to 12:1. The first conductive layer is electrically connected to the topmost layer of the plurality of metallization layers through the first and second openings.