Abstract: An electronic chassis includes a motherboard sled configured to engage in or out of the electronic chassis. The motherboard sled includes a housing and a mechanical actuator for engaging the motherboard sled into or out of an electronic chassis. The mechanical actuator includes at least one lever rotatably coupled to a hinge to form a first fulcrum adjacent to a vertical edge of a front surface of the housing. The mechanical actuator also includes a guiding arm adjacent to the hinge and mechanically connected to the at least one lever to form a second fulcrum. The guiding arm rotates between a secured position adjacent to the front surface and an unsecured position away from the front surface.

Abstract: A carrier for different electronic components for installation in an expansion card for a computing device is disclosed. The carrier conforms to M.2 standards such as an M.2 22110 form factor. The carrier has a top heat sink and a bottom heat sink. A circuit board includes the electronic device. The circuit board is seated between the top heat sink and the bottom heat sink. A side clip includes a top panel and a bottom panel. The side clip has an open position and a closed position. When the side clip is in the closed position, the top panel of the side clip contacts the top heat sink, and the bottom panel of the side clip contacts the bottom heat sink, to hold the top heat sink to the bottom heat sink.

Abstract: Provided is a liposomal sustained-release composition for use in treatment of pulmonary disease. The liposomal sustained release composition comprises a liposome that includes a polyethylene glycol (PEG)-modified lipid and encapsulates a tyrosine kinase inhibitor. Tyrosine kinase inhibitor is stably entrapped in the liposome, and the resulting liposomal drug formulation can be aerosolized or nebulized for administration via inhalation. This aerosolized liposomal drug formulation yields consistent pharmacokinetic and pharmacodynamic profiles while achieving desired efficacy and safety.

Abstract: A semiconductor device includes passive electrical components in a substrate; and an interconnect structure over the passive electrical components, conductive features of the interconnect structure being electrically coupled to the passive electrical components. The conductive features of the interconnect structure includes a first conductive line over the substrate; a conductive bump over the first conductive line, where in a plan view, the conductive bumps has a first elongated shape and is entirely disposed within boundaries of the first conductive line; and a first via between the first conductive line and the conductive bump, the first via electrically connected to the first conductive line and the conductive bump, where in the plan view, the first via has a second elongated shape and is entirely disposed within boundaries of the conductive bump.

Abstract: The present invention relates to methods for treating patients having cancer or a premalignant or neoplastic condition. It is based, at least in part, on the discovery that a genome editing technique that specifically targets a fusion gene can induce cell death in a cancer cell other than a prostate cancer cell, e.g., a hepatocellular cancer cell, having the fusion gene. The present invention provides methods for treating cancer patients that include performing a genome editing technique targeting a fusion gene present within one or more cells of a subject to produce an anti-cancer effect.

Abstract: A common-mode noise filter is provided, and comprises a first transmission structure and a second transmission structure. At least one first transmission unit is connected between a first signal input end and a first signal output end of the first transmission structure in series. At least one second transmission unit is connected between a second signal input end and a second signal output end of the second transmission structure in series. Two first capacitors are connected between the first signal input end and the second signal input end in series, and connected at a first node together. A first common-mode noise suppression unit is connected between the first node and a reference potential, and comprises a second capacitor and a first lossy element connected to the second capacitor in series or parallel. The first common-mode noise suppression unit can absorb a common-mode noise via the first lossy element.

Abstract: Provided is a projection device, including a casing, a light source module, an optical engine module, a projection lens, and a fan. The casing includes a right cover plate and a baffle opposite to each other, and a lower cover plate adjacent to the right cover plate. The baffle divides the casing into first and second areas. The right and lower cover plates respectively have first and second air outlets adjacent to each other and located in the second area. The light source module, the optical engine module, located on a light transmission path of the light source module, the projection lens, connected to the optical engine module, and the fan, adjacent to the baffle, are disposed in the first area of the casing. The projection device is placed in a first or second state, and hot airflow therein flows out from the first or second air outlet.

Abstract: A sliding table includes a sliding seat having a seat body made from a first material and disposed between two main rigid rails parallel with each other. The seat body has two opposite rail recesses opening toward the main rigid rails, and two inner cyclic track holes disposed between the rail recesses. Two seat body rigid rails made from a second material harder than the first material are fixed in the rail recesses to confront the main rigid rails. Two roller belt modules are arranged in two cyclic track members overmolded to the seat body. When the seat body moves along the main rigid rails, each roller belt module circulates along one of the cyclic track members.

Abstract: An electronic chassis includes a motherboard sled configured to engage in or out of the electronic chassis. The motherboard sled includes a housing and a mechanical actuator for engaging the motherboard sled into or out of an electronic chassis. The mechanical actuator includes at least one lever rotatably coupled to a hinge to form a first fulcrum adjacent to a vertical edge of a front surface of the housing. The mechanical actuator also includes a guiding arm adjacent to the hinge and mechanically connected to the at least one lever to form a second fulcrum. The guiding arm rotates between a secured position adjacent to the front surface and an unsecured position away from the front surface.

Abstract: A slide rail device includes a track member, and a slider unit that includes a slider being slidable along the track member and having a recess which is cooperatively defined by two inner side faces and an inner connecting face connected between the inner side faces, and two block boards fixedly fastened to the inner connecting face. The slide rail device further includes a linear motor unit that includes a rotor connected to the inner connecting face and cooperating with the inner connecting face, the inner side faces and the block boards to define a filling space, and a heat dissipating member that fills the filling space, and that is seamlessly connected between the rotor and the slider unit.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A package structure including at least one semiconductor die and a redistribution structure is provided. The semiconductor die is laterally encapsulated by an encapsulant, and the redistribution structure is disposed on the semiconductor die and the encapsulant and electrically connected with the semiconductor die. The redistribution structure includes signal lines and a pair of repair lines. The signal lines include a pair of first signal lines located at a first level, and each first signal line of the pair of first signal lines has a break that split each first signal line into separate first and second fragments. The pair of repair lines is located above the pair of first signal lines and located right above the break. Opposite ending portions of each repair line are respectively connected with the first and second fragments with each repair line covering the break in each first signal line.

Abstract: A video processing system includes an input port and a video processing circuit. The input port obtains device information of a display panel. The video processing circuit obtains an input frame and the device information, configures an image enhancement operation according to the device information, generates an output frame by performing the image enhancement operation upon the input frame, and transmits the output frame to the display panel for video playback.

Abstract: A motor for an electric cylinder includes a motor body, an encoder, a rotor coupling portion and an encoder fixing portion. The motor body includes a rotor having a shaft hole through which a rotating shaft extends. The encoder is installed on the motor body and includes a fixing ring fixed on the rotating shaft, a magnet holder combined with the fixing ring, an encoder magnet mounted on the magnet holder, and a magnetic sensor opposite to the encoder magnet. The magnet holder is rotatable relative to the fixing ring to adjust the magnetic pole position of the encoder magnet relative to the magnetic sensor. The rotor coupling portion is arranged on the rotor and fixed to the rotating shaft at a first corresponding position. The encoder fixing portion is arranged on the fixing ring and fixed with the rotating shaft at a second corresponding position.

Abstract: A computer chassis can include an airflow channel for permitting airflow specifically to cool one or more power supply units (PSUs) within respective power supply receiving space(s). The chassis can include a baffle device positioned between the power supply receiving space and the airflow channel for directing airflow through the PSU into the airflow channel. The airflow channel can be located between first and second spaces of the chassis, each containing computing components. The baffle device can include a cable passthrough that receives a cable that facilitates communication between component(s) in the first space and component(s) in the second space. The baffle device can include one or more ribs that stop the PSU from being fully inserted into the power supply receiving space when the PSU is inserted in an incorrect orientation, thus signaling to the user to remove the PSU and re-insert it in a correct orientation.

Abstract: A computer chassis can include an airflow channel for permitting airflow specifically to cool one or more power supply units (PSUs) within respective power supply receiving space(s). The chassis can include a baffle device positioned between the power supply receiving space and the airflow channel for directing airflow through the PSU into the airflow channel. The airflow channel can be located between first and second spaces of the chassis, each containing computing components. The baffle device can include a cable passthrough that receives a cable that facilitates communication between component(s) in the first space and component(s) in the second space. The baffle device can include one or more ribs that stop the PSU from being fully inserted into the power supply receiving space when the PSU is inserted in an incorrect orientation, thus signaling to the user to remove the PSU and re-insert it in a correct orientation.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A package structure including at least one semiconductor die and a redistribution structure is provided. The semiconductor die is laterally encapsulated by an encapsulant, and the redistribution structure is disposed on the semiconductor die and the encapsulant and electrically connected with the semiconductor die. The redistribution structure includes signal lines and a pair of repair lines. The signal lines include a pair of first signal lines located at a first level, and each first signal line of the pair of first signal lines has a break that split each first signal line into separate first and second fragments. The pair of repair lines is located above the pair of first signal lines and located right above the break. Opposite ending portions of each repair line are respectively connected with the first and second fragments with each repair line covering the break in each first signal line.

Abstract: A touchpad press device includes a support unit having two first sides interconnecting between two second sides, and first engaging members proximate to the second sides. A touch unit with a touch switch is disposed above the support unit, and a transmission unit is disposed between the support unit and the touch unit. The transmission unit includes peripheral plates, each of which is disposed above one of the second sides and has second engaging members, and a pressing plate to trigger the touch switch. When one of the peripheral plates is pressed downward through the touch unit, the other peripheral plate turns upward so that the second engaging members thereof engage the respective first engaging members to limit the other peripheral plate from moving further upward.

Abstract: A carrier device includes a base bracket, a device bracket, a lever, and a cable holder. The device bracket is coupled to the base bracket and is movable between an initial device bracket position and a final device bracket position. The lever is coupled to the base bracket and is movable between an initial lever position and a final lever position. The lever is configured to move from the initial lever position toward the final lever position in response to the device bracket moving from the initial device bracket position to the final device bracket position. The cable holder is coupled to the base bracket and the lever. The cable holder is configured to hold one or more cables. The cable holder is further configured to move from an initial cable holder position to a final cable holder position, in response to the lever moving to the final lever position.