Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.

Abstract: A semiconductor device includes passive electrical components in a substrate; and an interconnect structure over the passive electrical components, conductive features of the interconnect structure being electrically coupled to the passive electrical components. The conductive features of the interconnect structure includes a first conductive line over the substrate; a conductive bump over the first conductive line, where in a plan view, the conductive bumps has a first elongated shape and is entirely disposed within boundaries of the first conductive line; and a first via between the first conductive line and the conductive bump, the first via electrically connected to the first conductive line and the conductive bump, where in the plan view, the first via has a second elongated shape and is entirely disposed within boundaries of the conductive bump.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A video processing circuit includes an input buffer, an online adaptation circuit, and an artificial intelligence (AI) super-resolution (SR) circuit. The input buffer receives input low-resolution (LR) frames and high-resolution (HR) frames from a video source over a network. The online adaptation circuit forms training pairs, and calculates an update to representative features that characterize the input LR frames using the training pairs. Each training pair formed by one of the input LR frames and one of the HR frames. The AI SR circuit receives the input LR frames from the input buffer and the representative features from the online adaptation circuit. Concurrently with calculating the update to the representative features, the AI SR circuit generates SR frames for display from the input LR frames based on the representative features. Each SR frame has a higher resolution than a corresponding one of the input LR frames.

Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.

Abstract: A motor for an electric cylinder includes a motor body, an encoder, a rotor coupling portion and an encoder fixing portion. The motor body includes a rotor having a shaft hole through which a rotating shaft extends. The encoder is installed on the motor body and includes a fixing ring fixed on the rotating shaft, a magnet holder combined with the fixing ring, an encoder magnet mounted on the magnet holder, and a magnetic sensor opposite to the encoder magnet. The magnet holder is rotatable relative to the fixing ring to adjust the magnetic pole position of the encoder magnet relative to the magnetic sensor. The rotor coupling portion is arranged on the rotor and fixed to the rotating shaft at a first corresponding position. The encoder fixing portion is arranged on the fixing ring and fixed with the rotating shaft at a second corresponding position.

Abstract: A sliding table includes a sliding seat having a seat body made from a first material and disposed between two main rigid rails parallel with each other. The seat body has two opposite rail recesses opening toward the main rigid rails, and two inner cyclic track holes disposed between the rail recesses. Two seat body rigid rails made from a second material harder than the first material are fixed in the rail recesses to confront the main rigid rails. Two roller belt modules are arranged in two cyclic track members overmolded to the seat body. When the seat body moves along the main rigid rails, each roller belt module circulates along one of the cyclic track members.

Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.

Abstract: A semiconductor package includes an integrated passive device (IPD) including one or more passive devices over a first substrate; and metallization layers over and electrically coupled to the one or more passive devices, where a topmost metallization layer of the metallization layers includes a first plurality of conductive patterns; and a second plurality of conductive patterns interleaved with the first plurality of conductive patterns. The IPD also includes a first under bump metallization (UBM) structure over the topmost metallization layer, where the first UBM structure includes a first plurality of conductive strips, each of the first plurality of conductive strips electrically coupled to a respective one of the first plurality of conductive patterns; and a second plurality of conductive strips interleaved with the first plurality of conductive strips, each of the second plurality of conductive strips electrically coupled to a respective one of the second plurality of conductive patterns.

Abstract: A mechanical device includes a worm and two swing units disposed in a housing. Each swing unit has a pivot member and a swing member meshing with the worm. The swing member has an arcuate cam slot that has a first end and a second end. A rail is fixed to the housing above the swing units and the worm. Two sliders are connected to the swing units. Each slider has a slide block engaging the rail, an extension arm, and a protrusion protruding from the extension arm and inserted into the arcuate cam slot to slide between the first and second ends of the arcuate cam slot when the worm drives the swing member to swing.

Abstract: A semiconductor package includes a lower encapsulated semiconductor device, a lower redistribution structure, an upper encapsulated semiconductor device, and an upper redistribution structure. The lower redistribution structure is disposed over and electrically connected to the lower encapsulated semiconductor device. The upper encapsulated semiconductor device is disposed over the lower encapsulated semiconductor device and includes a sensor die having a pad and a sensing region, an upper encapsulating material at least laterally encapsulating the sensor die, and an upper conductive via extending through the upper encapsulating material and connected to the lower redistribution structure. The upper redistribution structure is disposed over the upper encapsulated semiconductor device. The upper redistribution structure covers the pad of the sensor die and has an opening located on the sensing region of the sensor die.

Abstract: A coil assembly includes coil units connected to a coil base. Each coil unit includes top, intermediate and bottom coil modules, each of which has spaced-apart first and second interaction sides, and two non-interaction sides connected to the first and second interaction sides to form an accommodating space. The first interaction sides of the intermediate and bottom coil modules are juxtaposed with each other in the accommodating space of the top coil module. The second interaction sides of the top and intermediate coil modules are juxtaposed with each other in the accommodating space of the bottom coil module. An ironless motor includes a magnetic rail assembly and the aforesaid coil assembly.

Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.

Abstract: A mechanical device includes a worm and two swing units disposed in a housing. Each swing unit has a pivot member and a swing member meshing with the worm. The swing member has an arcuate cam slot that has a first end and a second end. A rail is fixed to the housing above the swing units and the worm. Two sliders are connected to the swing units. Each slider has a slide block engaging the rail, an extension arm, and a protrusion protruding from the extension arm and inserted into the arcuate cam slot to slide between the first and second ends of the arcuate cam slot when the worm drives the swing member to swing.

Abstract: A semiconductor package includes an integrated passive device (IPD) including one or more passive devices over a first substrate; and metallization layers over and electrically coupled to the one or more passive devices, where a topmost metallization layer of the metallization layers includes a first plurality of conductive patterns; and a second plurality of conductive patterns interleaved with the first plurality of conductive patterns. The IPD also includes a first under bump metallization (UBM) structure over the topmost metallization layer, where the first UBM structure includes a first plurality of conductive strips, each of the first plurality of conductive strips electrically coupled to a respective one of the first plurality of conductive patterns; and a second plurality of conductive strips interleaved with the first plurality of conductive strips, each of the second plurality of conductive strips electrically coupled to a respective one of the second plurality of conductive patterns.

Abstract: A semiconductor device includes passive electrical components in a substrate; and an interconnect structure over the passive electrical components, conductive features of the interconnect structure being electrically coupled to the passive electrical components. The conductive features of the interconnect structure includes a first conductive line over the substrate; a conductive bump over the first conductive line, where in a plan view, the conductive bumps has a first elongated shape and is entirely disposed within boundaries of the first conductive line; and a first via between the first conductive line and the conductive bump, the first via electrically connected to the first conductive line and the conductive bump, where in the plan view, the first via has a second elongated shape and is entirely disposed within boundaries of the conductive bump.

Abstract: Provided is a liposomal sustained-release composition for use in treatment of pulmonary disease. The liposomal sustained release composition comprises a liposome that includes a polyethylene glycol (PEG)-modified lipid and encapsulates a tyrosine kinase inhibitor. Tyrosine kinase inhibitor is stably entrapped in the liposome, and the resulting liposomal drug formulation can be aerosolized or nebulized for administration via inhalation. This aerosolized liposomal drug formulation yields consistent pharmacokinetic and pharmacodynamic profiles while achieving desired efficacy and safety.

Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.

Abstract: A sliding table assembly includes a sliding seat unit slidably mounted to a base unit. Two auxiliary sliding seats are slidably mounted to the base unit and disposed on two sides of the sliding seat unit. A connection member is connected between the auxiliary sliding seats. Two roller sets are respectively mounted to the auxiliary sliding seats. Each roller set has rollers to roll on the base unit. A driving screw rod is coupled to the sliding seat unit and embraced by the auxiliary seats. When the sliding unit is moved by the driving screw rod, it pushes the auxiliary sliding seats to slide together therewith.