Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.

Abstract: A computer case assembly is adapted for computer component units of a computer system to be mounted to. The computer component units include a motherboard and a power supply unit. The computer case assembly includes a main case module and a power case module. The main case module includes a main frame that is cuboid-shaped and that is adapted for the motherboard to be mounted to. The power case module includes a power case frame that is cuboid-shaped, that is adapted for the power supply unit to be mounted to, and that is detachably mounted to the main frame.

Abstract: Aspects of the present disclosure provide an automated labeling system. For example, the automated labeling system can include an automated labeling module (ALM) configured to receive wireless signals and ground truth of learning object and label the wireless signals with the ground truth when receiving the ground truth to generate labeled training data. The automated labeling system can also include a training database coupled to the ALM. The training database can be configured to store the labeled training data.

Abstract: A method for manufacturing a target material is provided, including the steps of: disposing raw material powder on a substrate and melting the raw material powder by laser to form a target material layer; repeating the preceding process to allow a plurality of target material layers to form an integrated target material column; after cooling the target material column, removing the target material column from the substrate; and performing vacuum heat treatment on the target material column. Since the target material is additively manufactured and subjected to vacuum heat treatment, the target material has a finer and more uniform microstructure, thus improving the product quality.

Abstract: Systems and methods for reconciling location based on multiple computing device signals. For example, the computing system can obtain location datasets associated with freight carrier services from computing sources. The computing system can determine an expected signal pattern for a location associated with a freight transportation service. The computing system can determine, for each computing source, a confidence score. The confidence score can represent the probability that the respective location dataset is associated with a load being transported for a freight transportation service. The computing system can determine a primary location dataset based on the confidence scores. The computing system can perform actions based on the primary location dataset.

Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.

Abstract: A bus power distribution micromodule, including a UPS; a channel door containing a bus starting end A; and at least one cabinet containing a bus section A1 or A2, wherein an input end of the bus starting end A is connected to the UPS, an output end thereof is connected to the bus section A1 or A2 by means of a connector, and the bus section A1 or A2 is disposed in the cabinet and connected to a power distribution apparatus of the cabinet. In the bus power distribution micromodule, a plug-and-play property, easy expansion and IT load flexible matching of the cabinet are realized; the bus starting end is integrated in the channel door of the micromodule, thereby facilitating convenient maintenance and operation; the beneficial effect of having a small, occupied area is achieved; and, moreover, the bus power distribution micromodule has the advantage of rapid delivery.

Abstract: An adaptive overshoot-voltage suppression circuit (100), a reference circuit, a chip and a communication terminal. The adaptive overshoot-voltage suppression circuit (100) comprises an overshoot-voltage suppression unit (1001) and a voltage-current conversion unit (1002), wherein an input end of the overshoot-voltage suppression unit (1001) is connected to a preset sampling point on a reference circuit to be tested, an output end of the overshoot-voltage suppression unit (1001) is connected to an input end of the voltage-current conversion unit (1002), and an output end of the voltage-current conversion unit (1002) is connected to a preset adjustment point on said reference circuit.

Abstract: An information encoding control method includes: receiving first configuration information, where the first configuration information is used to configure N groups of parameters of N artificial intelligence (AI) encoders or an AI decider, and the AI decider is configured to determine an AI encoder that is in the N AI encoders and to which first information is applicable, and/or is configured to determine that none of the N AI encoders is applicable to encoding the first information; and sending first indication information to a network device, where the first indication information indicates that a first encoder is used for encoding the first information, the first encoder is determined based on the first configuration information and the first information, and the first encoder is an encoder in the N AI encoders, or is a second encoder different from the N AI encoders.

Abstract: The present disclosure generally relates to underwater user interfaces.

Abstract: A method for processing an integrated circuit includes forming first and second gate all around transistors. The method forms a dipole oxide in the first gate all around transistor without forming the dipole oxide in the second gate all around transistor. This is accomplished by entirely removing an interfacial dielectric layer and a dipole-inducing layer from semiconductor nanosheets of the second gate all around transistor before redepositing the interfacial dielectric layer on the semiconductor nanosheets of the second gate all around transistor.

Abstract: A semiconductor device includes a first active region, a second active region and a dielectric wall. The second active region disposed adjacent to the first active region, and there is a first space between the first active region and the second active region. The dielectric wall is formed within the first space and has a first sidewall and a second sidewall opposite to the first sidewall. The first sidewall and the second sidewall opposite to the first sidewall continuously extend along a plane.

Abstract: A method includes: obtaining impact values for characteristic conditions; selecting training data subsets respectively from training data sets according to the impact values; obtaining a candidate model and an evaluation value based on the training data subsets; supplementing the training data subsets according to the impact values; obtaining another candidate model and another evaluation value based on training data subsets thus supplemented; repeating the step of supplementing the training data subset, and the step of obtaining another candidate model and another evaluation value based on the training data subsets thus supplemented; and selecting one of the candidate models as a prediction model based on the evaluation values.

Abstract: In one aspect, a method includes receiving a packet at a first node from a second node, wherein the first node and the second node are part of a network; determining if congestion exists in a primary route used by the packet; processing a packet drop event to establish a secondary route for the packet in response to determining that the congestion exists in the primary route; and restoring use of the primary route if an expiration time has expired. The expiration time is adjusted by an elapsed period and a congestion condition within the network.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure. The method includes forming a stack of semiconductor layers comprising a plurality of first semiconductor layers and a plurality of second semiconductor layers over a semiconductor substrate. A first stack of masking layers is formed over the stack of semiconductor layers with a first width and a second stack of masking layers is formed laterally offset from the stack of semiconductor layers with a second width less than the first width. A patterning process is performed on the semiconductor substrate and the stack of semiconductor layers, thereby defining a first fin structure laterally adjacent to a second fin structure. The first fin structure has the first width and the second fin structure has the second width. The stack of semiconductor layers directly overlies the first fin structure and has the first width.

Abstract: Provide are a positioning reference signal generation method and apparatus, a communication system and a storage medium. The method includes: generating a positioning frequency domain sequence according to time-frequency resource information and system configuration information, where the time-frequency resource information includes the number Nprsslot of allocated system symbols consecutive in time, and the system configuration information includes positioning subcarrier spacing ?fprs; and generating, based on the positioning frequency domain sequence, positioning time domain data consecutive in a time period of the Nprsslot consecutive system symbols.

Abstract: An absorption type near-infrared filter comprising a first multilayer film, a second multilayer film, and an absorption film, wherein in the ultraviolet band, the difference of between the wavelength with the transmittance at 80% of the absorbing film and the wavelength with the reflectivity at 80% of the first multilayer film falls in the range between 25 nm and 37 nm, the difference of between the wavelength with the transmittance at 50% of the absorbing film and the wavelength with the reflectivity at 50% of the first multilayer film falls in the range between 6 nm and 14 nm, and the difference of between the wavelength with the transmittance at 20% of the absorbing film and the wavelength with the reflectivity at 20% of the first multilayer film falls in the range between ?6 nm and 2.5 nm.

Abstract: An adaptive vehicle headlight is provided for being installed on a vehicle body for use. The adaptive vehicle headlight includes a light body, an optical lens, a driver, and a control unit. The optical lens, the driver, and the control unit are integrated into the light body. In practice, the optical lens can optionally include a light distributing member. The control unit can cause an operation of the driver according to a tilt angle of the vehicle body, such that the optical lens and/or the light distributing member are rotated to a predetermined angle, so as to produce an illumination pattern in a horizontal state.

Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: 0 ? ? ? T ? ? 1 T ? ? 2 ? A ? ( T ) ? dT - ? T ? ? 1 T ? ? 3 ? E ? ( T ) ? dT ? ? < 0.01 wherein A(T) is the coefficient of thermal expansion of the transfer head, E(T) is the coefficient of thermal expansion of the substrate, T1 is room temperature, T2 is the temperature of the transfer head, and T3 is the temperature of the substrate.

Abstract: A chamber adaptor and a manufacturing method thereof. The chamber adaptor includes: a housing provided with a gas inlet, a gas outlet, a chamber inlet, and a chamber outlet, where the gas inlet is configured to be removably connected to a main board device, the gas outlet is configured to be removably connected to a respiratory pathway, the chamber inlet is configured to be removably connected to an input end of a chamber for storing liquid and the chamber outlet is configured to be removably connected to an output end of the chamber, the chamber adaptor further includes a control circuit and at least one sensing apparatus, where the at least one sensing apparatus is arranged on one end of the control circuit closer to the gas outlet and extends into a gas output channel.