Abstract: A mask package comprises a package body, a cover body and a first buffer. The package body has a bottom and a side wall, where the side wall has a top; the side wall is connected with the bottom, the top is located on a side opposite to a side where the side wall is connected with the bottom, and the side wall surrounds the bottom to form an accommodating space. The cover body is disposed on the top of the side wall and masks the accommodating space. The first buffer has a first length and a first width, and is disposed between the package body and the cover body, where the accommodating space has a second length and a second width, the second length is less than the first length and the second width is less than the first width.

Abstract: A lithography system includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket, a rail guide, and a first protective film. The first sliding member is coupled to the wafer stage. The second sliding member is coupled to an edge of the table body, in which the first sliding member is coupled to a track of the second sliding member. The first bracket fixes the first cable, the first bracket being coupled to a roller structure, in which the roller structure includes a body and a wheel coupled to the body. The rail guide confines a movement of the wheel of the roller structure. The first protective film is adhered to a surface of the rail guide, in which the roller structure is moveable along the first protective film on the surface of the rail guide.

Abstract: A sensing module includes a first antenna unit, a second antenna unit, a first inductor and a proximity sensor. The first antenna unit has at least one first communication frequency band, and the second antenna unit has at least one second communication frequency band. The first antenna unit and the second antenna unit are connected in parallel to one end of the first inductor, and the other end of the first inductor is electrically connected to the proximity sensor.

Abstract: A foldable tool includes a first rod member, a second rod member and a pivoting device. The first rod member has a first length. The second rod member has a second length. The pivoting device is arranged between the first rod member and the second rod member. The first rod member and the second rod member are configured to be selectively pivotable to each other via the first pivoting device. A ratio of the first length to the second length is in a range between 1.1 and 6.

Abstract: A semiconductor device includes a substrate. Semiconductor layers are stacked one above another over the substrate. A gate structure wraps around each of the semiconductor layers. Epitaxial layers are over the substrate and in contact with opposite ends of a bottommost one of the semiconductor layers. Source/drain epitaxial structures are over and in contact with the epitaxial layers, respectively. Dielectric structures vertically between the epitaxial layers and the respective source/drain epitaxial structures, respectively.

Abstract: A composition for oral damage mitigation, use thereof, and manufacturing method thereof are disclosed. The composition includes mitochondria and a biocompatible carrier. The composition can mitigate, repair, ameliorate, or treat oral damage and can be expected to be a composition or medicament that is able to mitigate, repair, ameliorate, or treat periodontal diseases or oral cancers while having both safety and effectiveness.

Abstract: Operations in fabricating a Fin FET include providing a substrate having a fin structure, where an upper portion of the fin structure has a first fin surface profile. An isolation region is formed on the substrate and in contact with the fin structure. A portion of the isolation region is recessed by an etch process to form a recessed portion and to expose the upper portion of the fin structure, where the recessed portion has a first isolation surface profile. A thermal hydrogen treatment is applied to the fin structure and the recessed portion. A gate dielectric layer is formed with a substantially uniform thickness over the fin structure, where the recessed portion is adjusted from the first isolation surface profile to a second isolation surface profile and the fin structure is adjusted from the first fin surface profile to a second fin surface profile, by the thermal hydrogen treatment.

Abstract: In some embodiments, the present disclosure relates to an integrated circuit device. A transistor structure includes a gate electrode separated from a substrate by a gate dielectric and a pair of source/drain regions disposed within the substrate on opposite sides of the gate electrode. A lower conductive plug is disposed through a lower inter-layer dielectric (ILD) layer and contacting a first source/drain region. A capping layer is disposed directly on the lower conductive plug. An upper inter-layer dielectric (ILD) layer is disposed over the capping layer and the lower ILD layer. An upper conductive plug is disposed through the upper ILD layer and directly on the capping layer.

Abstract: A scraper includes a cover, a first clamping member, a second clamping member, and a locking device. The cover has a connection portion and an insertion protrusion. The first clamping member has a first through groove, and the second clamping member has a second through groove. The locking device has a sliding portion slidably arranged in the first through groove and the second through groove. The connection portion of the cover is detachably connected to the side of the first clamping member opposite to the second clamping member, and the insertion protrusion inserts through the first through groove and the second through groove and is detachably coupled with the second clamping member.

Abstract: A pixel structure includes a pixel driving circuit, a first insulating layer, a first conductive pattern, a second insulating layer, a second conductive pattern, multiple bonding pads and a light-emitting element. The first conductive pattern is disposed on the first insulating layer and is electrically connected to the pixel driving circuit through a first contact window of the first insulation layer. The second conductive pattern is disposed on the second insulating layer and is electrically connected to the first conductive pattern through a second contact window of the second insulation layer. In a top view of the pixel structure, the first contact window and the second contact window have a first spacing in a first direction, and the first contact window and the second contact window have a second spacing in a second direction.

Abstract: A magnetic lock for charging an electric vehicle and an operating method of the magnetic lock are provided. The magnetic lock includes a voltage conversion circuit, a detection circuit, and a magnetic attraction circuit. The voltage conversion circuit receives a first voltage from a power supplying connector and converts the first voltage into a second voltage and a third voltage. The detection circuit is driven according to the second voltage, provides a first control signal according to a first status signal from the power supplying connector, and provides a second control signal according to the second status signal from the power supplying connector. The magnetic attraction circuit uses the third voltage to generate a magnetic attraction force according to the first control signal. The power supplying connector is fixed to a charging port of the electric vehicle by the magnetic attraction force.

Abstract: An intrusion detection method includes steps of obtaining a current detection box and a historical detection box of a target in an input image; determining whether the current detection box has an intersection with a security line or a security area; determining that the target has an intrusion behavior if the current detection box has the intersection with the security line or the security area; and determining a direction of intrusion of the target according to the current detection box and the historical detection box.

Abstract: The present invention includes novel molecules and methods of using an amphiphilic kanamycin molecule having substitutions at the O-4?, O-6?, or O-4? and O-6? positions having reduced antimicrobial activity for targeting Connexin Hemichannels.

Abstract: An electronic device includes a flexible substrate and a conductive wire structure. The conductive wire structure is disposed on the flexible substrate and includes a first segment, a second segment, a third segment, a fourth segment, a first joint portion, a second joint portion, a third joint portion and a fourth joint portion. A first opening is surrounded by the first segment, the second segment, the first joint portion and the second joint portion. A second opening is surrounded by the third segment, the fourth segment, the third joint portion and the fourth joint portion. Along a first direction, a ratio of a first width sum of widths of the first segment, the second segment, the third segment and the fourth segment to a second width sum of widths of the first joint portion and the third joint portion is in a range from 0.8 to 1.2.

Abstract: A method for efficiently generating a plurality of personalized email strategies and corresponding personalized emails for campaign recipients is disclosed. Multi-dimensional data comprising account data, recipient data, and seller data is received from one or more data sources. The received multi-dimensional data is processed to extract relevant features. A dynamic feature hierarchy is generated using the extracted features. A pre-trained machine learning model is fine-tuned using the dynamic feature hierarchy to generate email strategies, wherein model parameters are adjusted based on the hierarchy during fine-tuning. A plurality of email strategies is generated for each recipient by applying the fine-tuned model's recommendations. An email strategy is selected from the plurality of strategies based on one or more factors. A personalized email corresponding to the selected email strategy is generated. The personalized email and the selected email strategy used to generate it are displayed to a user.

Abstract: The present disclosure provides a semiconductor structure and a system for manufacturing the semiconductor structure. The system includes a fabrication equipment, configured to perform operations to form a layer on a wafer; an exposure equipment, configured to perform patterning operations to form a pattern of the layer; and an alignment equipment, configured to detect an alignment of two overlay marks at different elevations on the wafer. The alignment equipment includes a stage, configured to support the wafer; an optical device, configured to emit a radiation to excite a photoluminescent material of one of the two overlay marks; an optical filter, configured to receive and filter a radiation emitted from the photoluminescent material; and an optical detector, configured to convert an optical signal filtered by the optical filter to an electrical signal.

Abstract: A magnetic core structure is disclosed. The magnetic core structure includes a bottom plate, two magnetic columns, a sidewall and a cover plate. The two magnetic columns are disposed on the bottom plate. The sidewall has a first wall portion, a second wall portion and a third wall portion. The first wall portion and the second wall portion are disposed on two sides of the bottom plate along an axial direction of the two magnetic columns. The third wall portion is disposed between the two magnetic columns, and the third wall portion is connected to the first wall portion and the second wall portion, respectively. The cover plate is disposed on the sidewall and covers the two magnetic columns. Another magnetic core structure is also provided.