Abstract: A stacked package structure and a method for forming the same, are provided. The stacked package structure includes: a first substrate; a chip stacked structure on an upper surface of the first substrate, the chip stacked structure includes first semiconductor chips stacked in sequence along a direction perpendicular to the upper surface; a first functional surface of a first portion of a first flexible circuit board is mounted on a top surface of the chip stacked structure, and a second portion of the first flexible circuit board is bent to a side surface of the chip stacked structure; a part of a third functional surface of a second flexible circuit board is mounted on a second functional surface of the second portion of the first flexible circuit board; and second semiconductor chips are mounted on a fourth functional surface of the second flexible circuit board.

Abstract: A method for calibrating the reception of a phased array antenna with a built-in local oscillator and an electronic device, are provided. The method includes: constructing and configuring a test system, where a transmitting antenna is located on the central axis of a phased array antenna, and the transmitting antenna is connected to a signal source; dividing the phased array antenna into a plurality of centrally symmetric ring areas according to the central axis of the phased array antenna, and each ring area has one or more centrally symmetric sub-units, and each sub-unit includes a plurality of antenna channels of the same number; and receiving signals using the phased array antenna and transmitting signals with the transmitting antenna, and performing amplitude and phase calibrations between antenna channels within sub-units of the ring areas, between sub-units of the ring areas, and between different ring areas.

Abstract: A method for calibrating the transmission of a phased array antenna with a built-in local oscillator and an electronic device are provided. The method includes: constructing and configuring a test system, where a receiving antenna is located on a central axis of the phased array antenna; dividing the phased array antenna according to a layout of the phased array antenna, where the layout of the phased array antenna is divided into centrally symmetric ring areas, and each of the ring areas includes one or more centrally symmetric sub-units, and each of the sub-units includes a same number of antenna channels; and transmitting signals using the phased array antenna and receiving signals by the receiving antenna, and performing amplitude and phase calibration between the antenna channels within the sub-units of the ring areas, between the sub-units of the ring areas, and between the ring areas.

Abstract: A stacked package structure and a method for forming the same are provided. The stacked package structure includes: a first substrate including an upper surface and a lower surface; a chip stacked structure located on the upper surface of the first substrate, where the chip stacked structure includes first semiconductor chips; and a flexible circuit board mounted on a side surface of the chip stacked structure, where the flexible circuit board includes a first functional surface and a second functional surface; the first functional surface is close to the corresponding side surface of the chip stacked structure; the second functional surface is away from the corresponding side surface of the chip stacked structure; and second semiconductor chips are mounted on the second functional surface of the flexible circuit board.

Abstract: A data processing system includes: a processor; a memory containing programming instructions for execution by the processor; and a network interface for communicating with an Artificial Intelligence (AI) engine. The programming instructions include an application for generating written content, the application having a function to generate and submit a structured query regarding the written content to the AI engine to generate feedback on an assessed quality of the written content, the structured query structured to prompt for feedback in a variety of specified categories for the written content. The application further includes a user interface to display the feedback on the written content and provide an option to a user to implement the feedback to revise the written content.

Abstract: The present invention relates to the technical field of chip package, in particular to a semiconductor package injection molding mold, a semiconductor package injection molding device and a semiconductor package injection molding method. The semiconductor package injection molding mold includes a bottom mold and a top mold. The upper surface of the bottom mold is fitted with the lower surface of a substrate to form a semiconductor package structure; the top mold is matched with the bottom mold; the top mold has a cavity; the cavity is oriented toward the upper surface of the substrate and is used to accommodate a plastic package layer formed on the upper surface of the substrate; through holes that penetrate through the bottom mold are formed at positions corresponding to the substrate in the bottom mold; and the through holes are connected with an external pressure source.

Abstract: Provided is a display device. The display device includes: a first functional layer, a display panel, and a second functional layer. The display panel is disposed on the first functional layer and is defined with a first display region and a second display region. The second display region includes a light transmitting region. The second functional layer is disposed on the display panel. The display device further includes a first film layer, provided with a plurality of opaque or translucent particles arranged irregularly at a position corresponding to the light transmitting region of the second display region. The display device can alleviate the diffraction problem of the camera under panel (CUP) technology of a full screen.

Abstract: A package structure and a forming method thereof are disclosed. In the package structure, two adjacent first chips arranged in a row direction are interconnected through a first wiring, two adjacent first chips arranged in a column direction are interconnected through a second wiring, and lengths of the first wiring and the second wiring are the same, so that two adjacent first chips can be interconnected in both the row direction and the column direction, thereby increasing connection channels and enhancing the bandwidth. In addition, since the lengths of the first wiring and the second wiring are the same, rates for various same or different communications or data transmissions between the two adjacent first chips arranged in rows and columns can remain consistent or vary slightly in the row direction and the column direction, thereby improving performance of the package structure.

Abstract: A stacked package structure and a forming method thereof are disclosed. The forming method includes mounting a first active surface of a first chip facing down on an upper surface of a substrate; forming a chip stacking structure on a first back surface of the first chip, including a plurality of second chips stacked sequentially in a vertical direction; performing a mass reflow process to solder the micro bumps of the upper second chip to the second connection terminals of the adjacent lower second chip; and performing a molded underfill process to form a molding layer filled between the upper and lower second chips and between the lower second chip and the first chip. This improves packaging efficiency, prevents the micro bumps from collapsing, and ensures evenness during stacking.

Abstract: A debris cleaning mechanism and a cleaning device, comprising a driving mechanism, a transmission mechanism, and a debris scraping mechanism. The transmission mechanism comprises a gear box, and the gear box is connected to the driving mechanism by means of an input shaft and connected to the debris scraping mechanism by means of an output shaft; the debris scraping mechanism comprises a debris scraping body, and the output shaft is in transmission connection with the debris scraping body to drive the debris scraping body to move; the debris scraping body is provided with a first and/or a second debris scraping strip. The cleaning device comprises a debris barrel, a debris barrel cover, the debris cleaning mechanism, and a cover opening mechanism; when a rack of the transmission mechanism moves to a preset position along the axial direction of the debris barrel, the cover opening mechanism is pushed to move.

Abstract: Disclosed are a magnetic coupling-based inter-chip wireless communication interface structure and method for three-dimensional stacked chips. The interface structure includes a master chip and at least one slave chip, wherein the master chip and all the slave chips are vertically stacked; the slave chip includes a clock receiving module, a data transmitting module, and a data receiving module; the master chip includes a clock transmitting module, a data transmitting module, and a data receiving module. The solution herein makes use of the magnetic coupling relationship between on-chip spiral inductors of different chips in a vertical direction to simultaneously transmit data and clock signals. The communication method herein modulates each bit of digital signal into a differential bi-directional non-return-to-zero pulse train and performs decision and data parsing at the receiving end by a high-speed dynamic comparator.

Abstract: A drying module includes a moisture absorption and removal assembly. The moisture absorption and removal assembly includes a moisture absorption rotary wheel component, a rotary wheel shell, and a rotary wheel driving mechanism for driving the moisture absorption rotary wheel component to rotate. The moisture absorption rotary wheel component is rotatably arranged inside the rotary wheel shell and includes an outer peripheral shell member. A power input member configured to introduce power from the rotary wheel driving mechanism for rotating the moisture absorption rotary wheel component is arranged at an outer peripheral edge of the outer peripheral shell member. The power input member is driven by the rotary wheel driving mechanism at an outer peripheral edge of the power input member.

Abstract: A cleaning device and a cleaning system. The cleaning device includes: a cleaning base provided with a cleaning roller, the cleaning base being configured to move on a surface to be cleaned so that the cleaning roller cleans the surface to be cleaned; a clear water tank configured to contain clear water; a detergent box configured to contain a detergent; and a dual-head pump configured to pump a first liquid and a second liquid and including: a driving motor; a first pump body mounted on a first side of the driving motor and configured to pump the first liquid; and a second pump body mounted on a second side of the driving motor and configured to pump the second liquid, the first side and the second side being arranged opposite to each other.

Abstract: A surface cleaning device includes: a liquid distributor, configured to distribute a cleaning liquid to a cleaning component or a surface to be cleaned; and a wastewater tank, configured to collect wastewater recovered from the surface to be cleaned, where the wastewater tank includes: a wastewater inlet, configured to enable the wastewater to enter the wastewater tank; and a first opening, configured to enable, in response to a self-cleaning instruction of the wastewater tank, airflow to enter the wastewater tank through the first opening, thereby causing oscillation of the wastewater in the wastewater tank, and achieving self-cleaning of the wastewater tank under the oscillation of the wastewater.

Abstract: The present invention provides a packaging structure and a manufacturing method thereof. The packaging structure includes a first substrate, a first chip, a second chip, a first heat conductor and a second heat conductor, wherein the first substrate includes a cavity; the first chip is embedded in the cavity and includes a first connecting surface and a first heat-conducting surface that face away from each other; the second chip is disposed on a side of the first connecting surface and electrically connected to the first chip, a side of the second chip distal from the first chip includes a second heat-conducting surface on a side; and the first heat conductor is connected to the first heat-conducting surface, and the second heat conductor is connected to the second heat-conducting surface. The first substrate includes a third connecting surface that is flush with the first connecting surface.

Abstract: The present disclosure relates to a method, device, and computer program product for updating an application programming interface (API). The method includes identifying a code segment of a first version from the API. The method further includes converting the code segment of the first version to a first abstract syntax tree (AST) according to a first conversion strategy. The method further includes generating a second AST according to the first AST. The method further includes converting the second AST to a code segment of a second version according to a second conversion strategy. In scenarios where an API is automatically updated, the method according to the present disclosure can improve the accuracy of updating the API, thereby improving the efficiency of updating.