Patents by Inventor Cheng Yang

Cheng Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12657198
    Abstract: A data processing system includes: a processor; a memory containing programming instructions for execution by the processor; and a network interface for communicating with an Artificial Intelligence (AI) engine. The programming instructions include an application for generating written content, the application having a function to generate and submit a structured query regarding the written content to the AI engine to generate feedback on an assessed quality of the written content, the structured query structured to prompt for feedback in a variety of specified categories for the written content. The application further includes a user interface to display the feedback on the written content and provide an option to a user to implement the feedback to revise the written content.
    Type: Grant
    Filed: December 27, 2024
    Date of Patent: June 16, 2026
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Aleksey Aleksandrovich Sokolov, Utkarsh Garg, Siqing Chen, Warren Anthony Aldred, Saket Kumar, Cheng Yang, Bhavuk Jain, Mahaveer Bhavarlal Kothari, Alyssa Rachel Mayo, Tashfeen Ahmed, Zhang Li, Olivier Michel Nicolas Gauthier, Christine Lauren Mayer, Jesse Alexander Freitas
  • Patent number: 12605868
    Abstract: The present invention relates to the technical field of chip package, in particular to a semiconductor package injection molding mold, a semiconductor package injection molding device and a semiconductor package injection molding method. The semiconductor package injection molding mold includes a bottom mold and a top mold. The upper surface of the bottom mold is fitted with the lower surface of a substrate to form a semiconductor package structure; the top mold is matched with the bottom mold; the top mold has a cavity; the cavity is oriented toward the upper surface of the substrate and is used to accommodate a plastic package layer formed on the upper surface of the substrate; through holes that penetrate through the bottom mold are formed at positions corresponding to the substrate in the bottom mold; and the through holes are connected with an external pressure source.
    Type: Grant
    Filed: October 30, 2023
    Date of Patent: April 21, 2026
    Assignee: JCET Management Co., Ltd.
    Inventor: Cheng Yang
  • Patent number: 12610696
    Abstract: Provided is a display device. The display device includes: a first functional layer, a display panel, and a second functional layer. The display panel is disposed on the first functional layer and is defined with a first display region and a second display region. The second display region includes a light transmitting region. The second functional layer is disposed on the display panel. The display device further includes a first film layer, provided with a plurality of opaque or translucent particles arranged irregularly at a position corresponding to the light transmitting region of the second display region. The display device can alleviate the diffraction problem of the camera under panel (CUP) technology of a full screen.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: April 21, 2026
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Cheng Yang, Junpu Tang
  • Publication number: 20260090420
    Abstract: A package structure and a forming method thereof are disclosed. In the package structure, two adjacent first chips arranged in a row direction are interconnected through a first wiring, two adjacent first chips arranged in a column direction are interconnected through a second wiring, and lengths of the first wiring and the second wiring are the same, so that two adjacent first chips can be interconnected in both the row direction and the column direction, thereby increasing connection channels and enhancing the bandwidth. In addition, since the lengths of the first wiring and the second wiring are the same, rates for various same or different communications or data transmissions between the two adjacent first chips arranged in rows and columns can remain consistent or vary slightly in the row direction and the column direction, thereby improving performance of the package structure.
    Type: Application
    Filed: August 12, 2025
    Publication date: March 26, 2026
    Applicant: JCET Management Co., Ltd.
    Inventor: Cheng Yang
  • Publication number: 20260082977
    Abstract: A stacked package structure and a forming method thereof are disclosed. The forming method includes mounting a first active surface of a first chip facing down on an upper surface of a substrate; forming a chip stacking structure on a first back surface of the first chip, including a plurality of second chips stacked sequentially in a vertical direction; performing a mass reflow process to solder the micro bumps of the upper second chip to the second connection terminals of the adjacent lower second chip; and performing a molded underfill process to form a molding layer filled between the upper and lower second chips and between the lower second chip and the first chip. This improves packaging efficiency, prevents the micro bumps from collapsing, and ensures evenness during stacking.
    Type: Application
    Filed: August 27, 2025
    Publication date: March 19, 2026
    Applicant: JCET GROUP CO., LTD.
    Inventor: Cheng Yang
  • Patent number: 12557954
    Abstract: A debris cleaning mechanism and a cleaning device, comprising a driving mechanism, a transmission mechanism, and a debris scraping mechanism. The transmission mechanism comprises a gear box, and the gear box is connected to the driving mechanism by means of an input shaft and connected to the debris scraping mechanism by means of an output shaft; the debris scraping mechanism comprises a debris scraping body, and the output shaft is in transmission connection with the debris scraping body to drive the debris scraping body to move; the debris scraping body is provided with a first and/or a second debris scraping strip. The cleaning device comprises a debris barrel, a debris barrel cover, the debris cleaning mechanism, and a cover opening mechanism; when a rack of the transmission mechanism moves to a preset position along the axial direction of the debris barrel, the cover opening mechanism is pushed to move.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: February 24, 2026
    Assignee: Beijing Roborock Technology Co., Ltd.
    Inventors: Xing Li, Zhimin Yang, Yungen Qin, Cheng Yang, Guangzhong Luo, Ping Luo, Liang Qiao
  • Patent number: 12562772
    Abstract: Disclosed are a magnetic coupling-based inter-chip wireless communication interface structure and method for three-dimensional stacked chips. The interface structure includes a master chip and at least one slave chip, wherein the master chip and all the slave chips are vertically stacked; the slave chip includes a clock receiving module, a data transmitting module, and a data receiving module; the master chip includes a clock transmitting module, a data transmitting module, and a data receiving module. The solution herein makes use of the magnetic coupling relationship between on-chip spiral inductors of different chips in a vertical direction to simultaneously transmit data and clock signals. The communication method herein modulates each bit of digital signal into a differential bi-directional non-return-to-zero pulse train and performs decision and data parsing at the receiving end by a high-speed dynamic comparator.
    Type: Grant
    Filed: December 22, 2023
    Date of Patent: February 24, 2026
    Assignees: ZHEJIANG UNIVERSITY, JCET GROUP CO., LTD.
    Inventors: Xiaolei Zhu, Chonghui Sun, Kun Yang, Rushuo Tao, Cheng Yang
  • Publication number: 20260035854
    Abstract: A drying module includes a moisture absorption and removal assembly. The moisture absorption and removal assembly includes a moisture absorption rotary wheel component, a rotary wheel shell, and a rotary wheel driving mechanism for driving the moisture absorption rotary wheel component to rotate. The moisture absorption rotary wheel component is rotatably arranged inside the rotary wheel shell and includes an outer peripheral shell member. A power input member configured to introduce power from the rotary wheel driving mechanism for rotating the moisture absorption rotary wheel component is arranged at an outer peripheral edge of the outer peripheral shell member. The power input member is driven by the rotary wheel driving mechanism at an outer peripheral edge of the power input member.
    Type: Application
    Filed: August 24, 2023
    Publication date: February 5, 2026
    Inventors: Xing Li, Chuanlin Duan, Zhimin Yang, Tong Liu, Cheng Yang, Hang Qi, Gang Quan
  • Publication number: 20260033695
    Abstract: A cleaning device and a cleaning system. The cleaning device includes: a cleaning base provided with a cleaning roller, the cleaning base being configured to move on a surface to be cleaned so that the cleaning roller cleans the surface to be cleaned; a clear water tank configured to contain clear water; a detergent box configured to contain a detergent; and a dual-head pump configured to pump a first liquid and a second liquid and including: a driving motor; a first pump body mounted on a first side of the driving motor and configured to pump the first liquid; and a second pump body mounted on a second side of the driving motor and configured to pump the second liquid, the first side and the second side being arranged opposite to each other.
    Type: Application
    Filed: March 29, 2023
    Publication date: February 5, 2026
    Applicant: Beijing Roborock Technology Co., Ltd.
    Inventors: Xing LI, Yongfei ZHOU, Cheng YANG
  • Publication number: 20260013695
    Abstract: A surface cleaning device includes: a liquid distributor, configured to distribute a cleaning liquid to a cleaning component or a surface to be cleaned; and a wastewater tank, configured to collect wastewater recovered from the surface to be cleaned, where the wastewater tank includes: a wastewater inlet, configured to enable the wastewater to enter the wastewater tank; and a first opening, configured to enable, in response to a self-cleaning instruction of the wastewater tank, airflow to enter the wastewater tank through the first opening, thereby causing oscillation of the wastewater in the wastewater tank, and achieving self-cleaning of the wastewater tank under the oscillation of the wastewater.
    Type: Application
    Filed: September 23, 2025
    Publication date: January 15, 2026
    Inventors: Yongfei ZHOU, Guangzhong LUO, Cheng YANG, Baohuan QIN
  • Patent number: 12519022
    Abstract: The present invention provides a packaging structure and a manufacturing method thereof. The packaging structure includes a first substrate, a first chip, a second chip, a first heat conductor and a second heat conductor, wherein the first substrate includes a cavity; the first chip is embedded in the cavity and includes a first connecting surface and a first heat-conducting surface that face away from each other; the second chip is disposed on a side of the first connecting surface and electrically connected to the first chip, a side of the second chip distal from the first chip includes a second heat-conducting surface on a side; and the first heat conductor is connected to the first heat-conducting surface, and the second heat conductor is connected to the second heat-conducting surface. The first substrate includes a third connecting surface that is flush with the first connecting surface.
    Type: Grant
    Filed: December 1, 2022
    Date of Patent: January 6, 2026
    Assignee: JCET MANAGEMENT CO., LTD.
    Inventor: Cheng Yang
  • Publication number: 20250377881
    Abstract: The present disclosure relates to a method, device, and computer program product for updating an application programming interface (API). The method includes identifying a code segment of a first version from the API. The method further includes converting the code segment of the first version to a first abstract syntax tree (AST) according to a first conversion strategy. The method further includes generating a second AST according to the first AST. The method further includes converting the second AST to a code segment of a second version according to a second conversion strategy. In scenarios where an API is automatically updated, the method according to the present disclosure can improve the accuracy of updating the API, thereby improving the efficiency of updating.
    Type: Application
    Filed: July 30, 2024
    Publication date: December 11, 2025
    Inventors: Lian LI, Ren WANG, Cheng YANG, Yuhong NIE, Weiyang LIU, Yun ZHANG
  • Publication number: 20250375860
    Abstract: A method is provided for determining a torque value of a torque applied by an electronic torque wrench that includes a handle, a square drive and a strain gauge. The method includes measuring an angular velocity and a normal acceleration of the handle as the handle is rotated relative to the square drive, and finding a length of a moment arm from the square drive to the handle based on the angular velocity and the normal acceleration. The method includes measuring a bending moment of a rotational force at the strain gauge that is located at a known distance from the handle, the bending moment measured as the rotational force is applied at the handle that produces the torque at the square drive. And the torque value is determined based on the bending moment, the length of the moment arm and the known distance.
    Type: Application
    Filed: September 1, 2022
    Publication date: December 11, 2025
    Inventors: Cheng Yang, Henglian Luo, Zheng Xu
  • Patent number: 12416591
    Abstract: A temperature-controllable test device for cable monitoring includes a vertical plate. The lower end of the vertical plate is secured to a base plate. A second motor is mounted on the rear side of the vertical plate. The output shaft end of the second motor extends to the front side of the vertical plate. A mounting plate is secured to the output shaft end of the second motor. A stretching mechanism is disposed inside the mounting plate and configured to stretch a cable. The stretching mechanism includes a transmission cavity formed inside the mounting plate. A first bidirectional reciprocating screw rod is rotatably connected between the left inner wall of the transmission cavity and the right inner wall of the transmission cavity. A turbine is mounted in the middle of the first bidirectional reciprocating screw rod.
    Type: Grant
    Filed: August 1, 2024
    Date of Patent: September 16, 2025
    Assignee: DONGGUAN POWER BUREAU OF GUANGDONG POWER GRID CO., LTD.
    Inventors: Fang Liu, Xiliang Dai, Cheng Yang, Jinning Liu, Guanke Liu, Jianrong Zhang, Jinkun Shan, Shaobing Cheng, Min Xia, Hanbiao Yin, Haoer Wu, Qingkeng Huang, Huiyue Mao, Guohua Chen, Yaoyun Liu
  • Publication number: 20250279105
    Abstract: Aspects of the disclosed technology include computer-implemented systems and methods for automatically separating sounds associated with different sources in media such as video. More particularly, a machine-learned system is configured to separate sounds in media and provide an interface for users to easily manipulate the separated sounds during playback of the media. The system can obtain media, provide decoded audio from the media to a machine-learned audio separation model, generate a plurality of separated sound components from the decoded audio using the machine-learned audio separation model, provide decoded video from the media and the plurality of separated sound components to a machine-learned audio classification model, and generate a class label for each of the plurality of separated sound components using the machine-learned audio classification model.
    Type: Application
    Filed: March 3, 2025
    Publication date: September 4, 2025
    Inventors: Cheng Yang, Xing Li, Pascal Tom Getreuer, Jianing Wei
  • Patent number: D1097066
    Type: Grant
    Filed: October 17, 2024
    Date of Patent: October 7, 2025
    Inventors: Xiaomin Luo, Shaojie Shi, Cheng Yang, Weihao Zheng
  • Patent number: D1098365
    Type: Grant
    Filed: October 17, 2024
    Date of Patent: October 14, 2025
    Inventors: Xiaomin Luo, Shaojie Shi, Cheng Yang, Weihao Zheng
  • Patent number: D1105802
    Type: Grant
    Filed: January 18, 2024
    Date of Patent: December 16, 2025
    Assignee: YY VERTICAL
    Inventor: Cheng Yang
  • Patent number: D1108166
    Type: Grant
    Filed: August 23, 2023
    Date of Patent: January 6, 2026
    Inventor: Cheng Yang
  • Mug
    Patent number: D1129993
    Type: Grant
    Filed: May 6, 2025
    Date of Patent: June 16, 2026
    Assignee: YY VERTICAL
    Inventor: Cheng Yang