Abstract: The present invention provides a chip package structure and the manufacturing method thereof, which affords higher heat dissipation efficiency and is suitable to fabricate the stack type package structure with a higher integration. The chip package structure comprises a carrier, at least a chip, a heat sink and a mold compound. The chip is disposed on the carrier, while the bonding pads of the chip are electrically connected to the leads of the carrier. The heat sink is disposed over the chip and includes at least a body and a plurality of connecting portions. The connecting portions are disposed around a periphery of the body and are electrically connected to the leads. By using a specially designed heat sink, the chip package structure can afford better heat dissipation and be suitable to form stack type package structures.

Abstract: The present invention relates to a method for stacking BGA packages. At first, a first BGA package is provided. The first BGA package includes a first substrate, at least one first chip and a plurality of first connecting balls. The first substrate has a first upper surface and a first bottom surface. The first chip is disposed on the first upper surface. The first connecting balls are disposed on a plurality of first connecting pads of the first upper surface. Then, a second BGA package is provided. The second BGA package includes a second substrate, at least one second chip and a plurality of second connecting balls. The second substrate has a second upper surface and a second bottom surface. The second connecting balls are disposed on a plurality of second connecting pads of the second bottom surface. The second BGA package is stacked on the first BGA package for the second connecting balls to contact the corresponding first connecting balls.

Abstract: A method of forwarding traffic in a connectionless communications network from a source location to a destination location. The traffic is associated with a predetermined category of transmission service. The method involves assigning a principal path to the traffic. The principal path operatively connects the source and destination locations. The principal path is determined on the basis that transmission of the traffic from the source location to the destination location does not exceed a specified maximum delay for transmission. An alternate path is also assigned to the traffic. The alternate path is selected on the basis that the alternate path does not exceed a specified maximum delay for involving the alternate path in order to forward the traffic along the alternate path in the event the principal path is unavailable for forwarding the traffic.

Abstract: A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.

Abstract: A process for fabricating a multi-chip package module is disclosed. A substrate, at least a first chip and at least a second chip are provided. The backside of the first chip is attached to a die pad on a substrate. A wire-bonding operation is carried out to electrically connect the first chip and the substrate through conductive wires. A plurality of bumps is bonded to the second chip so that one end of each bump is bonded to a contact on the second chip. Thereafter, the other end of each bump is bonded to a contact on the substrate so that the second chip and the substrate are physically and electrically connected together. Finally, an encapsulation process is performed to form a packaging material enclosing the first chip, the second chip, the conductive wires, the bumps and the substrate.

Abstract: Location update messages for a mobile node can be made interceptible by routers which form tunnels for communication with the mobile node. A correspondent agent intercepts a Binding Update with a Router Alert and binds the address of the mobile node with a care of address for the mobile node provided in the Binding Update. The correspondent agent will thereafter intercept messages from its correspondent host destined for the mobile node and redirect them to the care of address thereby bypassing the home agent of the mobile node. A border router intercepts a Registration Request with Router Alert and binds the address of the mobile node with a care of address for the mobile node. If a binding existed previously, then the border router terminates the Request. Otherwise, the Request is forwarded to the home agent of the mobile node after substituting its own address for the care of address.

Abstract: The present invention provides a chip package structure and the manufacturing method thereof, which affords higher heat dissipation efficiency and is suitable to fabricate the stack type package structure with a higher integration. The chip package structure comprises a carrier, at least a chip, a heat sink and a mold compound. The chip is disposed on the carrier, while the bonding pads of the chip are electrically connected to the leads of the carrier. The heat sink is disposed over the chip and includes at least a body and a plurality of connecting portions. The connecting portions are disposed around a periphery of the body and are electrically connected to the leads. By using a specially designed heat sink, the chip package structure can afford better heat dissipation and be suitable to form stack type package structures.

Abstract: A Stackable package module comprises a plurality of semiconductor devices in stack. One of the semiconductor devices includes a chip with an active surface and a corresponding back surface, a plurality of solder bumps and a plurality of stud bumps. The solder bumps are formed on the active surface. The stud bumps are formed on the back surface. Each stud bump has a bump body and a protruding trail by wire-bonding and cutting. Bumps of another package are bonded on the stub bumps for replacing known intermediate substrate in conventional stacked package module.

Abstract: A method for avoiding loops from forming when setting up label switched paths is provided. The method uses a Label Splicing Message is followed by an Acknowledgment message to determine if loops are formed in the process of joining a new node or subtree to a multicast MPLS tree. By verifying that the path towards the root of the MPLS tree is loop-free during the construction of the tree, this method complements the loop detection mechanism provided by the label switched protocol (LDP).

Abstract: A flip chip package mainly comprises a chip, a leadless lead frame. The leadless lead frame has a die paddle and a plurality of leads. The active surface of the chip has a plurality of bonding pads formed thereon. Besides, a plurality of bumps formed on the bonding pads are electrically connected to the chip, the leads and the die paddle. Therein, the die paddle electrically connected to the chip via the bumps not only prevents the chip from being dislocated but also provides another grounding and heat transmission paths to enhance the electrical, thermal and mechanical performance of the flip chip package. Similarly, the bumps formed on the bonding pads of the chip are electrically connected to the leads so as to fix the chip to the lead frame more securely.

Abstract: The present invention provides an OAM tool that enables a network operator to verify the path that an Ethernet frame traverses through bridges in a bridged Ethernet LAN. Verification is performed using a mechanism to ping the path a frame will traverse. An Ethernet path verification message (Eping message) is sent in the data path, the message having a new EtherType that identifies it as a path verification message. The method verifies the data path that frames actually take, rather than determining the data path that frames should take as is done by prior art methods that utilize the control plane for path determination.

Abstract: A method for detecting a routing loop when repairing a bidirectional multicast distribution tree is disclosed. According to the method, a splice message is launched from an originating node attempting to join a bidirectional multicast tree and is sent to a root-node to find out if a routing loop is formed when a node is joining the multicast distribution tree. Depending on the multicast application requirement, when a routing loop is detected during the repairing of a multicast distribution tree, the severed node may abort, or the repair can be deferred until the connection to the root-node is re-established. The loop detection and loop prevention method of the invention may be used as a loop avoidance mechanism with any protocol for repairing a partitioned tree.

Abstract: This invention is applicable to a Virtual Private LAN service built using multiple point-to-point Ethernet services from a network operator, where the bridging and the transport/tunneling of Ethernet frames to a remote site are decoupled. The learning bridge function (including MAC address learning and flooding) is performed at customer equipment CE devices, while the tunneling is performed at provider edge PE nodes. The models described here for this VPN refer to hub redundancy, site-to-site SLA guarantees and address discovery in the case of hybrid connections.

Abstract: The present invention discloses a solution which delivers routing systems with less path setup latency and causes them to be less susceptible to network loading, by providing them the ability to setup diverse paths as a result of specifying network resources to exclude as part of a path setup. The invention proposes an extension to RSVP-TE in the form of a new RSVP-TE object, known as an Exclude Route Object, which will allow, in a path setup request, the specification of a set of abstract nodes and resources to be explicitly excluded from the path. Additionally, the invention introduces a second type of exclusion which is achieved through a modification to the existing Explicit Route Object (ERO) by allowing a node to specify, in a path setup request, the exclusion of certain abstract nodes and resources between a specific pair of abstract nodes within an Explicit Route Object.

Abstract: Methods for provisioning Virtual Local Area Network (VLAN) services are presented. The methods provide for Protocol Data Unit (PDU) transport in service provider and carrier communications networks using tunneling technologies via virtual connections established between Provider Edge equipment (PEs), providing learning bridge functionality at Customer Located Equipment (CLE), while PEs multiplex VLAN traffic onto the tunnels based on VLAN IDentifiers, with each VLAN ID corresponding to a peer remote site participating in a customer VLAN. Advantages are derived from a less restrictive use of VLAN IDs which need only be unique in the access network portion of the service provider's network, Media Access Control ADDRess (MAC ADDRs) tracking is performed only by peer CLEs which store only peer MAC ADDRs, automatic MAC ADDR—VLAN ID associativity determination via the CLE performed learning bridge function, thereby reducing virtual private LAN service provisioning.

Abstract: A process for fabricating a multi-chip package module is disclosed. A substrate, at least a first chip and at least a second chip are provided. The backside of the first chip is attached to a die pad on a substrate. A wire-bonding operation is carried out to electrically connect the first chip and the substrate through conductive wires. A plurality of bumps is bonded to the second chip so that one end of each bump is bonded to a contact on the second chip. Thereafter, the other end of each bump is bonded to a contact on the substrate so that the second chip and the substrate are physically and electrically connected together. Finally, an encapsulation process is performed to form a packaging material enclosing the first chip, the second chip, the conductive wires, the bumps and the substrate.

Abstract: A flip chip package mainly comprises a chip, a leadless lead frame. The leadless lead frame has a die paddle and a plurality of leads. The active surface of the chip has a plurality of bonding pads formed thereon. Besides, a plurality of bumps formed on the bonding pads are electrically connected to the chip, the leads and the die paddle. Therein, the die paddle electrically connected to the chip via the bumps not only prevents the chip from being dislocated but also provides another grounding and heat transmission paths to enhance the electrical, thermal and mechanical performance of the flip chip package. Similarly, the bumps formed on the bonding pads of the chip are electrically connected to the leads so as to fix the chip to the lead frame more securely.

Abstract: A system in package structure includes a first substrate, a first chip, a first heat-dissipating component, a second substrate, and a second chip. In this case, the first chip is formed on and electrically connected to the first substrate, and the first heat-dissipating component having a heat-conducting portion is formed above the first chip. The second chip is formed on and electrically connected to the second substrate. The second substrate is set above the first heat-dissipating component and electrically connected to the first substrate.

Abstract: A method to engineer paths for multicast traffic in an IP network, by directing the control messages to setup multicast trees on engineered paths, is disclosed. The multicast traffic engineering process is separated from the multicast route setup and the resources and the paths for multicast data delivery can be aggregated and independently allocated. Resources are allocated on the same trip when paths are selected and setup, and this prevents data from being forwarded on branches where resources have not been yet allocated. The traffic can be statistically multiplexed enabling the network operators to have control over the topology of the multicast trees and to provide differentiated services in a scalable manner.

Abstract: A semiconductor chip package comprises a semiconductor chip with a metal layer formed over the backside surface thereof and a package body encapsulating the chip in a manner that the metal layer on the backside surface of the chip is exposed from the bottom surface of the package body. The package body has a plurality of protruding potions projecting from the bottom surface of the package body. A plurality of bonding wires each has one end electrically connected to the semiconductor chip and the other end exposed from one of the protruding portions of the package body for electrical coupling to an outside circuit. Preferably, the exposed end of each bonding wire has a longitudinal length at least four times larger than the diameter of the bonding wire. The present invention further provides manufacturing methods of the semiconductor chip package.