Abstract: A semiconductor package with a thermal enhance film mainly comprises a substrate, a semiconductor chip and a thermal enhance film. The semiconductor chip is electrically connected to the substrate and the thermal enhance film is formed on the back surface of the semiconductor chip. Therein, the thermal enhance film can be regarded as a heat transmission layer to transmit the heat to the outside and upgrade the thermal efficiency of the semiconductor package. In addition, the thermal enhance film can be made of a material comprising polymer. For example, the thermal enhance film is a thermally conductive polymer layer and can be regarded as a buffer layer to prevent the active surface of the semiconductor chip from being chipped. Furthermore, a manufacturing method to manufacture the semiconductor package is provided.

Abstract: A method of processing OAM messages by network elements in a communications network is described. Elements in the network are provided with configuration information respecting OAM messages together with connection signaling upon setting up a call through the network. Each network element interprets the OAM messages and derives therefrom configuration information for use in executing an OAM function.

Abstract: A system and method for providing path protection for meshed networks is described. A backup tree having one or more backup paths interfaces with a destination node to provide path protection for one or more working paths. At least a portion of the backup paths share a common route on the backup tree. The common route extends from the destination node to the source nodes and ends at a merging point at which the backup paths diverge.

Abstract: A semiconductor chip package comprises a semiconductor chip with a metal layer formed over the backside surface thereof and a package body encapsulating the chip in a manner that the metal layer on the backside surface of the chip is exposed from the bottom surface of the package body. The package body has a plurality of protruding potions projecting from the bottom surface of the package body. A plurality of bonding wires each has one end electrically connected to the semiconductor chip and the other end exposed from one of the protruding portions of the package body for electrical coupling to an outside circuit. Preferably, the exposed end of each bonding wire has a longitudinal length at least four times larger than the diameter of the bonding wire. The present invention further provides manufacturing methods of the semiconductor chip package.