Patents by Inventor Cheng-Yu (Sean) Lin

Cheng-Yu (Sean) Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230128943
    Abstract: Described are computer implemented methods, a system and a power supply amplifier (PSA) that supports compliance testing of the PSA. The power supplies power to a powered device/information handling system. A voltage of synchronous rectifier (SR) gate is measured and compared to a calculated sense voltage at a sense resistor of the PSA. If the sense voltage is zero, received current of the PSA bypasses a first blocking MOSFET and a second blocking MOSFET for over voltage protection. If the sense voltage is not zero, the received current passes through the first blocking MOSFET.
    Type: Application
    Filed: October 26, 2021
    Publication date: April 27, 2023
    Applicant: Dell Products L.P.
    Inventors: Wei Cheng Yu, Merle Jackson Wood, III, Geroncio Ong Tan, Chi Che Wu
  • Publication number: 20230119864
    Abstract: A measuring method includes the following. An image to be tested of an object to be tested with a first characteristic pattern is formed and is copied to form multiple images to be tested. The multiple images to be tested are superimposed to form a to-be-tested overlapped image which has the multiple first characteristic patterns. A reference image of a reference object with a second characteristic pattern is formed and is copied to form multiple reference images. The multiple reference images are superimposed to form a reference overlapped image which has the multiple second characteristic patterns. The to-be-tested overlapped image and the reference overlapped image are superimposed to generate a virtual moiré image having a moiré pattern different from the multiple first characteristic patterns and the multiple second characteristic patterns.
    Type: Application
    Filed: December 6, 2021
    Publication date: April 20, 2023
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Tai Li, Kao-Chi Lin, Cho-Fan Hsieh, Teng-Chun Wu, Cheng-Yu Peng
  • Patent number: 11632845
    Abstract: In one embodiment, a method for managing a light source of a power adapter includes: determining that the power adapter is coupled to a power supply; causing the light source to be in a first illuminated state indicating that the power adapter is receiving the power from the power supply; determining that a first instance of a threshold period of inactivity has occurred; causing the light source to be in an unilluminated state; determining that the power adapter is communicably coupled to an information handling system; causing the light source to be in a second illuminated state indicating that the power adapter is providing the power to the information handling system; determining that a second instance of the threshold period of inactivity has occurred; and causing the light source to be in the unilluminated state.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: April 18, 2023
    Assignee: Dell Products L.P.
    Inventors: Andrew T. Sultenfuss, Wei-Cheng Yu, Chi-Che Wu, Tsung-Cheng Liao
  • Publication number: 20230115449
    Abstract: A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, antenna elements and a first insulating film. The insulating encapsulant is encapsulating the at least one semiconductor die, the insulating encapsulant has a first surface and a second surface opposite to the first surface. The first redistribution layer is disposed on the first surface of the insulating encapsulant. The second redistribution layer is disposed on the second surface of the insulating encapsulant. The antenna elements are located over the second redistribution layer. The first insulating film is disposed in between the second redistribution layer and the antenna elements, wherein the first insulating film comprises a resin rich region and a filler rich region, the resin rich region is located in between the filler rich region and the second redistribution layer and separating the filler rich region from the second redistribution layer.
    Type: Application
    Filed: December 13, 2022
    Publication date: April 13, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Yu Kuo, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Yi-Yang Lei, Wei-Jie Huang
  • Publication number: 20230111192
    Abstract: Provided is an electronic package providing a circuit structure having auxiliary circuit layers. Further, an electronic component is disposed on the circuit structure and electrically connected to the auxiliary circuit layers. In addition, an encapsulant covers the electronic component, and the circuit structure is disposed on the package substrate having a plurality of main circuit layers, such that the main circuit layers are electrically connected to the auxiliary circuit layers. As such, a number of layers of the auxiliary circuit layers is used to replace a layer number configuration of the main circuit layers.
    Type: Application
    Filed: November 16, 2021
    Publication date: April 13, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yi-Min Fu, Chi-Ching Ho, Cheng-Yu Kang, Yu-Po Wang
  • Patent number: 11626700
    Abstract: The present disclosure provides embodiments of direct current (DC) power connectors and methods to manufacture the same. More specifically, the present disclosure provides a connector plug with improved power capacity and structural rigidity. The connector plug includes an inner body and an outer body coupled to transmit power through the DC power connector, wherein the inner body is concentrically arranged within the outer body, and an insulating barrel that is coupled between the inner body and the outer body to electrically isolate the inner body from the outer body. The inner body and outer body comprise a base metal or metal alloy having an electrical conductivity ranging between 30% International Annealed Copper Standard (IACS) and greater than or equal to 99% IACS.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: April 11, 2023
    Assignee: Dell Products L.P.
    Inventors: Wei Cheng Yu, Andrew Sultenfuss, Chi Che Wu, Tsung-Cheng Liao
  • Publication number: 20230105153
    Abstract: A method for performing communications specification version control of a memory device in predetermined communications architecture with aid of compatibility management, associated apparatus and computer-readable medium are provided.
    Type: Application
    Filed: March 28, 2022
    Publication date: April 6, 2023
    Applicant: Silicon Motion, Inc.
    Inventors: Hong-Ren Fang, Chun-Che Yang, Cheng-Yu Lee, Te-Kai Wang
  • Publication number: 20230104892
    Abstract: A method for performing access management in a memory device, the associated memory device and the controller thereof, and the associated electronic device are provided. The method may include: receiving a host command and a logical address from a host device; performing at least one checking operation to obtain at least one checking result, for determining whether to load a logical-to-physical (L2P) table from the NV memory to a random access memory (RAM) of the memory device, wherein the L2P table includes address mapping information for accessing the target data, and performing the at least one checking operation to obtain at least one checking result includes checking whether a first L2P-table index pointing toward the L2P table and a second L2P-table index sent from the host device are equivalent to each other; and reading the target data from the NV memory, and sending the target data to the host device.
    Type: Application
    Filed: December 9, 2022
    Publication date: April 6, 2023
    Applicant: Silicon Motion, Inc.
    Inventors: Jie-Hao Lee, Cheng-Yu Yu
  • Patent number: 11621368
    Abstract: A magnetic light-emitting structure and fabrication method for manufacturing a magnetic light-emitting element are provided. The fabrication method comprises providing a magnetic metal composite substrate, wherein a second metal layer is respectively disposed on an upper and lower surface of a first metal layer; forming a connecting metal layer, an epitaxial layer and a plurality of electrode unit on top; and performing a complex process, which removes the second metal layer on the lower surface of the first metal layer and part of the first metal layer and performs cutting according to the number of the electrode unit, so as to form a plurality of epitaxial die. Each epitaxial die corresponds to an electrode unit to form a magnetic light-emitting element. The proposed method improves soft magnetic properties of an original substrate and enables dies to reverse spontaneously, thereby used perfectly for industrial mass transfer technology.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: April 4, 2023
    Assignee: Ingentec Corporation
    Inventors: Hsiang-An Feng, Chia-Wei Tu, Cheng-Yu Chung, Ya-Li Chen
  • Publication number: 20230102470
    Abstract: In one embodiment, a method for managing a light source of a power adapter includes: determining that the power adapter is coupled to a power supply; causing the light source to be in a first illuminated state indicating that the power adapter is receiving the power from the power supply; determining that a first instance of a threshold period of inactivity has occurred; causing the light source to be in an unilluminated state; determining that the power adapter is communicably coupled to an information handling system; causing the light source to be in a second illuminated state indicating that the power adapter is providing the power to the information handling system; determining that a second instance of the threshold period of inactivity has occurred; and causing the light source to be in the unilluminated state.
    Type: Application
    Filed: September 17, 2021
    Publication date: March 30, 2023
    Inventors: Andrew T. Sultenfuss, Wei-Cheng Yu, Chi-Che Wu, Tsung-Cheng Liao
  • Publication number: 20230099262
    Abstract: An optical engine module is adapted to a projection apparatus. The optical engine module includes an optical engine housing, a first optical element and a heat dissipation assembly. The optical engine housing has a first vent and a second vent. The first optical element is disposed in the optical engine housing and adjacent to the first vent. The heat dissipation assembly is disposed outside the optical engine housing and adapted to generate airflow flowing through the first vent, the first optical element and the second vent. The heat dissipation assembly includes a fan and an air duct, in which the air duct is connected between the first vent and the fan. A projection apparatus having the optical engine module is also provided.
    Type: Application
    Filed: September 19, 2022
    Publication date: March 30, 2023
    Inventors: CHENG-YU YEH, WEN-YEN CHUNG
  • Publication number: 20230096430
    Abstract: The present invention provides a speech recognition system for teaching assistance, which provides caption service for the hearing impaired. This system includes a speaker and a automatic speech recognition (ASR) classroom server, a listener-typist and a computer, a hearing impaired and a live screen, all are in the same classroom. Connect the ASR classroom server, the computer and the live screen with a local area network. The speaker's audio is sent to the ASR classroom server by a microphone for being converted into text caption, and then the text caption is sent to the live screen of the hearing impaired together with the speaker's audio so that the hearing impaired can read the text caption spoken by the speaker. The text caption can be corrected by the listener-typist to make it completely correct.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 30, 2023
    Inventors: Sin Horng Chen, Yuan Fu Liao, Yih Ru Wang, Shaw Hwa Hwang, Bing Chih Yao, Cheng Yu Yeh, You Shuo Chen, Yao Hsing Chung, Yen Chun Huang, Chi Jung Huang, Li Te Shen, Ning Yun Ku
  • Patent number: 11612529
    Abstract: A collapsible mobility scooter includes a chassis and a transformation actuator. The chassis includes a rear frame a front frame pivotally connected to a rear frame. The front frame is pivoted to the rear frame when the chassis is in a collapsed position. The front frame is pivoted away from the rear frame when the chassis is in an extended position. The transformation actuator includes a rear end connected to the rear frame and a front end connected to the front frame.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: March 28, 2023
    Assignee: HEARTWAY MEDICAL PRODUCTS CO., LTD.
    Inventors: Cheng-Yu Ho, Yung-Ho Ho
  • Patent number: 11611801
    Abstract: The present invention provides a control method applied to an electronic device is disclosed, wherein the electronic device includes a processor and a wireless network module, and the control method includes the steps of: generating a determination result by determining if the wireless network module needs to transmit a packet; and when the determination result indicates that the wireless network module needs to transmit the packet, reducing a frequency of a clock signal used by the processor during a packet transmission.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: March 21, 2023
    Assignee: Realtek Semiconductor Corp.
    Inventors: Zhen-Rong Chen, Cheng-Yu Lee, Chia-Chi Yeh, Ming-Tsung Tsai
  • Publication number: 20230084138
    Abstract: A limb exercise machine includes a first transmission unit and a second transmission unit. A left-hand control member, as well as a right-foot control member, is connected to the first transmission unit. The left-hand control member and the right-foot control member are pulled by the first transmission unit to be moved synchronously. A right-hand control member, as well as a left-foot control member, is connected to the second transmission unit. The right-hand control member and the left-foot control member are pulled by the second transmission unit to be moved synchronously.
    Type: Application
    Filed: September 16, 2021
    Publication date: March 16, 2023
    Inventor: Cheng Yu CHAN
  • Publication number: 20230073044
    Abstract: An optical imaging lens assembly includes at least one optical lens element. The optical lens element includes an anti-reflective coating, and the anti-reflective coating is arranged on at least one surface of the optical lens element. The anti-reflective coating includes a high-low refractive coating and a gradient refractive coating, and the high-low refractive coating is arranged between the optical lens element and the gradient refractive coating. The high-low refractive coating includes at least one high refractive coating layer and at least one low refractive coating layer, which are stacked in alternations. The low refractive coating layer is in contact with the optical lens element. The gradient refractive coating includes a plurality of holes, and the holes away from the optical lens element are relatively larger than the holes close to the optical lens element.
    Type: Application
    Filed: August 18, 2022
    Publication date: March 9, 2023
    Inventors: Wen-Yu TSAI, Chien-Pang CHANG, Cheng-Yu TSAI, Chun-Hung TENG, Kuo-Chiang CHU
  • Publication number: 20230060729
    Abstract: The present disclosure is related to a power module. The power module includes first fasteners and power devices. The power devices are adjacently disposed and locked by the first fasteners. Each of the power devices packages a power electronic therein. Each of the power devices includes a first extending portion. The first extending portion extends from a side of the power device. The first extending portion includes at least one first curved opening for receiving the first fastener. The first curved openings are adjacently disposed to form a first inserting hole. The first fastener passes through the first inserting hole.
    Type: Application
    Filed: August 30, 2022
    Publication date: March 2, 2023
    Inventors: Chia-Chi WU, Lian-An JIAN, Cheng-Yu SHEN, Chun-Hong CHEN, Hung-Hsiao LIU
  • Publication number: 20230068280
    Abstract: An IC device includes first and second cells adjacent each other and over a substrate. The first cell includes a first IO pattern along a first track among a plurality of tracks in a first metal layer, the plurality of tracks elongated along a first axis and spaced from each other along a second axis. The second cell includes a plurality of conductive patterns along corresponding different tracks among the plurality of tracks in the first metal layer, each of the plurality of conductive patterns being an IO pattern of the second cell or a floating conductive pattern. The first metal layer further includes a first connecting pattern along the first track and connects the first IO pattern and a second IO pattern of the second cell. The second IO pattern is one of the plurality of conductive patterns of the second cell and is along the first track.
    Type: Application
    Filed: August 31, 2021
    Publication date: March 2, 2023
    Inventors: Cheng-Yu LIN, Jung-Chan YANG, Hui-Zhong ZHUANG, Sheng-Hsiung CHEN, Kuo-Nan YANG, Chih-Liang CHEN, Lee-Chung LU
  • Patent number: 11591211
    Abstract: A method of manufacturing a semiconductive structure includes receiving a first substrate; disposing an interconnection layer on the first substrate; forming a plurality of conductors over the interconnection layer; filing gaps between the plurality of conductors with a film; forming a barrier layer over the film; removing the barrier layer; and partially removing the film to expose a portion of the interconnection and leave a portion of the interconnection layer covered by the film.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: February 28, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yen-Cheng Liu, Cheng-Yu Hsieh, Shang-Ying Tsai, Kuei-Sung Chang
  • Patent number: D982567
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: April 4, 2023
    Assignee: Nanning FuLian FuGui Precision Industrial Co., Ltd.
    Inventors: Xiao-Min Liang, Zhi-Cheng Yu