Patents by Inventor Cheng-Yu (Sean) Lin

Cheng-Yu (Sean) Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11777191
    Abstract: The present disclosure relates to a wireless communication module. The wireless communication module includes a first antenna layer and a second antenna layer non-coplanar with the second antenna layer. An electromagnetic wave of the first antenna and the second antenna are configured to have far-field interference to each other.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: October 3, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Yu Ho, Sheng-Chi Hsieh, Chih-Pin Hung
  • Publication number: 20230307665
    Abstract: A method of making an interconnect for an electrochemical cell stack includes providing the interconnect, and creep flattening the interconnect prior to placing the interconnect into the electrochemical cell stack.
    Type: Application
    Filed: November 9, 2022
    Publication date: September 28, 2023
    Inventors: Michael GASDA, Sachin PARHAR, Cheng-Yu LIN, Victor FUNG, Amit NAWATHE, Brian THERAULT, Manoj PILLAI
  • Publication number: 20230307404
    Abstract: A package structure includes a die, a first redistribution circuit structure, a first redistribution circuit structure, a second redistribution circuit structure, an enhancement layer, first conductive terminals, and second conductive terminals. The first redistribution circuit structure is disposed on a rear side of the die and electrically coupled to thereto. The second redistribution circuit structure is disposed on an active side of the die and electrically coupled thereto. The enhancement layer is disposed on the first redistribution circuit structure. The first redistribution circuit structure is disposed between the enhancement layer and the die. The first conductive terminals are connected to the first redistribution circuit structure. The first redistribution circuit structure is between the first conductive terminals and the die. The second conductive terminals are connected to the second redistribution circuit structure.
    Type: Application
    Filed: March 28, 2022
    Publication date: September 28, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Yu Kuo, Yu-Ching Lo, Wei-Jie Huang, Ching-Pin Yuan, Yi-Che Chiang, Kris Lipu Chuang, Hsin-Yu Pan, Yi-Yang Lei, Ching-Hua Hsieh, Kuei-Wei Huang
  • Publication number: 20230305200
    Abstract: An optical lens assembly includes at least one optical lens element and at least one optical element. At least one surface of the at least one optical lens element or the at least one optical element includes a low reflection layer, and the low reflection layer includes a rough layer, a nanocrystalline particle and a hydrophobic layer. The nanocrystalline particle is disposed between the rough layer and the hydrophobic layer, and the hydrophobic layer is farther away from the surface of the at least one optical lens element or the at least one optical element than the nanocrystalline particle. A material of the nanocrystalline particle at least includes SiO2.
    Type: Application
    Filed: March 22, 2023
    Publication date: September 28, 2023
    Inventors: Wen-Yu TSAI, Cheng-Yu TSAI, Chun-Hung TENG
  • Publication number: 20230305296
    Abstract: A head-mounted display device includes a body, an eye tracking module and a face gasket. The body has a first lens and a second lens corresponding to both eyes, and also has a first positioning portion. The eye tracking module is assembled to and electrically connected to the body and includes an outer frame, a first camera, a second camera, a first lens frame and a second lens frame. The outer frame has a second positioning portion. The second positioning portion is used for connecting with the first positioning portion, so that the outer frame is positioned on the body. The first lens frame and the second lens frame are movably arranged on the outer frame. The first lens frame is used for connecting the first lens. The second lens frame is used for connecting the second lens. The first camera is arranged on the first lens frame. The second camera is arranged on the second lens frame. The first camera and the second camera are used to shoot both eyes.
    Type: Application
    Filed: July 28, 2022
    Publication date: September 28, 2023
    Applicant: HTC Corporation
    Inventors: Wei-Cheng Hsu, Cheng-Yu Chen, Syuan-He Shih, Chih-Lin Chang
  • Patent number: 11769425
    Abstract: A computer processing system is provided for enhancing video-based language learning. The system includes a video server for storing videos that use one or more languages to be learned. The system further includes a video metadata database for storing translations of sentences uttered in the videos, character profiles of characters appearing in the videos, and mappings between the sentences and a learner profile. The system also includes a learner profile database for storing learner profiles. The system additionally includes a semantic analyzer and matching engine for finding, for at least a given video and a given learner, alternative sentences for and responsive to the translations of the sentences uttered in the given video that conflict with a respective learner profile for the given learner. The computer processing system further includes a presentation system for playing back the given video and providing the alternative sentences to the given learner.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: September 26, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: I-Hsiang Liao, Cheng-Yu Yu, Chih-Yuan Lin, Yu-Ning Hsu
  • Patent number: 11769861
    Abstract: A light-emitting diode packaging structure and a method for fabricating the same is disclosed. A semiconductor wafer is provided, which includes semiconductor substrates. Each semiconductor substrate is penetrated with a first through hole and three second through holes. An insulation layer is formed on the surface of each semiconductor substrate and the inner surfaces of the first through hole, the first sub-through hole, and the second sub-through hole. A patterned electrode layer is formed on the top surface of the semiconductor substrate. A conductive material covering the insulation layer is formed in the first through hole and the second through hole and electrically connected to the patterned electrode layer. Three light-emitting diodes are respectively formed in the first sub-through holes of the second through holes of each semiconductor substrate and respectively electrically connected to the conductive material within the second through holes.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: September 26, 2023
    Assignee: Ingentec Corporation
    Inventors: Ai Sen Liu, Hsiang An Feng, Cheng Yu Chung, Chia Wei Tu, Ya Li Chen
  • Publication number: 20230301016
    Abstract: A stand includes a body, sliding front and rear extending frames, first and second pivotal supports at two sides respectively, and two third pivotal supports at two sides of the sliding lower extending frame. The first, second and third pivotal supports are each capable of pivoting to dispose the body in an acute angle with respect to a supporting surface or rest the body on the supporting surface. The sliding front and rear extending frame each include a cross member and two sliding rods disposed at two ends of the cross member respectively, each sliding rod extending into the body. An angle of the stand with respect to the supporting surface is adjustable.
    Type: Application
    Filed: March 23, 2022
    Publication date: September 21, 2023
    Inventor: Cheng Yu Huang
  • Publication number: 20230300590
    Abstract: A fail-safe on-board unit, a movable device, and a control method for a vehicle which will automatically and reliably broadcast a distress signal to a rescue center in the event of accident includes in the on-board unit a first subscriber identity module (SIM), a second SIM, a main processor, a modem, a radio frequency (RF) switch module, and an antenna module with several antennas. The main processor selects the first SIM and / or the second SIM to make a call to generate a baseband signal, and outputs the baseband signal to the modem, the modem converts the baseband signal into an RF signal, and outputs the RF signal to the RF switch module to transmit outward via one or more antennas of the antenna module. The on-board unit has a wider network coverage to ensure higher success rate of emergency calls.
    Type: Application
    Filed: February 6, 2023
    Publication date: September 21, 2023
    Inventors: FENG-YUAN LI, ZHI-CHENG YU, XIAO-MIN LIANG
  • Patent number: 11764248
    Abstract: In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes an image sensor disposed within a first substrate. A first band-pass filter and a second band-pass filter are disposed on the first substrate. A dielectric structure is disposed on the first substrate. The dielectric structure is laterally between the first band-pass filter and the second band-pass filter and laterally abuts the first band-pass filter and the second band-pass filter.
    Type: Grant
    Filed: October 21, 2021
    Date of Patent: September 19, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu
  • Patent number: 11759688
    Abstract: An artificial shuttlecock, a feather and a preparation method thereof are provided. The feather includes a connecting portion, a first portion, a second portion and a concave. The first portion and the second portion are disposed on the opposite sides of the connecting portion. The concave is located at an outer edge of the second portion. The concave is formed by the following steps of: defining an overlapped outline, which is the outline of the adjacent feather overlapping on the second portion; defining a reference point, which is a point where the overlapped outline is closest to the connecting portion; defining a shifting reference line, which passes through the reference point and is parallel to the connecting portion; defining a reference outline, which is located outside the shifting reference line; and cutting the reference outline to form the concave.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: September 19, 2023
    Assignee: Victor Rackets Industrial Corp.
    Inventors: Shu-Jung Chen, Tzu-Wei Wang, Hsin-Chen Wang, Cheng-Yu Chang
  • Patent number: 11764239
    Abstract: A method for forming an image sensor package is provided. An image sensor chip is formed over a package substrate. A protection layer is formed overlying the image sensor chip. The protection layer has a planar top surface and a bottom surface lining and contacting structures under the protection layer. An opening is formed into the protection layer and spaced around a periphery of the image sensor chip. A light shielding material is filled in the opening to form an on-wafer shield structure having a sidewall directly contact the protection layer.
    Type: Grant
    Filed: February 10, 2022
    Date of Patent: September 19, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Hau Wu, Chun-Hao Chuang, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Cheng Yu Huang
  • Patent number: 11757231
    Abstract: A connector includes a receptacle and a plug. The receptacle includes a first terminal of a first gender. The plug includes a second terminal of a second gender opposite to the first gender. The plug further includes a cover and an insert. The cover plugs into the receptacle. The insert includes the second terminal. The insert inserts into the cover such that the first terminal makes an electrical connection with the second terminal.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: September 12, 2023
    Assignee: Dell Products L.P.
    Inventors: Wei-Cheng Yu, Robert D. Widenhofer, Chi-Che Wu
  • Patent number: 11755439
    Abstract: A memory controller coupled to a memory device and configured to control access operations of the memory device includes a host interface and a microprocessor. The microprocessor is coupled to the host interface and configured to set a value of a predetermined parameter to a specific value after the memory controller powers up and start to perform a link flow to try to establish a transmission link via the host interface. The predetermined parameter is one of a plurality of capability parameters of the host interface and the predetermined parameter is related to reception of the host interface. After the link flow is completed, the microprocessor is further configured to identify an object device with which the host interface establishes the transmission link according to the specific value and at least one of a plurality of attribute parameters associated with the transmission link.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: September 12, 2023
    Assignee: Silicon Motion, Inc.
    Inventors: Cheng-Yu Lee, Te-Kai Wang
  • Patent number: 11753568
    Abstract: An adhesive composition includes 0.1 to 1 part by weight of nano panicles, 50 to 95 parts by weight of acrylate resin, and 5 to 50 parts by weight of a monomer or oligomer of acrylate or acrylic acid containing multi-functional groups, and the acrylate resin and the monomer or oligomer of acrylate or acrylic acid containing multi-functional groups have a total weight of 100 parts by weight, in which the acrylate resin has a weight average molecular weight of 100,000 to 1,500,000. The nano particle has a shell covering parts of the surface of the core, and acrylate groups grafted to the surface of the core.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: September 12, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ming-Tzung Wu, Te-Yi Chang, Yao-Jheng Huang, Yu-Chin Lin, Chen-Cheng Yu, Yu-Ying Hsu, Shuang-Huei Chen
  • Patent number: 11745921
    Abstract: A sealing cover with a two-way embedding buckle mechanism includes an upper cover member, a lower cover member, a fastener, an elastic element and a handle member. The fastener has two embedded buckle channels corresponding to each other, each includes a sliding path, a first embedding port and a second embedding port. The first and second embedding ports are formed on two ends of the sliding path respectively. The elastic element is elastically clamped between the upper and lower cover members. The handle member includes a knob handle and two support arms, and each support arm has a shaft, and each shaft selectively enters one of the first and second embedding ports and is capable of moving in each sliding path. This arrangement may improve the convenience of assembling and disassembling.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: September 5, 2023
    Assignee: FREE-FREE INDUSTRIAL CORP
    Inventors: Cheng-Yu Ou, Sheng-Yu Liu
  • Patent number: 11749321
    Abstract: Systems and method are provided for a memory circuit that includes a bit cell responsive to a bit line signal line and a bit line bar signal line configured to store a bit of data. A pre-charge circuit is configured to charge one of the bit line and bit line bar signal lines prior to a read operation, where the pre-charge circuit includes a first pre-charge component and a second pre-charge component, the first and second pre-charge components being individually controllable for charging the bit line and bit line bar signal lines.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: September 5, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Wei-Cheng Wu, Kao-Cheng Lin, Chih-Cheng Yu, Pei-Yuan Li, Chien-Chen Lin, Wei Min Chan, Yen-Huei Chen
  • Patent number: 11748662
    Abstract: Provided is a system and method for building context from software applications and applying the context to visual settings in a graphical user interface. In one example, the method may include receiving an identification of actions performed by a user with respect to a user interface of a software application, receiving application metadata of the actions from the software application, the application metadata providing context associated with the actions, training one or more predictive models to predict user interface preferences for the user based on the actions and the application metadata, and storing the one or more trained predictive models via a storage device.
    Type: Grant
    Filed: October 3, 2022
    Date of Patent: September 5, 2023
    Assignee: BUSINESS OBJECTS SOFTWARE LTD.
    Inventor: Cheng Yu Yao
  • Patent number: 11741016
    Abstract: A method for performing access management in a memory device, the associated memory device and the controller thereof, and the associated electronic device are provided. The method may include: receiving a host command and a logical address from a host device; performing at least one checking operation to obtain at least one checking result, for determining whether to load a logical-to-physical (L2P) table from the NV memory to a random access memory (RAM) of the memory device, wherein the L2P table includes address mapping information for accessing the target data, and performing the at least one checking operation to obtain at least one checking result includes checking whether a first L2P-table index pointing toward the L2P table and a second L2P-table index sent from the host device are equivalent to each other; and reading the target data from the NV memory, and sending the target data to the host device.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: August 29, 2023
    Assignee: Silicon Motion, Inc.
    Inventors: Jie-Hao Lee, Cheng-Yu Yu
  • Publication number: 20230268699
    Abstract: The present disclosure provides embodiments of direct current (DC) power connectors and methods to manufacture the same. More specifically, the present disclosure provides a connector plug with improved power capacity and structural rigidity. The connector plug includes an inner body and an outer body coupled to transmit power through the DC power connector, wherein the inner body is concentrically arranged within the outer body, and an insulating barrel that is coupled between the inner body and the outer body to electrically isolate the inner body from the outer body. The inner body and outer body comprise a base metal or metal alloy having an electrical conductivity ranging between 30% International Annealed Copper Standard (IACS) and greater than or equal to 99% IACS.
    Type: Application
    Filed: March 17, 2023
    Publication date: August 24, 2023
    Inventors: Wei Cheng Yu, Andrew Sultenfuss, Chi Che Wu, Tsung-Cheng Liao