Patents by Inventor Chi Chen

Chi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11373971
    Abstract: A semiconductor device structure, along with methods of forming such, are described. The structure includes a substrate having one or more devices formed thereon, one or more bonding pads disposed over the substrate, and a first passivation layer disposed over the one or more bonding pads. The first passivation layer includes a first passivation sublayer having a first dielectric material, a second passivation sublayer disposed over the first passivation sublayer, and the second passivation sublayer has a second dielectric material different from the first dielectric material. The first passivation layer further includes a third passivation sublayer disposed over the second passivation sublayer, and the third passivation sublayer has a third dielectric material different from the second dielectric material. At least two of the first, second, and third passivation sublayers each includes a nitride.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: June 28, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsin-Chi Chen, Hsun-Ying Huang, Chih-Ming Lee, Shang-Yen Wu, Chih-An Yang, Hung-Wei Ho, Chao-Ching Chang, Tsung-Wei Huang
  • Patent number: 11373905
    Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: June 28, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Wei Chu, Ying-Chi Su, Yu-Kai Chen, Wei-Yip Loh, Hung-Hsu Chen, Chih-Wei Chang, Ming-Hsing Tsai
  • Patent number: 11373879
    Abstract: A planarization method and a CMP method are provided. The planarization method includes providing a substrate with a first region and a second region having different degrees of hydrophobicity or hydrophilicity and performing a surface treatment to the first region to render the degrees of hydrophobicity or hydrophilicity in proximity to that of the second region. The CMP method includes providing a substrate with a first region and a second region; providing a polishing slurry on the substrate, wherein the polishing slurry and the surface of the first region have a first contact angle, and the polishing slurry and the surface of the first region have a second contact angle; modifying the surface of the first region to make a contact angle difference between the first contact angle and the second contact angle equal to or less than 30 degrees.
    Type: Grant
    Filed: September 12, 2020
    Date of Patent: June 28, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Tung-Kai Chen, Ching-Hsiang Tsai, Kao-Feng Liao, Chih-Chieh Chang, Chun-Hao Kung, Fang-I Chih, Hsin-Ying Ho, Chia-Jung Hsu, Hui-Chi Huang, Kei-Wei Chen
  • Publication number: 20220201754
    Abstract: An electronic device, a transmission system, and a transmission method are provided. The electronic device includes a capturing module, a processing module, and a transmission module. The capturing module is configured to receive a first set of signals. The processing module is configured to select a second set of signals from the first set of signals based on a condition. The transmission module is configured to transmit the second set of signals.
    Type: Application
    Filed: December 18, 2020
    Publication date: June 23, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ting-Han CHEN, Yu-Chuang HSU, Alex Chi-Hong CHAN
  • Publication number: 20220201313
    Abstract: A method of decoding video data includes determining that bi-directional optical flow (BDOF) is enabled for a block of the video data; dividing the block into a plurality of sub-blocks based on the determination that BDOF is enabled for the block, determining, for each sub-block of one or more sub-blocks of the plurality of sub-blocks, respective distortion values, determining that one of per-pixel BDOF is performed or BDOF is bypassed for each sub-block of the one or more sub-blocks of the plurality of sub-blocks based on the respective distortion values, determining prediction samples for each sub-block of the one or more sub-blocks based on the determination of per-pixel BDOF being performed or BDOF being bypassed, and reconstructing the block based on the prediction samples.
    Type: Application
    Filed: December 20, 2021
    Publication date: June 23, 2022
    Inventors: Zhi Zhang, Han Huang, Chun-Chi Chen, Yan Zhang, Vadim Seregin, Marta Karczewicz
  • Publication number: 20220199401
    Abstract: Methods for depositing boron-containing films on a substrate are described. The substrate is exposed to a boron precursor and a plasma to form the boron-containing film (e.g., elemental boron, boron oxide, boron carbide, boron silicide, boron nitride). The exposures can be sequential or simultaneous. The boron-containing films are selectively deposited on one material (e.g., SiN or Si) rather than on another material (e.g., silicon oxide).
    Type: Application
    Filed: December 13, 2021
    Publication date: June 23, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Yung-Chen Lin, Chi-I Lang, Ho-yung David Hwang
  • Publication number: 20220198999
    Abstract: A light-emitting circuit is provided herein, which includes a light-emitting unit, a driving transistor, and a bypass transistor. The driving transistor is configured to drive the light-emitting unit. The bypass circuit diverts the current flowing from the driving transistor to the light-emitting unit for reducing the possibility of the light-emitting unit illuminating in the dark state.
    Type: Application
    Filed: November 5, 2021
    Publication date: June 23, 2022
    Inventors: Ming-Chun TSENG, Kung-Chen KUO, Lien-Hsiang CHEN, Chi-Lun KAO
  • Publication number: 20220196673
    Abstract: Disclosed herein are recombinant baculoviruses suitable for detecting the presence of arthropod-borne viruses in a biological sample of a test subject. The information derived from the detection may also be used to render a diagnosis on whether the test subject is infected with the arthropod-borne viruses or not, so that proper course of treatment may be assigned to the subject.
    Type: Application
    Filed: March 9, 2022
    Publication date: June 23, 2022
    Applicant: Chung Yuan Christian University
    Inventors: Tzong-Yuan WU, Szu-Cheng KUO, Pei-Yun SHU, Chang-Chi LIN, Der-Jiang CHIAO, Ying-Ju CHEN, Yi-Ting LIN, Shu-Fen CHANG, Chien-Ling SU
  • Publication number: 20220193852
    Abstract: A monitoring method and a monitoring system for a machine tool to machine a workpiece are provided. The monitoring method includes the following steps. First, a vibration signal of a spindle of the machine tool is detected. Next, a vibration feature value of the vibration signal is obtained. Whether the vibration feature value exceeds a threshold condition is determined, wherein the threshold condition is determined by a training model based on a predetermined surface quality of the workpiece. When the vibration feature value exceeds the threshold condition, a machining parameter of the machine tool is adjusted.
    Type: Application
    Filed: April 27, 2021
    Publication date: June 23, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Yu TSAI, Chi-Chen LIN, Sheng-Ming MA, Ta-Jen PENG
  • Publication number: 20220199314
    Abstract: A high-insulation multilayer planar transformer (1) includes a pair of iron cores (20) and a circuit board integration (10a). The circuit board integration (10a) is stacked between the iron cores (20) and has a through hole (100a). The circuit board integration (10a) includes a first to a third insulating layers (11a, 12a, 14a) and a first to a second coil windings (13a, 15a). The first and third insulating layers (11a, 14a) include at least two insulating plates (111a, 141a) stacked with each other respectively. The second insulating layer (12a) includes at least one insulating plate (121a). The coil winding (13a, 15a) is disposed between the adjacent insulating layers and surrounds the through hole (100a) planarly. Therefore, the reinforced insulation requirement of safety regulations may be achieved.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Inventors: Lien-Hsing CHEN, Hsiao-Hua CHI, Chun-Ping CHANG, Han-Chiang CHEN, Chia-Ti LAI, Yung-Chi CHANG
  • Publication number: 20220201315
    Abstract: Example devices and techniques for multi-pass decoder-side motion vector refinement (DMVR) are disclosed. An example device includes memory configured to store video data and one or more processors coupled to the memory. The one or more processors are configured to apply a multi-pass DMVR to a motion vector for a block of the video data to determine at least one refined motion vector and decode the block based on the at least one refined motion vector. The multi-pass DMVR includes a block-based first pass, a sub-block-based second pass, and a sub-block-based third pass.
    Type: Application
    Filed: December 20, 2021
    Publication date: June 23, 2022
    Inventors: Zhi Zhang, Han Huang, Chun-Chi Chen, Yan Zhang, Vadim Seregin, Marta Karczewicz
  • Publication number: 20220197466
    Abstract: A control method for an optical fingerprint sensor and a touch controller is provided, for canceling or reducing capacitive loading. The optical fingerprint sensor includes a plurality of pixels, and each of the pixels has a first control signal line and a second control signal line. Each of the pixels is further coupled to a first voltage source line, a second voltage source line and a sensing line. The control method includes the step of configuring at least one of the first control signal line, the second control signal line, the first voltage source line, the second voltage source line and the sensing line to be floating when the touch controller is in a touch operation period.
    Type: Application
    Filed: March 9, 2022
    Publication date: June 23, 2022
    Applicant: NOVATEK Microelectronics Corp.
    Inventors: Tsen-Wei Chang, Chih-Peng Hsia, Wei-Lun Shih, Hong-Chu Chen, Su-Wei Lien, Sheng-Wen Hsiao, Liang-Chi Cheng
  • Publication number: 20220197559
    Abstract: Techniques manage an access load of a storage system. For storage devices in the storage system, access histories of the storage devices in a previous time period are received respectively. Access loads of the storage devices in a future time period are determined respectively based on the access histories of the storage devices, the future time period being between a current time point and a future time point for performing future load balancing. An access balance degree of the storage system at the future time point is acquired based on the access loads. Load balancing is performed among the storage devices in response to determining that the access balance degree satisfies a first predetermined condition. Accordingly, it is possible to determine an access load of each storage device in a storage system more accurately and ensure that the access loads of the storage devices are in a balanced state.
    Type: Application
    Filed: May 19, 2021
    Publication date: June 23, 2022
    Inventors: Chi Chen, Huijuan Fan
  • Publication number: 20220197865
    Abstract: A system for providing user access to electronic mail includes an email client and an email server. The email client receives and communicates a user interaction with an email message The email server that receives the communication, determines whether the email message stored in a live database or in a backup storage. Upon determination that the email message is stored in a backup storage, the email server performs a message exchange with a backup storage system to perform the user-requested action.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 23, 2022
    Inventors: Arun Prasad Amarendran, Jun H. Ahn, Tirthankar Chatterjee, Manas Bhikchand Mutha, Ho-Chi Chen, Prosenjit Sinha, Yongtao Liu
  • Patent number: 11366710
    Abstract: A system and method for shortening the system management mode when a fault occurs in hardware component in a computer system is disclosed. The computer system has hardware components that may have faults. Notification of an error in one of the hardware components is received through RAS silicon on a processing unit. The error is detected from the hardware component by a system management interrupt handler executed by a bootstrap processor core. The error data is logged into a system error log via a system control interrupt handler executed by the processing unit. The system management mode is avoided during the logging of the error data. This prevents other processor cores being suspended from the system management mode.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: June 21, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Ming-Hung Hung, Hsing-Chi Chen, Yan-Ting Jiang
  • Publication number: 20220189786
    Abstract: A method and apparatus for patterning semiconductor materials using tin-based materials as mandrels, hardmasks, and liner materials are provided. One or more implementations of the present disclosure use tin-oxide and/or tin-carbide materials as hardmask materials, mandrel materials, and/or liner material during various patterning applications. Tin-oxide or tin-carbide materials are easy to strip relative to other high selectivity materials like metal oxides (e.g., TiO2, ZrO2, HfO2, Al2O3) to avoid influencing critical dimensions and generate defects. In addition, tin-oxide and tin-carbide have low refractive index, k-value, and are transparent under 663-nm for lithography overlay.
    Type: Application
    Filed: November 23, 2021
    Publication date: June 16, 2022
    Inventors: Yung-chen LIN, Chi-I LANG, Ho-yung HWANG
  • Publication number: 20220191999
    Abstract: An extreme ultra violet (EUV) radiation source apparatus includes a collector, a target droplet generator for generating a tin (Sn) droplet, a rotatable debris collection device and a chamber enclosing at least the collector and the rotatable debris collection device. The rotatable debris collection device includes a first end support, a second end support and a plurality of vanes, ends of which are supported by the first end support and the second end support, respectively. A surface of at least one of the plurality of vanes is coated by a catalytic layer, which reduces a SnH4 to Sn.
    Type: Application
    Filed: March 7, 2022
    Publication date: June 16, 2022
    Inventors: Shang-Chieh CHIEN, Po-Chung CHENG, Chia-Chen CHEN, Jen-Yang CHUNG, Li-Jui CHEN, Tzung-Chi FU, Shang-Ying WU
  • Publication number: 20220188210
    Abstract: A non-intrusive interaction method includes an electronic device that obtains a description file of an application, where the description file indicates a function to be implemented by the application, and is defined using a non-intrusive protocol description; determines a first component based on the description file, where the first component is a component that is in components of the electronic device and that can implement the function that needs to be implemented by the application, and the component is configured based on a non-intrusive protocol to provide a device capability service and can implement an independent function; and runs, based on the description file to provide the device capability service for the application, the first component to implement the function.
    Type: Application
    Filed: March 7, 2022
    Publication date: June 16, 2022
    Inventors: Jianfeng Wang, Hao Chen, Xiaoyun Yang, Chi Guan, Xiaoxiao Chen
  • Publication number: 20220188589
    Abstract: An integrated circuit, a wireless communication card and a wiring structure of an identification mark are provided. The integrated circuit includes a power supply wiring, a ground wiring and at least one identification mark pattern. Each identification mark pattern has a first conductive wiring and a second conductive wiring that overlap each other, wherein the first conductive wiring is electrically connected to the power wiring, and the second conductive wiring is electrically connected to the ground wiring.
    Type: Application
    Filed: March 1, 2022
    Publication date: June 16, 2022
    Applicant: Au Optronics Corporation
    Inventors: Shyh-Bin Kuo, Hsiang-Chi Cheng, Sin-Jie Wang, Yi-Cheng Lai, Chung-Hung Chen, Shih-Hsing Hung
  • Patent number: D955251
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: June 21, 2022
    Assignee: Amazon Technologies, Inc.
    Inventors: Michael Edward James Paterson, Chia-Wei Chan, Mei Hsuan Chen, Benjamin Wild, Matthew J. England, Wen-Yo Lu, James Siminoff, Mark Siminoff, Yen-Chi Tsai