Patents by Inventor Chi Chen

Chi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240326195
    Abstract: An apparatus includes a first platen configured to hold a first workpiece; a first dressing board; and blade holder including arms extending from a central axis, wherein the blade holder is configured to hold a blade at an end of each respective arm, wherein the blade holder is operable to rotate around the central axis, wherein the blade holder is configured to trim the first workpiece using at least one blade, wherein the blade holder is configured to dress at least one blade on the first dressing board.
    Type: Application
    Filed: March 30, 2023
    Publication date: October 3, 2024
    Inventors: Fang-I Chen, Pei-Keng Tsai, Hui-Chi Huang
  • Publication number: 20240332062
    Abstract: A device includes a substrate, a first fin, a second fin, a first isolation structure, a second isolation structure, and a gate structure. The first fin extends from a p-type region of the substrate. The second fin extends from an n-type region of the substrate. The first isolation structure is over the p-type region and adjacent to the first fin. The first isolation structure has a bottom surface and opposite first and second sidewalls connected to the bottom surface, a first round corner is between the bottom surface and the first sidewall of the first isolation structure, and the first sidewall is substantially parallel to the second sidewall. The second isolation structure is over the n-type region and adjacent to the first fin. The first isolation structure is deeper than the second isolation structure. The gate structure is over the first isolation structure and covering the first fin.
    Type: Application
    Filed: June 12, 2024
    Publication date: October 3, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsien-Chung HUANG, Chiung-Wen HSU, Mei-Ju KUO, Yu-Ting WENG, Yu-Chi LIN, Ting-Chung WANG, Chao-Cheng CHEN
  • Publication number: 20240332846
    Abstract: An electrical connector, wherein the electrical connector can offer sufficient wiring space for the accompanying conductive cables, thereby reducing the stacking height of the conductive cables during wiring to ensure that the electrical connector and its accompanying conductive cables occupy internal space within electronic devices at expected height dimensions. Additionally, the provided electrical connector can guide the conductive cables to extend outward laterally, enabling the conductive cables to extend laterally within electronic devices to facilitate the organization of conductive cables within electronic devices and even helps avoid unnecessary tangling of conductive cables within electronic devices, allowing electronic devices to continue advancing towards thinner designs.
    Type: Application
    Filed: March 29, 2024
    Publication date: October 3, 2024
    Inventors: MU-JUNG HUANG, TSUNG-CHI CHEN
  • Patent number: 12107581
    Abstract: A clock gating circuit includes an input circuit, a cross-coupled pair of transistors, a first transistor of a first type and a first pull-up transistor of the first type. The input circuit is configured to set a first control signal of a first node in response to a first or second enable signal. The cross-coupled pair of transistors is coupled between the first node and an output node. The first transistor is coupled between the first and a second node. The first pull-up transistor includes a first gate terminal, a first drain terminal and a first source terminal. The first gate terminal is configured to receive an inverted clock input signal. The first drain terminal is coupled to the second node and the first transistor. The first pull-up transistor is configured to adjust a clock output signal responsive to the inverted clock input signal.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: October 1, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Seid Hadi Rasouli, Jerry Chang Jui Kao, Xiangdong Chen, Tzu-Ying Lin, Yung-Chen Chien, Hui-Zhong Zhuang, Chi-Lin Liu
  • Patent number: 12107011
    Abstract: During a front side process of a wafer, a hard mask layer is formed under a metal portion of a semiconductor device, and an epitaxial layer is deposited to form epitaxial portions of the semiconductor device. In a back side process of the wafer to cut the epitaxial layer, the metal portion is covered and protected by the hard mask layer from damages during etching of the epitaxial layer.
    Type: Grant
    Filed: July 27, 2023
    Date of Patent: October 1, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-Yuan Chen, Li-Zhen Yu, Huan-Chieh Su, Lo-Heng Chang, Cheng-Chi Chuang, Chih-Hao Wang
  • Patent number: 12106962
    Abstract: The embodiments of the disclosure provide a patterning method, which includes the following processes. A target layer is formed on a substrate. A hard mask layer is formed over the target layer. A first patterning process is performed on the hard mask layer by using a photomask having a first pattern with a first pitch. The photomask is shifted along a first direction by a first distance. A second patterning process is performed on the hard mask layer by using the photomask that has been shifted, so as to form a patterned hard mask. The target layer is patterned using the patterned hard mask to form a patterned target layer. The target layer has a second pattern with a second pitch less than the first pitch.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: October 1, 2024
    Assignee: United Microelectronics Corp.
    Inventors: Yi Jing Wang, Chia-Chang Hsu, Chien-Hao Chen, Chang-Mao Wang, Chun-Chi Yu
  • Patent number: 12107074
    Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.
    Type: Grant
    Filed: February 28, 2023
    Date of Patent: October 1, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chang Chi Lee, Jung Jui Kang, Chiu-Wen Lee, Li Chieh Chen
  • Patent number: 12106598
    Abstract: A fingerprint sensing device has a sensing area, an operation area, and a peripheral area, and the operation area is disposed between the sensing area and the peripheral area. The fingerprint sensing device includes a substrate, a sensing element located at the sensing area, an operation element located at the operation area, a first signal line located at the peripheral area, a first planarization layer, a first insulating layer, and a first shading layer. The first planarization layer is located on the substrate and has a first trench, and the first trench overlaps the first signal line. The first insulating layer is located on the first planarization layer and in the first trench, and the first insulating layer has a first opening located in the first trench. The first shading layer is located on the first insulating layer and connected to the first signal line through the first opening.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: October 1, 2024
    Assignee: Au Optronics Corporation
    Inventors: Shu-Wen Tzeng, Yan-Liang Chen, Jui-Chi Lo
  • Patent number: 12102554
    Abstract: Apparatuses of reusable incontinence underwear and methods for manufacturing the same are provided. In one embodiment, an incontinence underwear includes an interior layer includes an excretion area, where the excretion area includes one or more openings configured to drain excretions of a user away from the interior layer; a middle layer configured to house an excretion collection unit, where the excretion collection unit is configured to store the urine from the interior layer to a urine collection bag external to the incontinence underwear; an exterior layer configured to conceal and prevent leakage from the middle layer of the incontinence underwear; and a support frame configured to hold the interior layer, the middle layer and the exterior layer of the incontinence underwear together.
    Type: Grant
    Filed: November 28, 2023
    Date of Patent: October 1, 2024
    Inventors: Chi Chen Hsien, Thomas C Chan
  • Patent number: 12105408
    Abstract: An optical element driving mechanism is provided in the present disclosure, including a fixed portion, a first movable portion, and a driving assembly. The first movable portion is movable relative to the fixed portion. The driving assembly drives the first movable portion to move relative to the fixed portion. The first movable portion brings an optical element to move.
    Type: Grant
    Filed: January 19, 2023
    Date of Patent: October 1, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Yung-Yun Chen, Yu-Chi Kuo, Xuan-Huan Su
  • Publication number: 20240323524
    Abstract: An optical coherence tomography image system and an autofocus method thereof are provided. The autofocus method captures a reference chart at a plurality of preset diopter positions, receives an interference signal generated by the reflection of a light beam projected onto an eyeball, and analyzes the reference chart and the interference signal to obtain an analysis value and a corresponding diopter. The method compares the plurality of analysis values to obtain one meeting the standard condition as the target analysis value. According to the target analysis value and the corresponding diopter, the focusing driving device is controlled to move to the position corresponding to the diopter to complete autofocusing. Therefore, the present invention can reduce the time of autofocusing, obtain a higher shooting success rate, provide better user experience, and use a lower-order computing device to reduce costs.
    Type: Application
    Filed: March 25, 2024
    Publication date: September 26, 2024
    Inventors: Jia-Pu Syu, CHIEN-CHI HUANG, Yu-Tsung Lee, Hung-Chin Chen
  • Publication number: 20240322801
    Abstract: A multimedia device comprises a power input interface, a computing circuit and a load circuit. The power input interface is configured to receive an operating voltage. The computing circuit is configured to receive the operating voltage from the power input interface, and configured to output a pulse-width modulation (PWM) signal. The load circuit is configured to receive a test current from the power input interface, receive the PWM signal, and determine a magnitude of the test current according to a duty ratio of the PWM signal. The computing circuit is configured to monitor the variation of the operating voltage while adjusting the duty ratio of the PWM signal step by step. The computing circuit is configured to determine an upper bound of a power consumption of the computing circuit according to the relationship between the operating voltage and the duty ratio of the PWM signal.
    Type: Application
    Filed: March 22, 2024
    Publication date: September 26, 2024
    Inventors: Chao-Min LAI, Chien-Liang CHEN, Chia-Chi YEH
  • Publication number: 20240322009
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a dielectric layer over a substrate. The dielectric layer has a first trench over a first portion of the substrate and a second trench over a second portion of the substrate. The method includes forming a first work function layer in the first trench and the second trench. The method includes forming a first mask layer over the first work function layer in the first trench. The method includes removing the first work function layer exposed by the first mask layer. The method includes removing the first mask layer. The method includes forming a first gate electrode in the first trench and a second gate electrode in the second trench. The method includes forming a first hard mask layer in the first trench and a second hard mask layer in the second trench.
    Type: Application
    Filed: June 3, 2024
    Publication date: September 26, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Han FANG, Chang-Yin CHEN, Ming-Chia TAI, Po-Chi WU
  • Publication number: 20240321954
    Abstract: A semiconductor device includes a substrate, a gate oxide layer formed on the substrate, a gate formed on the gate oxide layer, and a spacer formed adjacent the gate and over the substrate. The spacer includes a void filled with air to prevent leakage of charge to and from the gate, thereby reducing data loss and providing better memory retention. The reduction in charge leakage results from reduced parasitic capacitances, fringing capacitances, and overlap capacitances due to the low dielectric constant of air relative to other spacer materials. The spacer can include multiple layers such as oxide and nitride layers. In some embodiments, the semiconductor device is a multiple-time programmable (MTP) memory device.
    Type: Application
    Filed: June 3, 2024
    Publication date: September 26, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Gulbagh Singh, Kun-Tsang Chuang, Hsin-Chi Chen
  • Publication number: 20240324162
    Abstract: A static random access memory (SRAM) cell includes a first pull-up (PU) transistor comprising a first gate structure. The SRAM cell further includes a second PU transistor comprising a second gate structure, wherein the second gate structure comprises a gate stack and gate spacers. The SRAM cell further includes a first butted contact, wherein the first butted contact electrically connects a first terminal of the first PU transistor to the second gate structure, wherein the first butted contact directly contacts each of a top surface and a sidewall of the gate stack.
    Type: Application
    Filed: June 5, 2024
    Publication date: September 26, 2024
    Inventors: You Che CHUANG, Chih-Ming LEE, Hsin-Chi CHEN, Hsun-Ying HUANG
  • Patent number: 12100743
    Abstract: A semiconductor device and a method for forming the same are provided. The semiconductor device includes a substrate and a gate structure. The gate structure is disposed in the substrate and includes a shielded gate, a control gate, and a plurality of insulating layers. The shielded gate includes a bottom gate and a top gate. The bottom gate includes a step structure consisting of a plurality of electrodes. A width of the electrode is smaller as the electrode is farther away from the top gate, and a width of the top gate is smaller than a width of the electrode closest to the top gate. The control gate is disposed on the shielded gate. A first insulating layer is disposed between the shielded gate and the substrate. A second insulating layer is disposed on the shielded gate. A third insulating layer is disposed between the control gate and the substrate.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: September 24, 2024
    Assignee: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Ying-Chi Cheng, Yu-Jen Huang, Shin-Hong Chen
  • Patent number: 12099327
    Abstract: A holographic calling system can capture and encode holographic data at a sender-side of a holographic calling pipeline and decode and present the holographic data as a 3D representation of a sender at a receiver-side of the holographic calling pipeline. The holographic calling pipeline can include stages to capture audio, color images, and depth images; densify the depth images to have a depth value for each pixel while generating parts masks and a body model; use the masks to segment the images into parts needed for hologram generation; convert depth images into a 3D mesh; paint the 3D mesh with color data; perform torso disocclusion; perform face reconstruction; and perform audio synchronization. In various implementations, different of these stages can be performed sender-side or receiver side. The holographic calling pipeline also includes sender-side compression, transmission over a communication channel, and receiver-side decompression and hologram output.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: September 24, 2024
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Albert Parra Pozo, Joseph Virskus, Ganesh Venkatesh, Kai Li, Shen-Chi Chen, Amit Kumar, Rakesh Ranjan, Brian Keith Cabral, Samuel Alan Johnson, Wei Ye, Michael Alexander Snower, Yash Patel
  • Patent number: 12098412
    Abstract: Disclosed herein is an isolated strain of Roseburia hominis HGM001, which is deposited at Deutsche Sammlung von Mikroorganismen and Zellkulturen GmbH under an accession number DSM 34119. A method for producing butyric acid using the isolated strain of Roseburia hominis HGM001, a fermented culture produced by the method, and a method for alleviating an inflammatory disorder using the fermented culture are also disclosed.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: September 24, 2024
    Assignee: Food Industry Research and Development Institute
    Inventors: Chien-Hsun Huang, Li-Wen Hsu, Jong-Shian Liou, I-Ching Chen, Sung-Yuan Hsieh, Chien-Chi Chen
  • Patent number: 12101026
    Abstract: A metal-oxide semiconductor field-effect transistor with asymmetric parallel dies and a method of using the same, including an inductor, a load recognition control unit and a metal-oxide semiconductor field-effect transistor having a first die, a second die, and a switch. The first die is larger in size than the second die. The inductor produces a voltage signal when the load changes. The switch is controlled by the load recognition control unit such that different dies are switched on under different load conditions, thereby improving efficiency under light load condition in addition to reducing volume and cost.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: September 24, 2024
    Assignee: POTENS SEMICONDUCTOR CORP.
    Inventors: Wen Nan Huang, Ching Kuo Chen, Chih Ming Yu, Hsiang Chi Meng, Tung Ming Lai
  • Patent number: D1043662
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: September 24, 2024
    Assignee: Zebra Technologies Corporation
    Inventors: Mu-Kai Shen, Lawrence Allen Stone, Man-Ching Yen, Liao-Hsun Chen, Hui-Chi Kuo, Chandra M. Nair