Abstract: A package structure includes a plurality of semiconductor die, an insulating encapsulant and a redistribution layer. Each of the plurality of semiconductor dies includes a semiconductor substrate, conductive pads disposed on the semiconductor substrate, conductive posts disposed on the conductive pads, and at least one alignment mark located on the semiconductor substrate. The insulating encapsulant is encapsulating the plurality of semiconductor dies. The redistribution layer is disposed on the insulating encapsulant and electrically connected to the plurality of semiconductor dies.

Abstract: A method for assessing the release performance of microcapsules comprising at least one volatile ingredient, the method comprising the steps of: a. applying a plurality of said microcapsules to an underlying surface; b. applying a kinetic frictional shear stress ? through a contact surface of a probe under a predefined load, a predefined contact surface area and a predefined shear rate to said plurality of microcapsules; and c. measuring the amount of the at least one volatile ingredient released per second from said microcapsules under said kinetic frictional shear stress ?.

Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, two clamping plates, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The two clamping plates are detachably attached to two opposite sides of the connecting seat respectively. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the two clamping plates, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the two clamping plates, and the connecting seat therebetween into a locked condition.

Abstract: A management system, a management method, and a location finding method for managing a plurality of physical locations having multi-dimensional coordinates within a room are provided. The management system includes a plurality of terminal devices, at least one coordination device, and a management device. The management device stores a first and a second pairing table. The management device is configured to, in response to an external command, perform: obtaining an identification number of a first terminal device of the terminal devices from the first pairing table; determining, from the second pairing table, a first coordination device that is configured to manage the first terminal device; and transmitting a task command to the first coordination device such that the first coordination device assigns the first terminal device to complete the task command.

Abstract: A package structure includes a plurality of semiconductor die, an insulating encapsulant and a redistribution layer. Each of the plurality of semiconductor dies includes a semiconductor substrate, conductive pads disposed on the semiconductor substrate, conductive posts disposed on the conductive pads, and at least one alignment mark located on the semiconductor substrate. The insulating encapsulant is encapsulating the plurality of semiconductor dies. The redistribution layer is disposed on the insulating encapsulant and electrically connected to the plurality of semiconductor dies.

Abstract: In some examples, an electronic device includes a wireless charger, a detector, and a controller. The controller is to detect a peripheral device via the detector and, in response to detecting the peripheral device via the detector, determine an operation mode of the wireless charger, the operation mode including a power saving mode, a standby mode, and a charging mode.

Abstract: A micro LED display panel is provided. The micro LED display panel includes a driving substrate and a plurality of bonding pads disposed on the driving substrate and spaced apart from each other. The micro LED display panel also includes a plurality of micro LED structures electrically connected to the bonding pads. Each micro LED structure includes at least one electrode disposed on the side of the micro LED structure facing the driving substrate. The electrode has a normal contact surface and a side contact surface. The normal contact surface faces the driving substrate, and the side contact surface is laterally connected to the corresponding bonding pad.

Abstract: The micro-LED display device provided includes a substrate having a first circuit layer and a second circuit layer; a first pad on the first circuit layer and a second pad on the second circuit layer; a plurality of micro-LEDs, wherein each of the micro-LEDs includes a first electrode connected to the first pad and a second electrode connected to the second pad; a first bonding support layer disposed between the first and second pad and in direct contact with the substrate and the micro-LED; and a plurality of second bonding support layers, wherein each of the second bonding support layers includes a lower portion and a upper portion over the lower portion, wherein both portion are disposed between and in lateral contact with adjacent two of the micro-LEDs, and an optical density of the lower portion is greater than that of the upper portion under the same thickness.

Abstract: A system for application (APP) protection includes a processor. The processor is arranged to execute a guest virtual machine (VM), at least one primary VM, a hypervisor, and a host VM, wherein at least one APP protection with at least one identification (ID) of the at least one APP running on the guest VM is downloaded to the guest VM. The hypervisor includes an install service module and a launcher module. The host VM is arranged to: receive at least one install command from the guest VM, and generate an install service command to the install service module; verify the at least one APP protection by the at least one ID and generate at least one verification result; obtain the at least one ID from the at least one primary VM according to the at least one verification result; and generate a launch command to the launcher module.

Abstract: A system for model protection includes a processor. The processor is arranged to execute a guest virtual machine (VM), a primary VM, and a hypervisor. The guest VM includes a model, and is arranged to send at least one command to a command hub. The primary VM is arranged to refer to the at least one command sent from the command hub to manage and configure a protection setting for a protected model derived from the model. The hypervisor is arranged to receive a safety setting command sent by the primary VM, and manage and configure the safety protection component according to the safety setting command, to set a read-only mode of the protected model.

Abstract: A micro light-emitting diode package structure including a first base layer, a second base layer and a display unit is provided. The second base layer is disposed on the first base layer and has an opening. The opening exposes a part of the first base layer, and the opening and the exposed first base layer define a containing groove. The display unit is disposed in the containing groove, and the display unit includes a control circuit board and a micro light-emitting diode assembly. The micro light-emitting diode assembly is disposed on the control circuit board and electrically connected to the control circuit board.

Abstract: A computing system includes a processor, and the processor is arranged to execute: a guest virtual machine (VM), a hypervisor, and a primary VM, wherein an operating system (OS) runs on the guest VM, and an application (APP) runs on the OS. The kernel of the OS includes a protection service module and a memory management unit (MMU) manager. The protection service module is arranged to receive at least one virtual address and a first size information sent by a client of the APP. The primary VM includes a protection manager, and the protection manager is arranged to obtain a physical address array and a second size information according to the at least one virtual address and the first size information sent by the protection service through the hypervisor.

Abstract: A system for kernel protection includes a processor and a transmission interface. The processor is arranged to execute at least one guest virtual machine (VM), at least one primary VM, and a hypervisor. The at least one guest VM is arranged to send at least one command to a command hub. The at least one primary VM is arranged to manage and configure a safety setting according to the at least one command from the command hub and at least one policy, and manage and configure a safety protection component according to the safety setting. The hypervisor is arranged to manage and configure the safety protection component according to a ground rule and at least one safety setting command from the at least one primary VM. The transmission interface is arranged to bind the at least one primary VM to the hypervisor.

Abstract: A management system, a management method, and a location finding method for managing a plurality of physical locations having multi-dimensional coordinates within a room are provided. The management system includes a plurality of terminal devices, at least one coordination device, and a management device. The management device stores a first and a second pairing table. The management device is configured to, in response to an external command, perform: obtaining an identification number of a first terminal device of the terminal devices from the first pairing table; determining, from the second pairing table, a first coordination device that is configured to manage the first terminal device; and transmitting a task command to the first coordination device such that the first coordination device assigns the first terminal device to complete the task command.

Abstract: Method and apparatus for stress management in a searchable data service. The searchable data service may provide a searchable index to a backend data store, and an interface to build and query the searchable index, that enables client applications to search for and retrieve locators for stored entities in the backend data store. Embodiments of the searchable data service may implement a distributed stress management mechanism that may provide functionality including, but not limited to, the automated monitoring of critical resources, analysis of resource usage, and decisions on and performance of actions to keep resource usage within comfort zones. In one embodiment, in response to usage of a particular resource being detected as out of the comfort zone on a node, an action may be performed to transfer at least part of the resource usage for the local resource to another node that provides a similar resource.

Abstract: A device includes a sensor die having a sensing region at a top surface of the sensor die, an encapsulant at least laterally encapsulating the sensor die, a conductive via extending through the encapsulant, and a front-side redistribution structure on the encapsulant and on the top surface of the sensor die, wherein the front-side redistribution structure is connected to the conductive via and the sensor die, wherein an opening in the front-side redistribution structure exposes the sensing region of the sensor die, and wherein the front-side redistribution structure includes a first dielectric layer extending over the encapsulant and the top surface of the sensor die, a metallization pattern on the first dielectric layer, and a second dielectric layer extending over the metallization pattern and the first dielectric layer.

Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, two clamping plates, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The two clamping plates are detachably attached to two opposite sides of the connecting seat respectively. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the two clamping plates, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the two clamping plates, and the connecting seat therebetween into a locked condition.

Abstract: A dynamic audio broadcasting method is to receive an audio signal and an ambient sound, compare the audio signal and the ambient sound to adjust an amplification volume of the audio signal, and play the audio signal at the amplification volume. An audio broadcasting apparatus includes an audio receiver, an ambient sound receiver, a speaker, and a processing module electrically connected to the above components. The processing module is configured to receive an audio signal and an ambient sound through the audio receiver and the ambient sound receiver respectively, compare the audio signal and the ambient sound to adjust an amplification volume of the audio signal, and play the audio signal at the amplification volume through the speaker.

Abstract: A semiconductor package includes a semiconductor die including a sensing component, an encapsulant laterally covering the semiconductor die, a through insulator via (TIV) and a dummy TIV penetrating through the encapsulant, a patterned dielectric layer disposed on the top surfaces of the encapsulant and the semiconductor die, a conductive pattern disposed on and inserted into the patterned dielectric layer to be in contact with the TIV and the semiconductor die, and a first dummy conductive pattern disposed on the patterned dielectric layer and connected to the dummy TIV. The top surface of the encapsulant is above and rougher than a top surface of the semiconductor die, and the sensing component is accessibly exposed by the patterned dielectric layer.

Abstract: A package includes a die and a redistribution structure. The die has an active surface and is wrapped around by an encapsulant. The redistribution structure disposed on the active surface of the die and located above the encapsulant, wherein the redistribution structure comprises a conductive via connected with the die, a routing pattern located above and connected with the conductive via, and a seal ring structure, the seal ring structure includes a first seal ring element and a second seal ring element located above and connected with the first seal ring element, wherein the second seal ring element includes a seed layer sandwiched between the first seal ring element and the second seal ring element, and a top surface of the first seal ring element is substantially coplanar with a top surface of the conductive via.