Patents by Inventor Chi Chu
Chi Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10937400Abstract: A cable-driven beater mechanism for a percussion instrument has a base, a transmission shaft pivotally mounted on the base, a beater connected to the transmission shaft, a cable transmission assembly, a restoring spring and a cable. An elongated guiding slot is formed in the standing plate. The cable transmission assembly is pivotally mounted on the base and protrudes into the guiding slot. The cable and the transmission shaft are connected via the cable transmission assembly. Pulling force from a player is transferred via the cable to pivot the transmission shaft and the beater. The restoring spring returns the transmission shaft and the beater to an original position. The cable moves along a straight line during operation to reduce rubbing and repeated bending of the cable, which prolongs service life of the cable, reduces noise during operation, and allows the beater to respond more swiftly to the pulling force.Type: GrantFiled: March 31, 2020Date of Patent: March 2, 2021Assignee: RELIANCE INTERNATIONAL CORP.Inventors: Pei-Chi Chu, Cheng-Lin Ho, Wei-Ting Chen, Chi-Chia Huang
-
Publication number: 20200387510Abstract: Method and apparatus for stress management in a searchable data service. The searchable data service may provide a searchable index to a backend data store, and an interface to build and query the searchable index, that enables client applications to search for and retrieve locators for stored entities in the backend data store. Embodiments of the searchable data service may implement a distributed stress management mechanism that may provide functionality including, but not limited to, the automated monitoring of critical resources, analysis of resource usage, and decisions on and performance of actions to keep resource usage within comfort zones. In one embodiment, in response to usage of a particular resource being detected as out of the comfort zone on a node, an action may be performed to transfer at least part of the resource usage for the local resource to another node that provides a similar resource.Type: ApplicationFiled: May 22, 2020Publication date: December 10, 2020Applicant: Amazon Technologies, Inc.Inventors: Patrick W. Ransil, Aleksey Martynov, James Larson, James R. Collette, Robert Wai-Chi Chu, Partha Saha
-
Patent number: 10862988Abstract: Methods and systems for operating a sensor network are provided. In one example, a server may provide graphical data representing a hierarchical sensor network for displaying at a client device. The server may receive a selection to display sensor data from a first node of the nodes of the hierarchical sensor network and determine, based on the selection, a hierarchical sensor label associated with one or more first sensors of the hierarchical sensor network corresponding to the first node. The server may also receive a plurality of messages including sensor data generated by a plurality of sensors of the hierarchical sensor network from an in-bound real-time message processor, and identify a first set of messages based on the hierarchical sensor label. The server may extract the sensor data from the first set of messages and provide the sensor data for displaying at the client device.Type: GrantFiled: December 18, 2017Date of Patent: December 8, 2020Assignee: The Chinese University of Hong KongInventors: Waiman Cheung, Sung-Chi Chu, Chun Yip Leung, Kwong Man Cheng
-
Publication number: 20200356566Abstract: Method and apparatus for stress management in a searchable data service. The searchable data service may provide a searchable index to a backend data store, and an interface to build and query the searchable index, that enables client applications to search for and retrieve locators for stored entities in the backend data store. Embodiments of the searchable data service may implement a distributed stress management mechanism that may provide functionality including, but not limited to, the automated monitoring of critical resources, analysis of resource usage, and decisions on and performance of actions to keep resource usage within comfort zones. In one embodiment, in response to usage of a particular resource being detected as out of the comfort zone on a node, an action may be performed to transfer at least part of the resource usage for the local resource to another node that provides a similar resource.Type: ApplicationFiled: May 22, 2020Publication date: November 12, 2020Applicant: Amazon Technologies, Inc.Inventors: Patrick W. Ransil, Aleksey Martynov, James Larson, James R. Collette, Robert Wai-Chi Chu, Partha Saha
-
Patent number: 10789251Abstract: Method and apparatus for stress management in a searchable data service. The searchable data service may provide a searchable index to a backend data store, and an interface to build and query the searchable index, that enables client applications to search for and retrieve locators for stored entities in the backend data store. Embodiments of the searchable data service may implement a distributed stress management mechanism that may provide functionality including, but not limited to, the automated monitoring of critical resources, analysis of resource usage, and decisions on and performance of actions to keep resource usage within comfort zones. In one embodiment, in response to usage of a particular resource being detected as out of the comfort zone on a node, an action may be performed to transfer at least part of the resource usage for the local resource to another node that provides a similar resource.Type: GrantFiled: August 28, 2015Date of Patent: September 29, 2020Assignee: Amazon Technologies, Inc.Inventors: Patrick W. Ransil, Aleksey V. Martynov, James S. Larson, James R. Collette, Robert Wai-Chi Chu, Partha Saha
-
Publication number: 20200294915Abstract: A package structure includes a semiconductor die and a first redistribution circuit structure. The first redistribution circuit structure is disposed on and electrically connected to the semiconductor die, and includes a first build-up layer. The first build-up layer includes a first metallization layer and a first dielectric layer laterally wrapping the first metallization layer, wherein at least a portion of the first metallization layer is protruded out of the first dielectric layer.Type: ApplicationFiled: March 14, 2019Publication date: September 17, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu, Wei-Chih Chen
-
Publication number: 20200294930Abstract: A package structure includes a plurality of semiconductor die, an insulating encapsulant and a redistribution layer. Each of the plurality of semiconductor dies includes a semiconductor substrate, conductive pads disposed on the semiconductor substrate, conductive posts disposed on the conductive pads, and at least one alignment mark located on the semiconductor substrate. The insulating encapsulant is encapsulating the plurality of semiconductor dies. The redistribution layer is disposed on the insulating encapsulant and electrically connected to the plurality of semiconductor dies.Type: ApplicationFiled: March 14, 2019Publication date: September 17, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu
-
Patent number: 10772141Abstract: Methods and systems for peer-to-peer communication are provided. In one example, a first device may receive, from a server, a pairing code and a first handshake code. The first device may transmit at least a first portion of the pairing code in a first broadcast message and receive, from the second device, a second broadcast message. The first device may authenticate the second device based on at least a second portion of the pairing code in the second broadcast message. The first device may establish a wireless peer-to-peer communication channel with the second device, and receive, from the second device, a second handshake code via the wireless peer-to-peer communication channel. The first device may authorize the second party to engage in an offline interaction with the first party based on the first handshake code and the second handshake code.Type: GrantFiled: June 28, 2018Date of Patent: September 8, 2020Assignee: The Chinese University of Hong KongInventors: Waiman Cheung, Sung-Chi Chu, Chun Yip Leung, Kwong Man Cheng, Pan Kwok
-
Publication number: 20200227357Abstract: A method includes encapsulating a device die in an encapsulating material, forming a first dielectric layer over the device die and the encapsulating material, forming first redistribution lines extending into the first dielectric layer to electrically couple to the device die, forming an alignment mark over the first dielectric layer, wherein the alignment mark includes a plurality of elongated strips, forming a second dielectric layer over the first redistribution lines and the alignment mark, and forming second redistribution lines extending into the second dielectric layer to electrically couple to the first redistribution lines. The second redistribution lines are formed using the alignment mark for alignment.Type: ApplicationFiled: March 30, 2020Publication date: July 16, 2020Inventors: Jhih-Yu Wang, Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo
-
Patent number: 10664375Abstract: Method and apparatus for stress management in a searchable data service. The searchable data service may provide a searchable index to a backend data store, and an interface to build and query the searchable index, that enables client applications to search for and retrieve locators for stored entities in the backend data store. Embodiments of the searchable data service may implement a distributed stress management mechanism that may provide functionality including, but not limited to, the automated monitoring of critical resources, analysis of resource usage, and decisions on and performance of actions to keep resource usage within comfort zones. In one embodiment, in response to usage of a particular resource being detected as out of the comfort zone on a node, an action may be performed to transfer at least part of the resource usage for the local resource to another node that provides a similar resource.Type: GrantFiled: August 28, 2015Date of Patent: May 26, 2020Assignee: Amazon Technologies, Inc.Inventors: Patrick W. Ransil, Aleksey V. Martynov, James S. Larson, James R. Collette, Robert Wai-Chi Chu, Partha Saha
-
Patent number: 10664478Abstract: Method and apparatus for stress management in a searchable data service. The searchable data service may provide a searchable index to a backend data store, and an interface to build and query the searchable index, that enables client applications to search for and retrieve locators for stored entities in the backend data store. Embodiments of the searchable data service may implement a distributed stress management mechanism that may provide functionality including, but not limited to, the automated monitoring of critical resources, analysis of resource usage, and decisions on and performance of actions to keep resource usage within comfort zones. In one embodiment, in response to usage of a particular resource being detected as out of the comfort zone on a node, an action may be performed to transfer at least part of the resource usage for the local resource to another node that provides a similar resource.Type: GrantFiled: July 3, 2014Date of Patent: May 26, 2020Assignee: Amazon Technologies, Inc.Inventors: Patrick W. Ransil, Aleksey V. Martynov, James S. Larson, James R. Collette, Robert Wai-Chi Chu, Partha Saha
-
Patent number: 10631445Abstract: An electronic assembly with RFI shielding including a circuit board, a high frequency electromagnetic radiation device, and a shielding cover is provided. The circuit board includes a connector. The high frequency electromagnetic radiation device is detachably inserted to the connector of the circuit board to be electrically connected with the circuit board. The shielding cover is detachably assembled to the connector to be opened or closed relative to the circuit board. The shielding cover shields high frequency radiation generated by the high frequency electromagnetic radiation device when the shielding cover is in a closed state, and at least a portion of the shielding cover contacts the circuit board in the closed state, and the shielding cover is electrically connected to a grounding portion of the circuit board via the connector.Type: GrantFiled: December 20, 2017Date of Patent: April 21, 2020Assignee: COMPAL ELECTRONICS, INC.Inventors: Chin-Hsien Chang, Shang-Chu Chien, Ting-Tuan Chang, Chi-Chu Chen
-
Patent number: 10607941Abstract: A method includes encapsulating a device die in an encapsulating material, forming a first dielectric layer over the device die and the encapsulating material, forming first redistribution lines extending into the first dielectric layer to electrically couple to the device die, forming an alignment mark over the first dielectric layer, wherein the alignment mark includes a plurality of elongated strips, forming a second dielectric layer over the first redistribution lines and the alignment mark, and forming second redistribution lines extending into the second dielectric layer to electrically couple to the first redistribution lines. The second redistribution lines are formed using the alignment mark for alignment.Type: GrantFiled: April 30, 2018Date of Patent: March 31, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jhih-Yu Wang, Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo
-
Publication number: 20200083189Abstract: A package structure includes a semiconductor die and a redistribution circuit structure. The redistribution circuit structure is disposed on and electrically connected to the semiconductor die and includes a patterned conductive layer, a dielectric layer, and an inter-layer film. The dielectric layer is disposed on the patterned conductive layer. The inter-layer film is sandwiched between the dielectric layer and the patterned conductive layer, and the patterned conductive layer is separated from the dielectric layer through the inter-layer film.Type: ApplicationFiled: May 15, 2019Publication date: March 12, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Po-Han Wang, Yung-Chi Chu, Hung-Chun Cho
-
Patent number: 10537008Abstract: An apparatus for driving LEDs using high voltage includes two LED driving circuits and two switches controlled by a universal controller so as to connect the two LED driving circuits in two different configurations. Each LED driving circuit has an LED unit formed by a plurality of LED segments. Each LED segment has an associated bypass switch controlled by an LED controller to bypass or connect the LED segment in the LED unit. When an input voltage ranges from rectified 90 volt AC to rectified 140 volt AC, the two switches are controlled to connect the two LED driving circuits in parallel. When the input voltage ranges from rectified 180 volt AC to rectified 265 volt AC, the two switches are controlled to connect the LED segments of the LED unit in one LED driving circuit in series with the other LED driving circuit.Type: GrantFiled: June 30, 2017Date of Patent: January 14, 2020Assignee: VastView Technology Inc.Inventors: Hung-Chi Chu, Yuhren Shen
-
Publication number: 20200008251Abstract: Methods and systems for peer-to-peer communication are provided. In one example, a first device may receive, from a server, a pairing code and a first handshake code. The first device may transmit at least a first portion of the pairing code in a first broadcast message and receive, from the second device, a second broadcast message. The first device may authenticate the second device based on at least a second portion of the pairing code in the second broadcast message. The first device may establish a wireless peer-to-peer communication channel with the second device, and receive, from the second device, a second handshake code via the wireless peer-to-peer communication channel. The first device may authorize the second party to engage in an offline interaction with the first party based on the first handshake code and the second handshake code.Type: ApplicationFiled: June 28, 2018Publication date: January 2, 2020Inventors: Waiman Cheung, Sung-Chi Chu, Chun Yip Leung, Kwong Man Cheng, Pan Kwok
-
Publication number: 20190385951Abstract: A package includes a die and a redistribution structure. The die has an active surface and is wrapped around by an encapsulant. The redistribution structure disposed on the active surface of the die and located above the encapsulant, wherein the redistribution structure comprises a conductive via connected with the die, a routing pattern located above and connected with the conductive via, and a seal ring structure, the seal ring structure includes a first seal ring element and a second seal ring element located above and connected with the first seal ring element, wherein the second seal ring element includes a seed layer sandwiched between the first seal ring element and the second seal ring element, and a top surface of the first seal ring element is substantially coplanar with a top surface of the conductive via.Type: ApplicationFiled: June 15, 2018Publication date: December 19, 2019Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yung-Chi Chu, Hung-Jui Kuo, Jhih-Yu Wang, Yu-Hsiang Hu
-
Publication number: 20190385975Abstract: An integrated fan-out (InFO) package includes an encapsulant, a die, a plurality of conductive structures, and a redistribution structure. The die and the conductive structures are encapsulated by the encapsulant. The conductive structures surround the die. The redistribution structure is disposed on the encapsulant. The redistribution structure includes a plurality of routing patterns, a plurality of conductive vias, and a plurality of alignment marks. The conductive vias interconnects the routing patterns. At least one of the alignment mark is in physical contact with the encapsulant.Type: ApplicationFiled: June 15, 2018Publication date: December 19, 2019Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu
-
Publication number: 20190333862Abstract: A method includes encapsulating a device die in an encapsulating material, forming a first dielectric layer over the device die and the encapsulating material, forming first redistribution lines extending into the first dielectric layer to electrically couple to the device die, forming an alignment mark over the first dielectric layer, wherein the alignment mark includes a plurality of elongated strips, forming a second dielectric layer over the first redistribution lines and the alignment mark, and forming second redistribution lines extending into the second dielectric layer to electrically couple to the first redistribution lines. The second redistribution lines are formed using the alignment mark for alignment.Type: ApplicationFiled: April 30, 2018Publication date: October 31, 2019Inventors: Jhih-Yu Wang, Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo
-
Patent number: 10335692Abstract: An apparatus for recording game history is coupled between a game host and a game console and performs a game history recording and interaction method. The apparatus communicates with the game host through a first wireless unit, and communicates with the game console through a second wireless unit, to receive game operation information generated from operations of the game console. The apparatus receives a video signal outputted by the game host through a video input port. The processing module is coupled to the wireless units and the video input port respectively and is used to obtain the game operation information from the wireless units and generate operation information images corresponding to the game operation information. The processing module superimposes the operation information images on the video signal correspondingly to form game history video data and outputs the superimposed game history video data to a display device for display.Type: GrantFiled: July 16, 2018Date of Patent: July 2, 2019Assignee: Aten International Co., Ltd.Inventors: Kuo-feng Kao, Hung-Chi Chu, Hui-Ju Lin, Chia-Chih Chen