Patents by Inventor Chi Lee

Chi Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Additively manufactured thermoset polymers for metal plating and metal plated parts formed therefrom
    Patent number: 11692049
    Abstract: A thermoset resin for forming parts to be metal plated includes a vat photopolymerization (VPP) thermoset resin and an etchable phase disposed in the VPP thermoset resin. The etchable phase is etched from a surface of a part formed from the VPP thermoset resin such that a plurality of micro-mechanical locking sites is formed on the surface of the part. The etchable phase is at least one of organic particles, organic resins, inorganic particles, and copolymers of the VPP thermoset resin. For example, the etchable phase can be a polybutadiene phase and/or a mineral such as calcium carbonate.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: July 4, 2023
    Assignee: Ford Global Technologies, LLC
    Inventors: Xiaojiang Wang, Shannon Christine Bollin, Robert D. Bedard, Matthew Cassoli, Ellen Cheng-chi Lee
  • SEMICONDUCTOR PACKAGE
    Publication number: 20230207524
    Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.
    Type: Application
    Filed: February 28, 2023
    Publication date: June 29, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang Chi LEE, Jung Jui KANG, Chiu-Wen LEE, Li Chieh CHEN
  • ULTRASONIC EXTRACTION EQUIPMENT
    Publication number: 20230201742
    Abstract: An ultrasonic extraction equipment includes a solution tank and a plurality of ultrasonic transducers. The ultrasonic transducers are disposed on an outer surface of the solution tank. The ultrasonic transducers include a central ultrasonic transducer and a plurality of peripheral ultrasonic transducers arranged to surround the central ultrasonic transducer.
    Type: Application
    Filed: December 12, 2022
    Publication date: June 29, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-Hsuan FAN, Shu-Hsien TSAI, Shih-Chi LEE, Chuan-Chi CHIEN
  • LIGHT EMISSION MODULE, LIGHT DETECTION AND RANGING SYSTEM AND LIGHT SCANNING METHOD
    Publication number: 20230194674
    Abstract: A light emission module includes a laser source, a beam steering element and a scanning-angle expanding lens set. The laser source is used for emitting a laser beam. The beam steering element is used for receiving the laser beam and splitting the laser beam into at least two laser beams. The scanning-angle expanding lens set, adjacent to the beam steering element, is configured to receive and integrate the at least two laser beams, and to control a spanning angle and a scanning angle between the at least two laser beams on a scanned object. The spanning angle is a visual angle of a vertical scan direction of the scanned object, and the scanning angle is another visual angle of a horizontal scan direction of the scanned object. In addition, a light emission module and a light scanning method are also provided.
    Type: Application
    Filed: December 22, 2021
    Publication date: June 22, 2023
    Inventors: CHIA-YU HU, YI-CHI LEE, YUAN-DI CHEN, JI-BIN HORNG
  • Integrated Assemblies and Methods Forming Integrated Assemblies
    Publication number: 20230178586
    Abstract: Some embodiments include an integrated assembly having a laterally-extending container-shaped first capacitor electrode, and having a laterally-extending container-shaped second capacitor electrode laterally offset from the first capacitor electrode. Capacitor dielectric material lines interior surfaces and exterior surfaces of the container-shaped first and second capacitor electrodes. A shared capacitor electrode extends vertically between the first and second capacitor electrodes, and extends along the lined interior and exterior surfaces of the first and second capacitor electrodes. Some embodiments include methods of forming integrated assemblies.
    Type: Application
    Filed: January 27, 2023
    Publication date: June 8, 2023
    Applicant: Micron Technology, Inc.
    Inventor: Che-Chi Lee
  • AUTOSTEREOSCOPIC DISPLAY DEVICE AND METHOD
    Publication number: 20230156175
    Abstract: An autostereoscopic display device and a method are provided. The autostereoscopic display device includes a display panel, a plurality of collimation units, and a plurality of refraction units. The display panel has a plurality of pixel groups, each of the pixel groups includes a plurality of pixels, all of the pixels are arranged in an array, and the display panel emits image light in a light-emitting direction. Each of the collimation units is located at one side of at least one pixel to receive the image light, and each of the collimation units converges the image light into collimated image light. Each of the refraction units is located in front of at least one pixel on two sides of a center of the pixel group, so as to receive the collimated image light and refract the collimated image light into refraction image light.
    Type: Application
    Filed: March 31, 2022
    Publication date: May 18, 2023
    Inventor: Tung-Chi Lee
  • TIME DELAY INTEGRATION SENSOR HANDLING DEFECT PIXELS
    Publication number: 20230123405
    Abstract: The present disclosure provides a time delay integration (TDI) sensor using a rolling shutter. The TDI sensor includes multiple pixel columns. Each pixel column includes multiple pixels arranged in an along-track direction, wherein two adjacent pixels or two adjacent pixel groups in every pixel column have a separation space therebetween. The separation space is equal to a pixel height multiplied by a time ratio of a line time difference of the rolling shutter and a frame period, or equal to a summation of at least one pixel height and a multiplication of the pixel height by the time ratio of the line time difference and the frame period. The TDI sensor further records defect pixels of a pixel array such that in integrating pixel data to integrators, the pixel data associated with the defect pixels is not integrated into corresponding integrators.
    Type: Application
    Filed: June 27, 2022
    Publication date: April 20, 2023
    Inventors: Ren-Chieh LIU, Chao-Chi LEE, Yi-Yuan CHEN, En-Feng HSU
  • BATTERY MODULE AND BATTERY SYSTEM
    Publication number: 20230103073
    Abstract: A battery module is provided. The battery module includes a battery enclosure and a plurality of cell assemblies. The battery enclosure includes a front plate, a fluid inlet, a fluid outlet, and a plurality of enclosure interfaces. The fluid inlet is disposed on the front plate for a fluid to flow into the battery enclosure. The fluid outlet is disposed on the front plate for the fluid to flow out of the battery enclosure. The plurality of enclosure interfaces is disposed on the front plate. Each of the plurality of cell assemblies has a plurality of assembly electrodes and is installed in the battery enclosure. Each of the plurality of assembly electrodes is respectively coupled to one of the plurality of enclosure interfaces and electrically exposed to an outside of the front plate.
    Type: Application
    Filed: September 7, 2022
    Publication date: March 30, 2023
    Inventors: Yu-Chieh HUANG, Kai-Hsiang TU, Hung-Chi LEE, De-Shiuan HUANG, Keng-Ta SU
  • Integrated assemblies and methods forming integrated assemblies
    Patent number: 11616119
    Abstract: Some embodiments include an integrated assembly having a laterally-extending container-shaped first capacitor electrode, and having a laterally-extending container-shaped second capacitor electrode laterally offset from the first capacitor electrode. Capacitor dielectric material lines interior surfaces and exterior surfaces of the container-shaped first and second capacitor electrodes. A shared capacitor electrode extends vertically between the first and second capacitor electrodes, and extends along the lined interior and exterior surfaces of the first and second capacitor electrodes. Some embodiments include methods of forming integrated assemblies.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: March 28, 2023
    Assignee: Micron Technology, Inc.
    Inventor: Che-Chi Lee
  • COAXIAL VIA SHIELDED INTERPOSER
    Publication number: 20230063808
    Abstract: A coaxial interposer may shield certain signals (e.g., noisy signals, high speed signals, radio frequency (RF) signals) transmitted through an electronic device. The coaxial interposer may include a coaxial via that includes an outer barrel of non-conductive material and an inner barrel of non-conductive material separated by a conductive barrel. Further, the outer barrel of non-conductive material may be enclosed by an outer metal coating. The coaxial via serves to internally shield each signals transmitted between layers of a printed circuit board (PCB) within the electronic device.
    Type: Application
    Filed: September 2, 2021
    Publication date: March 2, 2023
    Inventors: Nima Shahidi, Meng Chi Lee
  • Semiconductor package
    Patent number: 11594518
    Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: February 28, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chang Chi Lee, Jung Jui Kang, Chiu-Wen Lee, Li Chieh Chen
  • DENTAL WATER JET DEVICE AND WATER TANK THEREOF
    Publication number: 20230054087
    Abstract: A water tank used for a dental water jet device includes a box and a water pipe. The box has a top and a bottom opposite to each other. An upper side of the bottom facing the top has a water guiding surface and a water collecting area. The water guiding surface extends obliquely downward from an edge of the upper side to the water collecting area. The water pipe extends from the water collecting area to pass through the top, and has a water outlet above the top. A dental water jet device having the water tank is also provided.
    Type: Application
    Filed: October 1, 2021
    Publication date: February 23, 2023
    Inventor: Jian-Chi Lee
  • Operating system with automatic login mechanism and automatic login method
    Patent number: 11588808
    Abstract: An operating system with automatic login mechanism and an automatic login method are provided. The operating system includes a first electronic device, a second electronic device and a server device. The second electronic device includes a biometric sensor. When a login event of the first electronic is triggered, the first electronic device sends a login request to the second electronic device directly or via the server device, so that the second electronic device performs a biometric verification by the biometric sensor according to the login request. When the biometric verification is passed, the second electronic device sends a first login credential to the first electronic device directly or via the server device, so that the first electronic device performs an automatic login operation of the first electronic device according to the first login credential.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: February 21, 2023
    Assignee: GoTrustID Inc.
    Inventors: Darren Tien-Chi Lee, Minglian Chen, Jeng-Lung Li, Yi-Kai Wang
  • PROCESS OPERATION SYSTEM AND PROCESS OPERATION METHOD
    Publication number: 20230009722
    Abstract: A process operating system includes a process control platform, a process operating platform and an endpoint task robot. The process control platform is configured to receive operation information, extract a task from the operation information using a semantic analysis method, and publish the task. The process operating platform is configured to receive the task and store the task in a task queue. After receiving the task, the process operating platform defines a processing flow based on the task, and sorts the order of the task in the task queue. The endpoint task robot is configured to automatically obtain the task from the process operation platform, executes the task according to the processing flow. It then writes the execution result into the log queue and transmits the execution result to the process control platform.
    Type: Application
    Filed: September 2, 2021
    Publication date: January 12, 2023
    Inventors: Chen-Chung LEE, Chun-Hung CHEN, Chien-Kuo HUNG, Wen-Kuang CHEN, En-Chi LEE
  • Stabilized additive manufacturing articles
    Patent number: 11542384
    Abstract: An additive article stabilizing method includes prior to polymerization, adding a radiation-activated stabilizing composition to a liquid resin, forming the article from the liquid resin, layer by layer, using radiation such that the stabilizing composition does not stabilize the liquid resin but the formed article, and neutralizing free radicals generated during a degradation process initiated by exposure of the article to additional radiation post-cure.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: January 3, 2023
    Assignee: Ford Global Technologies, LLC
    Inventors: Emily Ann Ryan, Mark Edward Nichols, Ellen Cheng-Chi Lee, Christopher Michael Seubert, Deborah Frances Mielewski, Nicholas Ryan Gunther, Matthew Linden Bedell
  • SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20220415851
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a carrier, a first electronic component, a second electronic component, a third electronic component, a fourth electronic component, and a connection element. The first electronic component is disposed over a surface of the carrier. The second electronic component is disposed over the first electronic component. The third electronic component is spaced apart from the first electronic component and disposed over the surface of the carrier. The fourth electronic component is disposed over the third electronic component. The connection element is electrically connecting the second electronic component to the fourth electronic component.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 29, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Chi LEE, Jyan-Ann HSIA
  • Methods for determining and controlling battery expansion
    Patent number: 11539086
    Abstract: Methods and systems for detecting and compensating for expansion of rechargeable batteries over time. An expansion detector may be coupled to or positioned proximate a rechargeable battery to monitor for expansion thereof. After expansion exceeding a selected threshold is detected, the expansion detector may report the expansion to an associated processing unit. The processing unit may undertake to arrest further rechargeable battery expansion by modifying or changing one or more characteristics of charging and/or discharging circuitry coupled to the rechargeable battery. For example, the processing unit may charge the rechargeable battery at a lower rate or with reduced voltage after detecting expansion.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: December 27, 2022
    Assignee: APPLE INC.
    Inventors: Daniel W. Jarvis, David M. DeMuro, Hongli Dai, Julian Malinski, Julien Marcil, Meng Chi Lee, Richard Hung Minh Dinh, Rishabh Bhargava, Steven D. Sterz, Richard M. Mank, Soundararajan Manthiri, Vijayasekaran Boovaragavan
  • Method for recovering lithium
    Patent number: 11530133
    Abstract: A method for recovering lithium is provided. The method includes the following steps. A lithium-containing solution is provided. A manganese oxide adsorbent is immersed in the lithium-containing solution, and a reducing agent is added to carry out an adsorption reaction, and the manganese oxide adsorbent is immersed in a solution containing an oxidizing agent to carry out a desorption reaction.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: December 20, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Li-Ching Chung, Guan-You Lin, Yi Ting Wang, Chun-Chi Lee, Tzu Yu Cheng, Shing-Der Chen, Kuan-Foo Chang, Hsin Shao
  • SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20220392871
    Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.
    Type: Application
    Filed: June 3, 2021
    Publication date: December 8, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang Chi LEE, Jung Jui KANG, Chiu-Wen LEE, Li Chieh CHEN
  • DUMMY POLY LAYOUT FOR HIGH DENSITY DEVICES
    Publication number: 20220384416
    Abstract: An array of poly lines on an active device area of an integrated chip is extended to form a dummy device structure on an adjacent isolation region. The resulting dummy device structure is an array of poly lines having the same line width, line spacing, and pitch as the array of poly lines on the active device area. The poly lines of the dummy device structure are on grid with the poly lines on the active device area. Because the dummy device structure is formed of poly lines that are on grid with the poly lines on the active device area, the dummy device structure may be much closer to the active device area than would otherwise be possible. The resulting proximity of the dummy device structure to the active device area improves anti-dishing performance and reduces empty space on the integrated chip.
    Type: Application
    Filed: August 5, 2022
    Publication date: December 1, 2022
    Inventors: Yung Feng Chang, Bao-Ru Young, Yu-Jung Chang, Tzung-Chi Lee, Tung-Heng Hsieh, Chun-Chia Hsu