Patents by Inventor Chi Lee

Chi Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Peripheral and control method of control component thereof
    Patent number: 11172080
    Abstract: A peripheral includes a body, an image processing device and a processor. The body includes a sub-housing and a second button. The sub-housing includes a control component. The control component includes a first button disposed on an upper surface of the sub-housing. The second button and the first button are disposed on different adjacent surfaces. The image processing device is disposed above or in the body. The image processing device is disposed above the body. The processor controls a first signal generated by the first button to be the same as a first signal generated by the second button. The sub-housing is disposed on an upper lateral side of the body.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: November 9, 2021
    Assignee: AVISION INC.
    Inventors: Shao-Lan Sheng, Chia-Ching Lin, Xiang Chi Lee
  • Low-spurious electric-field inductor design
    Patent number: 11164694
    Abstract: Inductors that generate a reduced spurious electric-field. One example can provide an inductor where the terminals of the inductor are located at positions that reduce the spurious electric field by determining the types of signals conveyed at the terminals of the inductor and then selecting locations for the terminals based on that determination. For example, where a dynamic differential signal is applied to the inductor, the terminals of the inductor can be positioned near a physical center of the inductor.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: November 2, 2021
    Assignee: Apple Inc.
    Inventors: Daniel P. Kumar, Frank Y. Yuan, Xinbo He, Rajarshi Paul, Meng Chi Lee
  • METHODS OF POST-CURING ADDITIVE MANUFACTURING PARTS USING ELECTRON BEAMS
    Publication number: 20210331394
    Abstract: A method of forming a part includes 3D printing a photopolymerizable resin and forming a preformed part and subsequently post-curing the preformed part with electron beams. The preformed part may be cured via UV curing. A section of the preformed part post-cured with electron beams may have a thickness of at least 1.0 centimeter, for example, at least 2.0 centimeters or at least 3.0 centimeters. An electron beam dosage to post-cure the preformed part may be between 10 kilogray (kGy) and 100 kGy. The preformed part may be 3D printed using stereolithography (SLA), digital light processing (DLP) or material jetting (MJ) and the photopolymerizable resin may include at least one of an acrylate functional polymer and a methacrylate functional polymer. In the alternative, or in addition to, the photopolymerizable resin may include at least one of a urethane, a polyester, and a polyether.
    Type: Application
    Filed: July 9, 2021
    Publication date: October 28, 2021
    Applicant: Ford Global Technologies, LLC
    Inventors: Christopher Michael Seubert, Mark Edward Nichols, Ellen Cheng-chi Lee
  • METHOD FOR SUPPRESSION OF HEPAPITIS B VIRUS REPLICATION AND HEPAPITIS B VIRUS SURFACE ANTIGEN SECRETION
    Publication number: 20210324084
    Abstract: A pharmaceutical composition for use in treating hepatitis B virus (HBV) infection includes an effective amount of an antibody against CD11b or a binding fragment thereof. A method for treating hepatitis B virus infection includes administering to a subject in need thereof an antibody against CD11b. Anti-CD11b antibody binding to CD11b may trigger immunostimulatory responses, as evidenced by the following observations: increased surface expression of MHC II and CD86 in CD11b+ peripheral blood mononuclear cells (PBMCs); suppressed level of hepatitis B surface antigen (HBsAg) and HBV DNA in the blood; and accelerated clearance of HBV from liver.
    Type: Application
    Filed: August 9, 2019
    Publication date: October 21, 2021
    Applicant: Ascendo Biotechnology, Inc.
    Inventors: Yen-Ta LU, Ping-Yen HUANG, Chia-Ming CHANG, I-Fang TSAI, Frank Wen-Chi LEE, Huei-Ling CHANG
  • Semiconductor device package including thermal dissipation element and method of manufacturing the same
    Patent number: 11127650
    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first die, a second die, and a thermal dissipation element. The first die has a first surface. The second die is disposed on the first surface. The thermal dissipation element is disposed on the first surface. The thermal dissipation element includes a first portion extending in a first direction substantially parallel to the first surface and partially covered by the second die and a second portion extending in a second direction substantially perpendicular to the first surface to be adjacent to an edge of the second die.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: September 21, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chien Lin Chang Chien, Chiu-Wen Lee, Hung-Jung Tu, Chang Chi Lee, Chin-Li Kao
  • Touch display panel
    Patent number: 11112921
    Abstract: A touch display panel includes a first sensing matrix and a second sensing matrix. The first sensing matrix includes a plurality of grid units and a first switch unit. The grid units are arranged in matrix, wherein each grid unit includes at least one first electrode. The first switch unit includes a plurality of switches, and the switches are disposed between adjacent grid units. Wherein, the control end of the switches is configured to receive a first controlling signal, and one end of each of the switches is configured to output a sensing signal. The second sensing matrix includes at least one second electrode, and is configured to receive a common signal. The second sensing matrix includes a plurality of opening units, and each opening unit overlaps with the open area of each pixel circuit in a vertical projection direction of the first substrate.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: September 7, 2021
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Chia-Chi Lee, Chi-Cheng Chen, Jing-Siang Syu, Shu-Wen Tzeng, Gui-Wen Liu, Zeng-De Chen, Wen-Rei Guo
  • SEMICONDUCTOR DEVICE PACKAGE INCLUDING THERMAL DISSIPATION ELEMENT AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210265231
    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first die, a second die, and a thermal dissipation element. The first die has a first surface. The second die is disposed on the first surface. The thermal dissipation element is disposed on the first surface. The thermal dissipation element includes a first portion extending in a first direction substantially parallel to the first surface and partially covered by the second die and a second portion extending in a second direction substantially perpendicular to the first surface to be adjacent to an edge of the second die.
    Type: Application
    Filed: February 24, 2020
    Publication date: August 26, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien Lin CHANG CHIEN, Chiu-Wen LEE, Hung-Jung TU, Chang Chi LEE, Chin-Li KAO
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210265273
    Abstract: A semiconductor device package includes a plurality of semiconductor chips and an interposer structure. The interposer structure has a plurality of tiers for accommodating the plurality of semiconductor chips. The interposer structure includes at least one conductive via connecting to a pad of the plurality of semiconductor chips.
    Type: Application
    Filed: February 21, 2020
    Publication date: August 26, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien Lin CHANG CHIEN, Chiu-Wen LEE, Ian HU, Chang Chi LEE
  • TOUCH PANEL
    Publication number: 20210255722
    Abstract: A touch panel includes a substrate, touch signal lines, sub-pixels, touch electrode groups, and at least one common signal array. The touch signal lines and the sub-pixels are located on substrate. Each of the sub-pixels includes a switch element and a pixel electrode. The switch element is electrically connected to a corresponding scan line and a corresponding data line. The touch electrode groups include touch electrodes. The touch electrodes overlap the pixel electrodes of the sub-pixels. Each of the touch electrode groups is electrically connected to a corresponding one of the touch signal lines. The common signal array includes common electrodes. Each of the common electrodes overlaps at least one of the scan line and the data line. The number of the sub-pixels overlapped by the common signal array is greater than the number of the sub-pixels overlapped by each of the touch electrode groups.
    Type: Application
    Filed: July 20, 2020
    Publication date: August 19, 2021
    Applicant: Au Optronics Corporation
    Inventors: Chia-Chi Lee, Sheng-Chin Fan, Che-Min Lin, Chun-Ru Huang, Chen-Hao Chiang, Yu-Hsin Hsieh, Zeng-De Chen
  • DUMMY POLY LAYOUT FOR HIGH DENSITY DEVICES
    Publication number: 20210257351
    Abstract: An array of poly lines on an active device area of an integrated chip is extended to form a dummy device structure on an adjacent isolation region. The resulting dummy device structure is an array of poly lines having the same line width, line spacing, and pitch as the array of poly lines on the active device area. The poly lines of the dummy device structure are on grid with the poly lines on the active device area. Because the dummy device structure is formed of poly lines that are on grid with the poly lines on the active device area, the dummy device structure may be much closer to the active device area than would otherwise be possible. The resulting proximity of the dummy device structure to the active device area improves anti-dishing performance and reduces empty space on the integrated chip.
    Type: Application
    Filed: June 16, 2020
    Publication date: August 19, 2021
    Inventors: Yung Feng Chang, Bao-Ru Young, Yu-Jung Chang, Tzung-Chi Lee, Tung-Heng Hsieh, Chun-Chia Hsu
  • FRAME WITH AN OUTER SILICONE LAYER AND A MANUFACTURING METHOD OF FORMING THE SILICONE LAYER ON THE OUTER PART OF FRAME
    Publication number: 20210245411
    Abstract: A frame with an outer silicon layer and a manufacturing method of forming the silicone layer on the outer part of frame are disclosed. The manufacturing method includes a forming step, a combining step and a removing step. First, a pair of mold with a forming space is formed with a silicone carrier including an effective combination region and an ineffective region. An emplacing space is next formed in the effective combination region and a frame is put into the emplacing space. Before putting in the frame, either the outer part of frame or the emplacing space is coated with a silicone coating, and then the effective combination region is combined on the outer part of frame by a secondary sulfurization. Finally, the effective combination region is removed from the ineffective region to form a silicone layer, made of the effective combination region, on the outer part of frame.
    Type: Application
    Filed: April 7, 2020
    Publication date: August 12, 2021
    Inventors: Kuo-Chi LEE, Chin-Hsing LEE, Lei CHENG
  • SPRING LEAF AND A MANUFACTURING METHOD OF MAKING THE SPRING LEAF
    Publication number: 20210246920
    Abstract: A spring leaf and a manufacturing method of making the spring leaf are disclosed. The spring leaf is installed in a casing to replace a butting part on the casing. The spring leaf includes at least a pole, at least an elastic connector, at least an elastic arm, a contact part which contacts the butting part, and a connecting part which is formed between the elastic arm and the contact part by injection molding. The contact part rotates between a positioning location and an escaping location in the casing through an elastic resetting function which is generated by the elastic arm, so as to quickly replace the butting part on the casing.
    Type: Application
    Filed: April 7, 2020
    Publication date: August 12, 2021
    Inventors: Kuo-Chi LEE, Chin-Hsing LEE, Lei CHENG
  • APPLICATION OF PEDF-DERIVED SHORT PEPTIDES IN TENDON HEALING
    Publication number: 20210244791
    Abstract: A method for treating a tendon injury includes administering to a subject in need thereof a pharmaceutical composition comprising a PEDF-derived short peptide (PDSP) or a variant of the PDSP, wherein the PDSP comprises residues 93-106 of human pigmented epithelium-derived factor (PEDF), and wherein the variant of the PDSP contains serine-93, alanine-96, glutamine-98, isoleucine-103, isoleucine-104, and arginine 106 of the PDSP and contains one or more amino acid substitutions at other positions, wherein residue location numbers are based on those in the human PEDF.
    Type: Application
    Filed: April 8, 2019
    Publication date: August 12, 2021
    Applicant: BRIM Biotechnology, Inc.
    Inventors: Frank Wen-Chi Lee, Yuan-Ming Lee, Yeou-Ping Tsao, Tsung-Chuan Ho
  • INJECTION MOLDING METHOD FOR A SEMIFINISHED PRODUCT
    Publication number: 20210245410
    Abstract: An injection molding method for a semifinished product includes a semifinished product emplacement step, a semifinished product pre-compression step and a forming step. First, a pair of mold with a forming space is provided. A semifinished product is put into the mold, and a first joint is performed to the mold by a press-fit jig, fixing the semifinished product in the forming space. The semifinished product is also tightly fitted with the mold. Next, a first open-die is performed and the press-fit jig is removed. After that, a second joint is performed, and a forming material is injected into the forming space. Finally, a second open-die is performed, and then a finished product is formed. By the semifinished product pre-compression step, the forming material can be prevented from resulting in spill or burr on the semifinished product, thereby improving the yield of injection molding.
    Type: Application
    Filed: April 7, 2020
    Publication date: August 12, 2021
    Inventors: Kuo-Chi LEE, Chin-Hsing LEE, Lei CHENG
  • APPLICATION OF PEDF-DERIVED SHORT PEPTIDES IN THE TREATMENT OF OSTEOARTHRITIS
    Publication number: 20210221862
    Abstract: A method for treating and/or preventing osteoarthritis includes administering to a subject in need thereof a pharmaceutical composition comprising a PEDF-derived short peptide (PDSP) or a variant of the PDSP, wherein the PDSP comprises residues 93-106 of human pigmented epithelium-derived factor (PEDF), and wherein the variant of the PDSP contains serine-93, alanine-96, glutamine-98, isoleucine-103, isoleucine-104, and arginine 106 of the PDSP and contains one or more amino acid substitutions at other positions, wherein residue location numbers are based on those in the human PEDF.
    Type: Application
    Filed: April 8, 2019
    Publication date: July 22, 2021
    Applicant: BRIM Biotechnology, Inc.
    Inventors: Frank Wen-Chi Lee, Yuan-Ming Lee, Yeou-Ping Tsao, Tsung-Chuan Ho
  • Adjustable supporting frame
    Patent number: 11067215
    Abstract: An adjustable supporting frame is disclosed for supporting a display. The adjustable supporting frame mainly comprises a base, a upright, a tilting unit, and a rotating unit, wherein the tilting unit pivotally rotates around an axial line of a connecting shaft, and the rotating unit rotates around a virtual axis, the axial line and the virtual axis intersect with each other.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: July 20, 2021
    Assignee: SYNCMOLD ENTERPRISE CORP.
    Inventors: Yuan-Chi Lee, Chih-Hsin Chou, Tung-Chiung Chen, Ching-Hui Yen
  • METHOD FOR RECOVERING LITHIUM
    Publication number: 20210188652
    Abstract: A method for recovering lithium is provided. The method includes the following steps. A lithium-containing solution is provided. A manganese oxide adsorbent is immersed in the lithium-containing solution, and a reducing agent is added to carry out an adsorption reaction, and the manganese oxide adsorbent is immersed in a solution containing an oxidizing agent to carry out a desorption reaction.
    Type: Application
    Filed: August 7, 2020
    Publication date: June 24, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Li-Ching Chung, Guan-You Lin, Yi Ting Wang, Chun-Chi Lee, Tzu Yu Cheng, Shing-Der Chen, Kuan-Foo Chang, Hsin Shao
  • Angle sensing device
    Patent number: 11041708
    Abstract: An angle sensing device including a first object, a second object, a magnetic field source, and a first magnetic sensor is provided. The second object is adapted to be rotated with respect to the first object, so that an inclined angle of the second object with respect to the first object is changed. The magnetic field source is connected to the second object. The first magnetic sensor is connected to the first object, and configured to sense a magnetic field generated by the magnetic field source. When the second object is rotated with respect to the first object, the magnetic field sensed by the first magnetic sensor changes, so that an output signal of the first magnetic sensor corresponding to the magnetic field changes.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: June 22, 2021
    Assignee: iSentek Inc.
    Inventors: Wei-An Hsieh, Fu-Te Yuan, Yen-Chi Lee
  • Server rack with dynamic power management by using baseboard management controllers
    Patent number: 11042202
    Abstract: A server rack includes a plurality of servers, each of which includes: a power management unit operable to convert a DC input voltage into at least one DC output voltage to output at least one type of DC output power; at least one application circuit for being respectively powered by the at least one type of DC output power; and a baseboard management controller cooperating with the power management unit to provide power management data. One of the baseboard management controllers of the servers is for receiving the power management data respectively from the other one(s) of the baseboard management controllers, and controls the power management units of the servers for power management of the servers based on the power management data.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: June 22, 2021
    Inventors: Chia-Hung Tseng, Han-Ching Hsieh, Kuan-Ho Lin, Shun-Chi Lee
  • Metal gate structure and methods thereof
    Patent number: 11043572
    Abstract: Provided is a metal gate structure and related methods that include forming a first fin and a second fin on a substrate. In various embodiments, the first fin has a first gate region and the second fin has a second gate region. By way of example, a metal-gate line is formed over the first and second gate regions. In some embodiments, the metal-gate line extends from the first fin to the second fin, and the metal-gate line includes a sacrificial metal portion. In various examples, a line-cut process is performed to separate the metal-gate line into a first metal gate line and a second gate line. In some embodiments, the sacrificial metal portion prevents lateral etching of a dielectric layer during the line-cut process.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: June 22, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tzung-Chi Lee, Tung-Heng Hsieh, Bao-Ru Young, Chia-Sheng Fan