Abstract: Disclosed herein are methods of treating or preventing a lung disorder comprising administering to a subject a composition comprising an agent that modulates activity and/or expression of Epithelial Membrane Protein 2 (EMP2) in an amount effective to treat or prevent the lung disorder and compositions useful in such for methods.

Abstract: A device for alleviating obstructive sleep apnea includes: a base fixed to a user's head and having a passage; a suction member having a channel passing through the passage to enter the user's oral cavity and move within the passage, with the channel connected to a tongue fixing portion disposed at the tip of the user's tongue, wherein the suction member has a stopping portion disposed outside the oral cavity to limit forward displacement of the tongue fixing portion; a resilient element for providing the tongue fixing portion with an elastic force required to approach the base and being weaker than a suction force between the suction member and the tongue and weaker than a pulling force generated by the tongue in tongue motion; and a negative pressure source communicating with the channel to provide negative pressure to the tongue in contact with the tongue fixing portion.

Abstract: A multiplexer circuit includes first and second fins each extending in an X-axis direction. First, second, third and fourth gates extend in a Y-axis direction perpendicular to the X-axis direction and contact the first and second fins. The first, second, third and fourth gates are configured to receive first, second, third and fourth data signals, respectively. Fifth, sixth, seventh and eighth gates extend in the Y-axis direction and contact the first and second fins, the fifth, sixth, seventh and eighth gates, and are configured to receive the first, second, third and fourth select signals, respectively. An input logic circuit is configured to provide an output at an intermediate node. A ninth gate extends in the Y-axis direction and contacts the first and second fins. An output logic circuit is configured to provide a selected one of the first, second, third and fourth data signals at an output terminal.

Abstract: An apparatus may include an ultrasonic sensor stack, a foldable display stack and a transmission enhancement layer. The foldable display stack may include a display stiffener and display stack layers. The display stack layers may form one or more display stack resonators configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in a first ultrasonic frequency range. In some implementations, a transmission enhancement resonator may include the display stiffener and the transmission enhancement layer. In some examples, the transmission enhancement resonator may include at least a portion of the ultrasonic sensor stack. The transmission enhancement resonator may be configured to enhance the ultrasonic waves transmitted by the ultrasonic sensor stack in the first ultrasonic frequency range.

Abstract: An exemplary endoscope may be provided with a first shaft, a second shaft and an image capture module. The first shaft may extend from a distal end of an endoscope body and may include a distal opening and a proximal opening. The second shaft may extend through an interior of the first shaft and may also include a distal opening and a proximal opening. The image capture module may be in operable communication with the endoscope body distal end. The endoscope may be configured to clear debris from the image capture module with suction when the second shaft proximal opening and first shaft proximal opening are in alignment. Methods of use are also disclosed.

Abstract: A mobile device supporting wideband operations includes an antenna structure that includes a ground element, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, and a fifth radiation element. The first radiation element has a feeding point. The second radiation element is coupled to a first grounding point on the ground element. The third radiation element is coupled to the feeding point. The first radiation element and the third radiation element are at least partially surrounded by the second radiation element. The fourth radiation element is coupled to a second grounding point on the ground element. The fourth radiation element includes a first elevated portion. The fifth radiation element is coupled to the feeding point. The fifth radiation element includes a second elevated portion.

Abstract: The disclosure relates to a projection system and an operation method thereof. The projection system includes a central control platform and a projection apparatus. The central control platform generates a sequence signal according to a self-defined setting. The projection apparatus is coupled to the central control platform and includes a power circuit, a first processing circuit, and an optical engine module. The power circuit passes the sequence signal through an energy storage element to generate a power supply. The first processing circuit performs an operation based on the power supply to generate a decoding result according to the sequence signal. The optical engine module obtains image information according to the decoding result and generates a display image according to the image information.

Abstract: A clock gating circuit includes a NOR logic gate, a transmission gate, a cross-coupled pair of transistors, and a first transistor. The NOR logic gate is coupled to a first node, and receives a first and a second enable signal, and outputs a first control signal. The transmission gate is coupled between the first and a second node, and receives the first control signal, an inverted clock input signal and a clock output signal. The cross-coupled pair of transistors is coupled between the second node and an output node, and receives at least a second control signal. The first transistor includes a first gate terminal configured to receive the inverted clock input signal, a first drain terminal coupled to the output node, and a first source terminal coupled to a reference voltage supply. The first transistor adjusts the clock output signal responsive to the inverted clock input signal.

Abstract: A mobile device includes a hybrid antenna, a tunable circuit element, an RF (Radio Frequency) module, and a proximity sensor. The tunable circuit element provides an impedance value. The RF module generates RF power. The hybrid antenna is coupled through the tunable circuit element to the RF module. The proximity sensor is respectively coupled to the hybrid antenna, the tunable circuit element, and the RF module, and is configured to detect a specific distance between the hybrid antenna and a conductive element. The tunable circuit element and the RF module are operated according to relative information of the specific distance. If the specific distance is shorter than or equal to a first threshold distance, the RF module will reduce the RF power. If the specific distance is shorter than or equal to a second threshold distance, the tunable circuit element will change the impedance value.

Abstract: A device for alleviating obstructive sleep apnea, comprising: a base fitted and fixed to an user's head and having a passage portion; an adjustment element extending into the passage portion and undergoing relative displacement therein; a locking element disposed at the passage portion, wherein an user uses the locking element to fix the adjustment element in place to limit the relative displacement of the adjustment element; a suction member undergoing relative displacement relative to the passage portion together with the adjustment element and having a channel, wherein the channel extends into the adjustment element, undergoes relative displacement in the adjustment element, and connects to a tongue fixing portion disposed at the front end of the user's tongue; and a negative pressure source being mounted on the base and in communication with the channel, providing a negative pressure to the user's tongue in contact with the tongue fixing portion.

Abstract: A method of backlight control for a display panel is provided. The display panel is configured to display with a variable refresh rate in a plurality of frame periods each having a fixed period and a variable period. The method includes steps of: generating a first backlight control signal in the fixed period of a frame period; determining whether a liquid crystal (LC) transition time corresponding to the frame period ends before an end time of the variable period of the frame period; generating a second backlight control signal in the variable period of the frame period when the LC transition time ends before the end time of the variable period of the frame period; and generating a compensation backlight control signal in a next frame period according to a backlight duty cycle of the frame period.

Abstract: A device package includes a first die directly bonded to a second die at an interface, wherein the interface comprises a conductor-to-conductor bond. The device package further includes an encapsulant surrounding the first die and the second die and a plurality of through vias extending through the encapsulant. The plurality of through vias are disposed adjacent the first die and the second die. The device package further includes a plurality of thermal vias extending through the encapsulant and a redistribution structure electrically connected to the first die, the second die, and the plurality of through vias. The plurality of thermal vias is disposed on a surface of the second die and adjacent the first die.

Abstract: A device includes an interposer, which includes a substrate having a top surface. An interconnect structure is formed over the top surface of the substrate, wherein the interconnect structure includes at least one dielectric layer, and metal features in the at least one dielectric layer. A plurality of through-substrate vias (TSVs) is in the substrate and electrically coupled to the interconnect structure. A first die is over and bonded onto the interposer. A second die is bonded onto the interposer, wherein the second die is under the interconnect structure.

Abstract: An interconnect structure includes a dielectric layer, a first conductive feature, a hard mask layer, a conductive layer, and a capping layer. The first conductive feature is disposed in the dielectric layer. The hard mask layer is disposed on the first conductive feature. The conductive layer includes a first portion and a second portion, the first portion of the conductive layer is disposed over at least a first portion of the hard mask layer, and the second portion of the conductive layer is disposed over the dielectric layer. The hard mask layer and the conductive layer are formed by different materials. The capping layer is disposed on the dielectric layer and the conductive layer.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a semiconductor substrate, an interconnection structure, through substrate vias, conductive pillars and dummy conductive pillars. The interconnection structure is disposed at a front side of the semiconductor substrate, and comprises a stack of dielectric layers and interconnection elements spreading in the stack of dielectric layers. The through substrate vias separately penetrate through the semiconductor substrate and the stack of dielectric layers. The conductive pillars are disposed at a front side of the interconnection structure facing away from the semiconductor substrate, and respectively in electrical connection with one of the through substrate vias. The dummy conductive pillars are disposed aside the conductive pillars at the front side of the interconnection structure.

Abstract: A mobile device with high radiation efficiency includes a ground element, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a dielectric substrate, a speaker body, and a cable. The first radiation element and the fourth radiation element are coupled to the ground element. The second radiation element and the third radiation element are coupled to a feeding point. An antenna structure is formed by the first radiation element, the second radiation element, the third radiation element, and the fourth radiation element. The speaker body has a first vertical projection on the dielectric substrate, and the first vertical projection at least partially overlaps the third radiation element. The cable is coupled to the speaker body. The cable has a second vertical projection on the dielectric substrate, and the second vertical projection does not overlap the antenna structure at all.

Abstract: A fan-out type packaging structure includes a strain adjustment layer, a plurality of chips, an encapsulation layer, a redistribution layer, and a plurality of solder balls. The strain adjustment layer is made of a polymer material and has at least 95% laser absorbance. The plurality of chips are partially embedded in the strain adjustment layer and are spaced apart from each other. The encapsulation layer surrounds the chips and is connected to the strain adjustment layer. The redistribution layer covers the encapsulation layer and the chips. The plurality of solder balls are disposed on the redistribution layer and are spaced apart from each other.

Abstract: A method for locating critical control points on a part or combination of parts during a manufacturing process involves mating, directly or indirectly, a jig extension to the part or parts. A pattern on the jig extension defines an origin point that is used to track the position of the part or parts during manufacturing, such as during location-sensitive operations. The jig extension may be a shoe last extension which connects to a shoe or shoe component via a shoe last.

Abstract: A method includes attaching a wafer to a wafer chuck having a curved surface. The method further includes placing a device die on the wafer, such that a first dielectric layer of the device die is in contact with a second dielectric layer of the wafer, and performing an annealing process to bond the first dielectric layer to the second dielectric layer. The method further includes encapsulating the device die with an encapsulating material, forming redistribution lines overlapping the encapsulating material and the device die, and sawing the encapsulating material to form a plurality of packages.

Abstract: A heat dissipation device includes a housing, a heat dissipation plate, a first fan and at least two second fans. The housing has a first sidewall and a second sidewall that are opposite to each other. The first sidewall has a first opening area. The second sidewall has a second opening area. The first opening area and the second opening area are facing each other. The heat dissipation plate is located inside the housing and covers at least one heat source. An opening penetrates through the heat dissipation plate, and the opening corresponds to the first opening area. The first fan is located inside the opening. The at least two second fans are located nearby the heat dissipation plate. The at least two second fans are facing a first direction. The housing further includes side surfaces that connect the first sidewall and the second sidewall.