Patents by Inventor Chi Wang
Chi Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12387027Abstract: The present disclosure provides a method and an apparatus for arranging electrical components within a semiconductor device, and a non-transitory computer-readable medium. The method includes (a) placing a plurality of cells in a first layout, wherein the first layout includes a first row and a second row adjacent to the first row; (b) dividing the first layout into a plurality of regions; (c) calculating a first density of each of the plurality of regions; (d) calculating, for a first region of the plurality of regions, a first probability of altering cell versions for cells in the first region according to the first density of the first region; (e) altering cell versions of one or more cells in the first region according to a comparison between the first probability and a first threshold; and (f) rearranging the cells in the first layout to reduce cell overlap.Type: GrantFiled: April 26, 2022Date of Patent: August 12, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Wai-Kei Mak, Ting-Chi Wang, Tsu-Ling Hsiung, Hsuan-Han Liang, Sheng-Hsiung Chen
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Publication number: 20250246487Abstract: The present disclosure provides a manufacturing method of an electronic device including the following steps. A substrate and a connecting element are provided, where the connecting element is disposed on the substrate. The connecting element is detected to obtain an opening, where the connecting element includes a first conductive line segment and a second conductive line segment, and the opening is located between the first conductive line segment and the second conductive line segment. A conductive element is provided corresponding to the opening. The conductive element is cured to form a first connecting line segment. An uncured portion of the conductive element is removed. A laser trimming process is performed on the first connecting line segment, wherein the first conductive line segment is electrically connected to the second conductive line segment through the first connecting line segment.Type: ApplicationFiled: April 21, 2025Publication date: July 31, 2025Applicant: InnoLux CorporationInventors: Cheng-Chi WANG, Kuang- Ming Fan, Liang-Lu Chen, Chia-Lin Yang
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Publication number: 20250246816Abstract: An electronic device includes a metal back cover, a metal frame, and at least one antenna module. The antenna module includes a separated portion, a first radiator, a second radiator, a third radiator disposed between the first radiator and the second radiator, and a fourth radiator connected to the separated portion. A first section of the first radiator is connected to the separated portion. A second section of the first radiator extends from the first section and has a first ground terminal. A third section of the first radiator extends from the first section and has a second ground terminal. The second radiator extends from the separated portion and has a third ground terminal. The third radiator includes a fourth section and a fifth section extending from the fourth section towards the second radiator. The fourth section is located next to the third section and has a fourth ground terminal.Type: ApplicationFiled: November 19, 2024Publication date: July 31, 2025Applicant: PEGATRON CORPORATIONInventors: Chien-Yi Wu, Shao-Chi Wang, Hau Yuen Tan, Chao-Hsu Wu, Chih-Wei Liao, Chih-Hung Cho, Shih-Keng Huang, Hung-Te Liao, Ming-Huang Chen, Chang-Hsun Wu
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Patent number: 12372705Abstract: A light guide plate includes a light incident surface, a first surface connected to the light incident surface, and a plurality of optical microstructures disposed on the first surface. Each optical microstructure has a first cross-sectional profile along a first direction and a second cross-sectional profile along a second direction perpendicular to the first direction. The first cross-sectional profile is different from the second cross-sectional profile. The optical microstructures include a plurality of first optical microstructures and a plurality of second optical microstructures. The second cross-sectional profile of each first optical microstructure is different from the second cross-sectional profile of each second optical microstructure. A light source module including the light guide plate projects light into the light incident surface.Type: GrantFiled: March 8, 2024Date of Patent: July 29, 2025Assignee: CM Visual Technology CorporationInventors: Tsang-Chi Wang, Hsin Wen Chang, Hung Yu Lin, Yung Pin Chen
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Patent number: 12374560Abstract: The present disclosure discloses a manufacturing method of an electronic device. A seed layer is formed on a substrate. After patterning the seed layer to form a plurality of sub-seed layers and a plurality of conductive lines, a metal layer is formed on a plurality of the sub-seed layers. The sub-seed layers include a first sub-seed layer and a second sub-seed layer, and the first sub-seed layer and the second sub-seed layer are separated from each other.Type: GrantFiled: October 20, 2022Date of Patent: July 29, 2025Assignee: InnoLux CorporationInventors: Chin-Lung Ting, Cheng-Chi Wang, Yu-Jen Chang, Ju-Li Wang
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Patent number: 12369420Abstract: Various embodiments of the present disclosure are directed towards methods for forming an image sensor in which a device layer overlies and has a different semiconductor material than a substrate and in which the device layer has high crystalline quality. Some embodiments of the methods include: epitaxially growing the device layer on the substrate; patterning the device layer to form a trench dividing the device layer into mesa structures corresponding to pixels; forming an inter-pixel dielectric layer filling the trench and separating the mesa structures; and forming photodetectors in the mesa structures. Other embodiments of the methods include: depositing the inter-pixel dielectric layer over the substrate; patterning the inter-pixel dielectric layer to form cavities corresponding to the pixels; epitaxially growing the mesa structures in the cavities; and forming the photodetectors in the mesa structures.Type: GrantFiled: August 4, 2022Date of Patent: July 22, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chiao-Chi Wang, Chung-Chuan Tseng, Chia-Ping Lai, Szu-Chien Tseng, Yeh-Hsun Fang
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Patent number: 12361331Abstract: Systems and methods for tuning hyperparameters for a machine learning model using a challenger champion model are described. A set of challenger configurations are generated based on a hyperparameter for tuning and a subset of the set of challenger configurations are scheduled for evaluation based on a loss function. A loss value derived from the loss function for the challenger configurations is compared to a loss value derived from the loss function for a champion configuration, and the champion configuration is replaced with the challenger configuration based on the comparison of the loss value derived from the loss function for the challenger configuration and the loss value derived from the loss function for the champion configuration. When the champion is replaced, a new set of challenger configurations is generated based on the new champion configuration.Type: GrantFiled: May 4, 2021Date of Patent: July 15, 2025Assignee: Microsoft Technology Licensing, LLCInventors: Chi Wang, John Carol Langford, Qingyun Wu, Paul S. Mineiro, Marco Rossi
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Patent number: 12364028Abstract: A method includes forming a plurality of openings extending into a substrate from a front surface of the substrate. The substrate includes a first semiconductor material. Each of the plurality of openings has a curve-based bottom surface. The method includes filling the plurality of openings with a second semiconductor material. The second semiconductor material is different from the first semiconductor material. The method includes forming a plurality of pixels that are configured to sense light in the plurality of openings, respectively, using the second semiconductor material.Type: GrantFiled: June 7, 2024Date of Patent: July 15, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yeh-Hsun Fang, Chiao-Chi Wang, Chung-Chuan Tseng, Chia-Ping Lai
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Publication number: 20250227297Abstract: A three-dimensional data encoding method includes: obtaining geometry information which includes first three-dimensional positions on a measurement target, and is generated by a measurer that radially emits an electromagnetic wave in different directions and obtains a reflected wave which is the electromagnetic wave that is reflected by the measurement target; generating a two-dimensional image including first pixels corresponding to the directions, based on the geometry information; and encoding the two-dimensional image to generate a bitstream. Each of the first pixels has a pixel value indicating a first three-dimensional position or attribute information of a three-dimensional point which is included in a three-dimensional point cloud and corresponds to a direction to which the first pixel corresponds among the directions.Type: ApplicationFiled: March 25, 2025Publication date: July 10, 2025Inventors: Toshiyasu SUGIO, Noritaka IGUCHI, Pongsak LASANG, Chi WANG, Chung Dean HAN
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Patent number: 12355899Abstract: A method and system for authentication through deep-links is provided. A communication device can provide a credential to a remote server computer as part of an authentication process. The remote server computer can challenge the communication device by transmitting a deep-link containing a one-time passcode to the communication device. The communication device can activate and parse the deep-link to determine the one-time passcode. The one-time passcode can be transmitted back to the remote server computer by the communication device. The remote server computer can verify that received one-time passcode matches the sent one-time passcode in order to complete the authentication process.Type: GrantFiled: April 10, 2018Date of Patent: July 8, 2025Assignee: Visa International Service AssociationInventor: Feng Chi Wang
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Patent number: 12356007Abstract: A three-dimensional data encoding method includes: generating a bitstream by encoding subspaces included in a current space in which three-dimensional points are included. The bitstream includes encoded data respectively corresponding to the subspaces. In the generating of the bitstream, a list of information about the subspaces is stored in first control information included in the bitstream. The subspaces are respectively associated with identifiers assigned to the subspaces, and the first control information is common to the encoded data. Each of the identifiers assigned to the subspaces respectively corresponding to the encoded data is stored in a header of a corresponding one of the encoded data.Type: GrantFiled: April 28, 2023Date of Patent: July 8, 2025Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICAInventors: Chung Dean Han, Pongsak Lasang, Chi Wang, Noritaka Iguchi, Toshiyasu Sugio
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Publication number: 20250209281Abstract: Natural language generators (NLGs), including large language models, are powerful technologies that are in widespread use. However, typically, as NLGs become more powerful and sophisticated, their correspondingly increased complexity requires substantial processing resources. The present disclosure provides automated techniques for dynamically routing queries between at least two NLGs based on an assessment of query difficulty. Less difficult queries can be routed to a less resource intensive NLG, while more difficult queries are routed to a more sophisticated, but more resource intensive NLG. Routing less difficult queries to a less resource intensive model can thus conserve computing resources, while providing little to no drop in response quality, and in some cases providing improved response quality.Type: ApplicationFiled: December 21, 2023Publication date: June 26, 2025Applicant: Microsoft Technology Licensing, LLCInventors: Ankur MALLICK, Daniel Eduardo MADRIGAL DIAZ, Chi WANG, Robert Alexander SIM, Victor RÜHLE, Ahmed AWADALLAH, Dujian DING
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Publication number: 20250205321Abstract: The present invention relates to therapeutical uses of non-classical human major histocompatibility complex (MHC) molecules (also named MHC class Ib molecules) in combination with peptide antigens for the treatment of Parkinson's disease. The invention more specifically relates to recombinant polypeptides comprising peptide antigens and one or more domains of a non-classical MHC class Ib molecule. The invention also relates to methods of producing such recombinant polypeptides, pharmaceutical compositions comprising the same, as well as their uses for treating Parkinson's disease.Type: ApplicationFiled: March 24, 2023Publication date: June 26, 2025Applicant: Julius-Maximilians-Universitat WurzburgInventors: Jörg WISCHHUSEN, Valentin BRUTTEL, Chi Wang IP
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Patent number: 12339441Abstract: The optical film includes a main body and an optical structure. The optical structure protrudes from a surface of the main body. The optical structure includes a first side surface and a second side surface. A first connecting line and a first angle less than 90 degrees are formed between the first side surface and the surface of the main body. A second connecting line and a second angle less than 90 degrees are formed between the second side surface and the surface of the main body. When viewed from a normal vector of the surface of the main body, a third angle is formed between an extension line of the first connecting line and an extension line of the second connecting line, and the third angle is greater than 0 degree and less than 90 degrees.Type: GrantFiled: May 12, 2021Date of Patent: June 24, 2025Assignee: CM VISUAL TECHNOLOGY CORPORATIONInventors: Tsang-Chi Wang, Hsin-Wen Chang
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Publication number: 20250188395Abstract: A cell and tissue sheet forming package includes a container body, a membrane, a sliding door plate and a sealing film. The sliding door plate is disposed slidably on a top of the container body to cover or expose the membrane. The sliding door plate has a hole and a passive magnetic assembly. The cell injection equipment includes a carrier, an injection mechanism and a drive mechanism. The carrier carries the package, and the drive mechanism moves the carrier and the injection mechanism to have the injection mechanism to inject a solution, through the hole, into the package. A heating element of the carrier is introduced to heat the membrane and the solution to transform the solution into a colloid sheet on the membrane. Then, the positive magnetic assembly engages magnetically the passive magnetic assembly to slide the sliding door plate to expose the colloid sheet on the membrane.Type: ApplicationFiled: February 18, 2025Publication date: June 12, 2025Inventors: HSIN-YI HSU, YANG-CHENG LIN, CHAO-HONG HSU, YU-BING LIOU, LI-HSIN LIN, HSIN-HSIN SHEN, YU-CHI WANG, CHANG-CHOU LI, CHIH-HUNG HUANG
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Patent number: 12322686Abstract: A redistribution layer structure is provided. The redistribution layer structure includes a first metal layer, a first dielectric layer disposed on the first metal layer, a second metal layer disposed on the first dielectric layer, and a second dielectric layer disposed on the second metal layer. A coefficient of thermal expansion of the first dielectric layer is less than a coefficient of thermal expansion of the second dielectric layer.Type: GrantFiled: November 21, 2021Date of Patent: June 3, 2025Assignee: Innolux CorporationInventors: Hung-Sheng Chou, Wen-Hsiang Liao, Kuo-Jung Fan, Heng-Shen Yeh, Cheng-Chi Wang
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Publication number: 20250167563Abstract: A charging method and a power system are provided. The power system includes multiple batteries, multiple charging integrated circuits respectively coupled to the multiple batteries, and a processor. The charging method is performed by the processor, and includes: obtaining multiple remaining capacities of the multiple batteries, respectively; selecting a battery from the multiple batteries that is lowest in remaining capacity as a target battery, and using a charging integrated circuit of the multiple charging integrated circuits that is coupled to the target battery as a target charging integrated circuit; and configuring the target charging integrated circuit to charge the target battery according to a first total power, and configuring each of the multiple charging integrated circuits other than the target charging integrated circuit to charge a corresponding one of the multiple batteries according to a second total power that is less than the first total power.Type: ApplicationFiled: May 15, 2024Publication date: May 22, 2025Inventors: CHIEN-PANG YU, Chun-Chi Wang
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Publication number: 20250168981Abstract: An electronic device is provided. The electronic device includes a substrate structure, a control unit, a first circuit structure, and an electronic unit. The substrate structure has a conductive via pattern and a dummy via pattern. The control unit is electrically connected to the conductive via pattern. The first circuit structure is electrically connected to the conductive via pattern. The electronic unit is electrically connected to the control unit through the first circuit structure. The dummy via pattern is electrically insulated from the first circuit structure.Type: ApplicationFiled: January 16, 2025Publication date: May 22, 2025Inventors: Cheng-Chi WANG, Kuan-Feng LEE, Jui-Jen YUEH
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Publication number: 20250154384Abstract: The present invention is to provide a water-based hot-melt adhesive for healthcare packaging. The water-based hot-melt adhesive includes 20 to 60 weight parts of hydrophilic-modified water-based polyolefin resin; 1 to 30 weight parts of water-based ionomer; 10 to 30 weight parts of wax particles; and 10 to 30 weight parts of tackifier particles. The coating layer formed on the healthcare packaging substrate from the water-based hot-melt adhesive of the present invention has great gas-permeability and weather resistance, and the healthcare packaging substrate with the water-based hot-melt adhesive of the present invention has satisfied seal strength, pealing ability and reliability after sealing with flexible sheet or blister containers at the peripheral edges thereof.Type: ApplicationFiled: September 3, 2024Publication date: May 15, 2025Inventors: Yen-Ling LIN, Tze-Chi WANG, Ching-Huang CHEN
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Publication number: 20250154561Abstract: The present invention provides a gene detection method for single nucleotide variations. The method involves gene amplification using specific primers, followed by the utilization of a copper nanocluster synthesis reaction to detect the expression of a target gene sequence. This approach facilitates the identification of wild-type nucleotide sequences, single nucleotide variation sequences, or their combinations, thereby offering precise results in gene detection.Type: ApplicationFiled: November 10, 2023Publication date: May 15, 2025Applicant: KAOHSIUNG MEDICAL UNIVERSITYInventors: Chun-Chi Wang, Ke-Peng Lai