Abstract: A method for calculating an object pick-and-place sequence and an electronic apparatus for automatic storage pick-and-place are provided. When a warehousing operation is to be performed, the following steps are performed. A weight of an object to be stocked that is to be put on a shelf is obtained. The weight is substituted into a plurality of coordinate positions corresponding to a plurality of unused grid positions respectively, so as to calculate a plurality of estimated center of gravity positions. Whether the estimated center of gravity positions are located within a balance standard area is determined so as to sieve out a plurality of candidate grid positions from these unused grid positions. One of the candidate grid positions is selected as a recommended position of the object to be stocked.

Abstract: A three-dimensional point cloud generation method for generating a three-dimensional point cloud including one or more three-dimensional points includes: obtaining (i) a two-dimensional image obtained by imaging a three-dimensional object using a camera and (ii) a first three-dimensional point cloud obtained by sensing the three-dimensional object using a distance sensor; detecting, from the two-dimensional image, one or more attribute values of the two-dimensional image that are associated with a position in the two-dimensional image; and generating a second three-dimensional point cloud including one or more second three-dimensional points each having an attribute value, by performing, for each of the one or more attribute values detected, (i) identifying, from a plurality of three-dimensional points forming the first three-dimensional point cloud, one or more first three-dimensional points to which the position of the attribute value corresponds, and (ii) appending the attribute value to the one or more fi

Abstract: A hot-swappable electronic device and a method for preventing crash of the same are provided. The method includes: detecting, by a controller, whether or not the hot-swappable electronic device is in a power-on state; detecting, by the controller, whether or not a power connection port is connected to an alternating current power source when the hot-swappable electronic device is in the power-on state; detecting, by a first sensor and a second sensor, whether or not a first battery leaves a first battery installation groove and a second battery leaves a second battery installation groove when the power connection port is not connected to the alternating current power source; and lowering, by the controller, a system power consumption of the hot-swappable electronic device when the first battery leaves the first battery installation groove or the second battery leaves the second battery installation groove.

Abstract: This disclosure discloses an extraction column for metal separation in an acid leaching solution of laterite nickel ore, and an extraction process thereof. The extraction column includes an extraction column tube body and a gas distribution device; an interior of the extraction column tube body is provided with an accommodating cavity for containing a continuous phase and a dispersed phase, the continuous phase and the dispersed phase are in countercurrent contact in the accommodating cavity; and the extraction column tube body is connected with the gas distribution device to make the gas distribution device pass gas into the accommodating cavity. The gas distribution device is used to control a pipe diameter of a gas outlet of the gas distribution device in a suitable range. Using turbulent effect of bubbles floating in a liquid phase, collisions and shears of the dispersed phase form dispersed phase droplets with suitable sizes.

Abstract: An electronic device includes first and second bodies and two antenna modules. The first body includes a first metal housing. The second body is pivotally connected to the first body through two metal hinges and includes a second metal housing, a third metal housing, and a non-metal housing. The non-metal housing is connected to the second metal housing and close to the first body. The two antenna modules are disposed between the second metal housing, the third metal housing, and the non-metal housing, and close to the two metal hinges respectively. Each antenna module includes a radiating part located between the coupling ground part and the corresponding metal hinge and a coupling ground part close to the first metal housing. The 10 coupling ground part, the first metal housing, the metal hinge, the second metal housing, and the third metal housing together form a loop path.

Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).

Abstract: An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.

Abstract: An electronic device includes a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, a third metal layer, a third insulating layer, a fourth metal layer, a fourth insulating layer and a conductive structure. The first insulating layer is disposed on the first metal layer. The second metal layer is disposed on the first insulating layer. The second insulating layer is disposed on the second metal layer. The third metal layer is disposed on the second insulating layer. The third insulating layer is disposed on the third metal layer. The fourth metal layer is disposed on the third insulating layer. The fourth insulating layer is disposed on the fourth metal layer. The conductive structure is disposed on and electrically connected to the fourth insulating layer. A chemical resistance of the first insulating layer is greater than a chemical resistance of the fourth insulating layer.

Abstract: An optoelectronic semiconductor device includes a substrate, a first type semiconductor structure located on the substrate, a second type semiconductor structure located on the first type semiconductor structure, an active structure located between the first type semiconductor structure and the second type semiconductor structure, a plurality of contact portions disposed between the first type semiconductor structure and the substrate, and a first conductive oxide layer, a second conductive oxide layer, a first insulating layer and a second insulating layer. The plurality of contact portions is separated from each other, and one of them includes a semiconductor and has a side wall. The first conductive oxide layer contacts the contact portion, and the second conductive oxide layer contacts the first conductive oxide layer. The first insulating layer contacts the side wall. The second insulating layer is disposed between the first insulating layer and the second conductive oxide layer.

Abstract: Methods for screening a test compound against multiple cell lines are provided and include the steps of: treating a mixture including cells from multiple cell lines with the test compound; identifying allele frequencies of single nucleotide polymorphisms (SNPs) in the treated mixture and a control mixture including cells from the same cell lines as present in the treated mixture; estimating a proportion of each individual cell line in both the treated mixture and the control mixture; and quantifying the effect of the test compound on each individual cell line using the estimated proportion of each cell line in the treated mixture and the estimated proportion of each cell line in the control mixture. Systems for screening a test compound against multiple cell lines, as well as systems and methods for identifying a proportion of a particular cell line in a mixture including multiple cell lines, are also provided.

Abstract: The present disclosure provides a method and an apparatus for arranging electrical components within a semiconductor device, and a non-transitory computer-readable medium. The method includes (a) placing a plurality of cells in a first layout; (b) generating a second layout by performing a first set of calculations on the first layout such that a total wire length of the second layout is less than that of the first layout; (c) generating a third layout by performing a second set of calculations on the second layout such that cell congestions in the second layout is eliminated from the third layout; (d) generating a fourth layout by performing a third set of calculations on the third layout such that the total wire length of the fourth layout is less than that of the third layout; and (e) iterating the operations (c) and (d) until a target layout conforms to a convergence criterion.

Abstract: A three-dimensional data encoding method includes: generating first information in which an N-ary tree structure of a plurality of three-dimensional points included in three-dimensional data is expressed using a first formula, where N is an integer of 2 or higher; and generating a bitstream including the first information. The first information includes pieces of three-dimensional point information each associated with a corresponding one of the plurality of three-dimensional points. The pieces of three-dimensional point information each include indexes each associated with a corresponding one of a plurality of levels in the N-ary tree structure. The indexes each indicate a subblock, among N subblocks belonging to a corresponding one of the plurality of levels, to which a corresponding one of the plurality of three-dimensional points belongs.

Abstract: A core of a dual-motor-driven inflatable pump has a base, a cylinder, two electric motors, and a drive wheel set. The base has an assembly portion, a fixing portion, and a receiving space formed between the assembly portion and the fixing portion. The cylinder is disposed on the base and has a cylinder body, a cylinder head, and a piston rod. The cylinder body is disposed on the fixing portion via the cylinder head. The piston rod is disposed in the cylinder body and extends in the receiving space via the fixing portion. The two electric motors are disposed on the assembly portion of the base, and each has a drive shaft extended in the receiving space. The drive wheel set is disposed in the receiving space of the base and has a driven gear and two drive gears engaging with the driven gear.

Abstract: A monolithic array chip comprises a first semiconductor layer; a common electrode located on the first semiconductor layer; a first light-emitting unit with a first electrode located on the first semiconductor layer; a second light-emitting unit with a second electrode located on the first semiconductor layer; a third light-emitting unit with a third electrode located on the first semiconductor layer, wherein the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit are separated from each other by a trench.

Abstract: The present invention provides a wearable device for monitoring blood-pressure.

Abstract: The application relates to a method for manufacturing an electronic device, and in particular, to a method for manufacturing an electronic device with a carrier substrate. The method includes: providing a carrier, forming a first base layer on the carrier; and forming working units on the first base layer. The working units are spaced apart from one another.

Abstract: The present disclosure discloses a method for manufacturing an electronic device, including: setting a basic working area; a photoresist coating process; a development process; an etching process; an exposure process; a metal plating process; and a polishing process, wherein the photoresist coating process, the development process, the etching process, the exposure process, the metal plating process and the polishing process respectively have a maximum optimized process area, and a smallest one of the maximum optimized process areas is selected as the basic working area.

Abstract: A redistribution layer structure is provided. The redistribution layer structure includes a first metal layer and a first dielectric layer disposed on the first metal layer. A range of a difference between a coefficient of thermal expansion of the first dielectric layer and a coefficient of thermal expansion of the first metal layer is 0% to 70% of the coefficient of thermal expansion of the first dielectric layer.

Abstract: The present disclosure provides a method for expanding a working area based on a laser map, a chip and a robot, and the method for expanding the working area includes using map pixel point information obtained by laser scanning to position pending boundary lines, deciding a next expansion of a rectangular working area according to an increment of a diagonal length of the rectangular working area framed by the pending boundary lines in a current expansion process, stopping expanding the rectangular working area of the robot when the increment of the diagonal length before expanding and after expanding reaches an overlap condition.

Abstract: An electronic component and a manufacturing method thereof are provided. The electronic component includes a structure member and a connecting member. The structure member includes at least one working unit. The at least one working unit is disposed in a first region. The connecting member is disposed on the structure member and includes a second region. The second region is overlapped with the first region, and a metal density of the second region is less than a metal density of the first region. The electronic component and the manufacturing method thereof of the embodiment of the disclosure include the effect of improving the reliability or quality of the electronic component.