Abstract: A system for traversal around a network address translator, including a session moderator located within a configured network, the session moderator configured to receive a websocket connection request from a logical requestor located in a second private network, the websocket request identifying a logical receiver located in a third private network, send a first ping message to the logical requestor as confirmation, transmit a second ping message to the identified logical receiver, receive a second websocket connection request from the identified logical receiver, create respective websocket instantiations for each respective received websocket connection request, send session confirmation to the logical requester, then perform two-directional data flow binding between each of the respective websocket instantiations, receive one or more TCP resource packets from the identified logical receiver, and forward the one or more TCP resource packets to the logical requestor.

Abstract: A method for anti-vibration verification in a digital image acquisition apparatus is provided. An animation is shown on a display, simulating that images captured by the digital image acquisition apparatus is vibrating during recording. A video stream comprising multiple images is acquired, where the video stream is acquired by recording the animation with the digital image acquisition apparatus to create the animation. It is determined whether an anti-vibration function of the digital image acquisition apparatus is adequate by sequentially detecting the difference between the images in the video stream.

Abstract: A stack structure of a carrier board embedded with semiconductor components and a method for fabricating the same are proposed. The stack structure includes first and second carrier boards having a through hole respectively, first and second semiconductors component disposed in through holes of the first and second semiconductor components respectively, and a dielectric layer structure clamped between the first carrier board and the second carrier board and having a first dielectric layer formed on the first carrier board and an inactive surface of the first semiconductor component and filled in gaps between the first carrier board and the first semiconductor component, a second dielectric layer formed on the second carrier board and an inactive of the second semiconductor component and filled in gaps between the second carrier board and the second semiconductor component, and a bonding layer clamped between the first dielectric layer and the second dielectric layer.

Abstract: A stirrup (210,310) includes a footrest (214,314) as well as a hanger (216,316) for suspending the stirrup from a saddle. A shock absorber (350) is provided for the footrest (314) and has passages (364) which allow the shock absorber to be tied to the footrest. Each of the passages (364) extends between two opposite surfaces of the shock absorber (350) and is made up of two tapering portions (374) which narrow in a direction away from the respective surfaces.

Abstract: Processes for packing -memory cards includes a step of preparing a base circuit board; a step of disposing passing members on the base circuit; a step of installing chips on each of the passive members; a step of using a single mold to glue or mold the chips on the passive members so as to form a plurality of circuit areas; a step of cutting the circuit areas from the base circuit board to be circuit pieces, and a step of installing each of the circuit pieces into casings respectively to obtain memory cards. The processes require only a single mold so as to reduce the expense of the mold and is suitable for mass production.

Abstract: A memory card includes a base plate on which IC chips are connected and a housing is mounted to the base plate. The housing has at least one recess defined in an underside of the housing and sealed by a top which is in flush with the outside of the housing. At leas tone of the IC chips is accommodated in the recess.

Abstract: The MMC memory card with TSOP package includes a circuit board with a plurality of passive elements and ICs installed thereon and a plastic housing is covered over and enclosing the circuit board to form a memory card structure. At least one flash memory of the ICs is used with a TSOP package and the housing has a space to position the TSOP type flash memory such that said TSOP type flash memory is assembled with the housing and the total thickness of the assembly meets the requirement of the standard specification.

Abstract: A memory card includes a base plate on which IC chips are connected and a case is mounted to the base plate. At least one window is defined through the case so that at least one of the IC chips is accommodated in the window. A seal plate is attached on the case and seals the at least one window.

Abstract: A stirrup includes a footrest as well as a hanger for suspending the stirrup from a saddle. A shock absorber is provided for the footrest and has protrusions which impart a nonslip character to the shock absorber. The protrusions have respective ends which face away from the shock absorber, and each of these ends is formed with a concavity.

Abstract: A stirrup includes an elongated footrest as well as a hanger for suspending the stirrup from a saddle. The footrest and the hanger can pivot relative to one another on an axis parallel to the longitudinal axis of the footrest. A shock absorber is provided for the footrest and has spaces for anchoring the shock absorber to the footrest. The footrest, in turn, has anchoring members for the shock absorber.