Patents by Inventor Chia-Cheng Chen

Chia-Cheng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190350096
    Abstract: A bending module and a folding display device are provided. The bending module is adapted to vary between a flattened state and a bent state. The bending module includes a flexible unit and a pair of supporting members. The flexible unit has a neutral layer, and the pair of supporting members are connected to the flexible unit. When the bending module varies between the flattened state and the bent state, the flexible unit is deformed, and the supporting members are each rotated via one corresponding center of rotation to be relatively close to or far from each other, wherein the centers of rotation are always maintained on the neutral layer of the flexible unit. By applying the bending module to the folding display device, the service life of the folding display device may be extended.
    Type: Application
    Filed: May 9, 2019
    Publication date: November 14, 2019
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Kai-Cheng Chao, You-Yu Chen, Chia-Hao Hsu, Chia-Huang Chan
  • Patent number: 10473613
    Abstract: Light-addressable potentiometric sensing units are provided. A light-addressable potentiometric sensing unit comprises a conductive substrate, a metal oxide semiconductor layer, and a sensing layer. The metal oxide semiconductor layer is made of indium gallium zinc oxide, indium gallium oxide, indium zinc oxide, indium oxide co-doped with tin and zinc, tin oxide, or zinc oxide. The wide-band gap characteristic of the metal oxide semiconductor layer enables the light-addressable potentiometric sensing unit to resist the interference from visible light. The light-addressable potentiometric sensing unit therefore exhibits a more stable performance.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: November 12, 2019
    Assignee: CHANG GUNG UNIVERSITY
    Inventors: Chao-Sung Lai, Chia-Ming Yang, Chun-Hui Chen, Tsung-Cheng Chen
  • Patent number: 10465427
    Abstract: An electronic device and a hinge assembly thereof are provided. The hinge assembly has a first fixing block, a second fixing block, a first linking rod and a second linking rod. The first fixing block has a first end and a second end. The second fixing block has a third end and a fourth end. The first linking rod has a fifth end slidably and rotatably connected to the second end and a sixth end rotatably connected to the fourth end. The second linking rod has a seventh end slidably and rotatably connected to the fourth end and an eighth end rotatably connected to the second end. The sixth end has a groove portion and a first inclined surface, and the eighth end has a second inclined surface contacting the first inclined surface.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: November 5, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Po-Jui Chen, Wei-Hao Lan, Che-Hsien Lin, Chen-Cheng Wang, Chun-Chieh Chen, Chia-Chi Lin, Han-Sheng Siao
  • Patent number: 10462928
    Abstract: A composite cable assembly includes flat cables, a cable unit and fastening units. Each flat cable includes conductor assemblies and a shielding layer covering the conductor assemblies. The cable unit includes transmission lines. The transmission lines are arranged horizontally and in contact with the shielding layer of the flat cable closest to the transmission lines. The cable unit contacts the flat cable closest to the cable unit, the cable unit and each flat cable are together bent to form bent portions and extension sections connected to the bent portions. Each two fastening units are arranged spaced apart at two sides of a corresponding bent portion. Each extension section has the same length when the cable unit and each flat cable are moved in a movement direction to extend or collapse.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: October 29, 2019
    Assignee: SUPER MICRO COMPUTER INC.
    Inventors: Hsiao-Chung Chen, Tan-Hsin Chang, Chia-Cheng Lu, Chih-Wei Chen
  • Patent number: 10459492
    Abstract: An electronic device includes a first machine body, a second machine body, a hinge structure, a moving component, and a towing structure. The hinge structure is configured to pivot the first machine body and the second machine body. The moving component is movably disposed in the first machine body. The towing structure is disposed in the first machine body and is coupled to the hinge structure and the moving component. The towing structure is configured to be driven by the hinge structure to drive the moving component to move relative to the first machine body.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: October 29, 2019
    Assignee: Wistron Corporation
    Inventors: Jing-Lung Chen, Chia-Lung Hsu, Yao-Jheng Chen, Po-Cheng Chen
  • Patent number: 10462747
    Abstract: A wireless device includes a radio-frequency module, a modem module, and a control unit. The radio-frequency module and the modem module operate either in a first operation mode or in a second operation mode. The control unit, coupled to the RF and the modem module, generates a control signal to indicate to the RF and the modem module to operate in the first operation mode or to operate in the second operation mode. A first set of signal formats corresponding to the first operation mode is a superset of a second set of signal formats corresponding to the second operation mode, and a first power consumption corresponding to the first operation mode is higher than a second power consumption corresponding to the second operation mode.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: October 29, 2019
    Assignee: Realtek Semiconductor Corp.
    Inventors: Hou-Wei Lin, Yi-Cheng Chen, Chia-Chun Hung, Yi-Chang Shih, Liang-Hui Li, Yi-Lin Li
  • Publication number: 20190322762
    Abstract: An antibody, or an antigen-binding fragment there, binding human ENO1 (GenBank: AAH506421.1) is provided. Methods for treating an ENO1 protein-related disease or disorder, inhibiting cancer invasion and diagnosis of cancer are also provided.
    Type: Application
    Filed: March 19, 2018
    Publication date: October 24, 2019
    Applicants: DEVELOPMENT CENTER FOR BIOTECHNOLOGY, NATIONAL HEALTH RESEARCH INSTITUTES
    Inventors: SHIH-CHONG TSAI, TA-TUNG YUAN, SHIH-CHI TSENG, JIANN-SHIUN LAI, CHIA-CHENG WU, PO-YIN LIN, YA-WEI TSAI, CHAO-YANG HUANG, YING-YUNG LOK, CHUNG-HSIUN WU, HSIEN-YU TSAI, NENG-YAO SHIH, KO-JIUNN LIU, LI-TZONG CHEN
  • Publication number: 20190320478
    Abstract: A multi-member Bluetooth network includes: a main Bluetooth circuit capable of directly communicating with a remote Bluetooth device through a Bluetooth transmission approach; and an auxiliary Bluetooth circuit capable of indirectly communicating with the remote Bluetooth device through the main Bluetooth circuit. When the auxiliary Bluetooth circuit becomes more closer to the remote Bluetooth device than the main Bluetooth circuit, the main Bluetooth circuit instructs the auxiliary Bluetooth circuit to utilize the device identification data and multiple Bluetooth connection parameters of the main Bluetooth circuit to directly communicate with the remote Bluetooth device through a Bluetooth transmission approach by imitating the main Bluetooth circuit, and the main Bluetooth circuit then indirectly communicates with the remote Bluetooth device through the auxiliary Bluetooth circuit.
    Type: Application
    Filed: April 11, 2019
    Publication date: October 17, 2019
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng CHEN, Kuan-Chung HUANG, Chia-Chun HUNG
  • Publication number: 20190320370
    Abstract: A multi-member Bluetooth device includes: a main Bluetooth circuit capable of directly communicating with a remote Bluetooth device through a Bluetooth transmission approach; and an auxiliary Bluetooth circuit capable of indirectly communicating with the remote Bluetooth device through the main Bluetooth circuit. After operating for a certain period, the main Bluetooth circuit transmits the main Bluetooth circuit's device identification data and multiple Bluetooth connection parameters between the main Bluetooth circuit and the remote Bluetooth device to the auxiliary Bluetooth circuit.
    Type: Application
    Filed: April 11, 2019
    Publication date: October 17, 2019
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng CHEN, Kuan-Chung HUANG, Chia-Chun HUNG
  • Publication number: 20190309092
    Abstract: The present invention provides a modified antigen-binding Fab fragment. An antigen-binding molecule comprising the antigen-binding Fab fragment and a composition comprising the molecule are also provided.
    Type: Application
    Filed: July 20, 2017
    Publication date: October 10, 2019
    Applicant: Development Center for Biotechnology
    Inventors: Chih-Yung HU, Chao-Yang HUANG, Yu-Jung CHEN, Chia-Cheng WU, Chien-Tsun KUAN, Chia-Hsiang LO, Hsien-Yu TSAI
  • Publication number: 20190304864
    Abstract: A package structure including a semiconductor die, an insulating encapsulant, and a redistribution layer is provided. The semiconductor die includes a semiconductor substrate, a plurality of metallization layers disposed on the semiconductor substrate, and a passivation layer disposed on the plurality of metallization layers. The passivation layer has a first opening that partially expose a topmost layer of the plurality of metallization layers. The insulating encapsulant is encapsulating the semiconductor die. The redistribution layer includes at least a first dielectric layer and a first conductive layer stacked on the first dielectric layer. The first dielectric layer has a second opening that overlaps with the first opening, and a width ratio of the second opening to the first opening is in a range of 2.3:1 to 12:1. The first conductive layer is electrically connected to the topmost layer of the plurality of metallization layers through the first and second openings.
    Type: Application
    Filed: March 29, 2018
    Publication date: October 3, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ting-Ting Kuo, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Chih-Hsuan Tai, Ying-Cheng Tseng
  • Patent number: 10431535
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes forming an antenna structure in contact with one side of a circuit structure of a packaging substrate, and disposing an electronic component on the other side of the circuit structure. As such, the antenna structure is integrated with the packaging substrate, thereby reducing the thickness of the electronic package and improving the efficiency of the antenna structure.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: October 1, 2019
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Jui-Feng Chen, Chia-Cheng Hsu, Wen-Jung Tsai, Chia-Cheng Chen, Cheng Kai Chang
  • Publication number: 20190292586
    Abstract: Disclosed herein is a method of quantifying a mutant allele burden of a target gene in a subject. The method includes providing a first plasmid that includes a mutant allele sequence and an internal control sequence, and a second plasmid that includes a wild-type allele sequence and the internal control sequence, and subjecting DNA of the subject to quantitative polymerase chain reaction to measure a mutant allele expression level of the target gene, so as to determine the mutant allele burden of the target gene in the subject based on a standard curve of the mutant allele burden of the target gene created by serial dilution of the first and second plasmids.
    Type: Application
    Filed: March 19, 2019
    Publication date: September 26, 2019
    Inventors: Chih-Cheng CHEN, Chia-Chen HSU
  • Publication number: 20190287190
    Abstract: A method of battery charging is to be implemented by an energy station communicable with a cloud server that stores reference battery identifiers. The method includes: detecting a provided battery identifier of a battery, and transmitting the provided battery identifier to the cloud server so as to enable the cloud server to determine one of the reference battery identifiers that matches the provided battery identifier, and to determine to which one of first and second lease codes the one of the reference battery identifiers thus determined corresponds; and being controlled to charge the battery when it is determined that the one of the reference battery identifiers thus determined by the cloud server corresponds to the first lease code.
    Type: Application
    Filed: March 14, 2019
    Publication date: September 19, 2019
    Inventors: Chia-Cheng TU, Chi-Wei TIEN, Chien-Hung CHEN
  • Publication number: 20190288068
    Abstract: The present disclosure relates generally to doping for conductive features in a semiconductor device. In an example, a structure includes an active region of a transistor. The active region includes a source/drain region, and the source/drain region is defined at least in part by a first dopant having a first dopant concentration. The source/drain region further includes a second dopant with a concentration profile having a consistent concentration from a surface of the source/drain region into a depth of the source/drain region. The consistent concentration is greater than the first dopant concentration. The structure further includes a conductive feature contacting the source/drain region at the surface of the source/drain region.
    Type: Application
    Filed: June 6, 2019
    Publication date: September 19, 2019
    Inventors: Su-Hao Liu, Huicheng Chang, Chia-Cheng Chen, Liang-Yin Chen, Kuo-Ju Chen, Chun-Hung Wu, Chang-Maio Liu, Huai-Tei Yang, Lun-Kuang Tan, Wei-Ming You
  • Patent number: 10418460
    Abstract: A structure and method for implementation of dummy gate structures within multi-gate device structures includes a semiconductor device including an isolation region that separates a first and second active region. The first active region is adjacent to a first side of the isolation region and the second active region is adjacent to a second side of the isolation region. A device including a source, a drain, and a gate is formed within the first active region. One of the source and drain regions are disposed adjacent to the isolation region. A dummy gate is formed at least partially over the isolation region and adjacent to the one of the source and drain regions. In various examples, the gate includes a first dielectric layer having a first thickness and the dummy gate includes a second dielectric layer having a second thickness greater than the first thickness.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: September 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Chu Liu, Kuei-Shun Chen, Chiang Mu-Chi, Chao-Cheng Chen
  • Publication number: 20190280502
    Abstract: A charger management method to be implemented by a server includes steps of: with respect to each charger, in response to receipt from the charger in a non-charging state of a notification including a charger identifier (ID) of the charger, updating the state flag of one of charger information sets stored in the server and including the charger ID to a second value; and in response to receipt of a query including a target location from a user end electronic device, selecting, based on the charger information sets and the target location, at least one candidate charging station information set from multiple charging station information sets.
    Type: Application
    Filed: February 25, 2019
    Publication date: September 12, 2019
    Inventors: Ping-Jui HSIEH, Chia-Cheng TU, Te-Chuan LIU, Jen-Chiun LIN, Yuh-Rey CHEN, Po-Yu CHUANG
  • Patent number: 10395937
    Abstract: A method of forming a semiconductor device is disclosed. The method includes providing a device having a substrate and a hard mask layer over the substrate; forming a mandrel over the hard mask layer; depositing a material layer on sidewalls of the mandrel; implanting a dopant into the material layer; performing an etching process on the hard mask layer using the mandrel and the material layer as an etching mask, thereby forming a patterned hard mask layer, wherein the etching process concurrently produces a dielectric layer deposited on sidewalls of the patterned hard mask layer, the dielectric layer containing the dopant; and forming a fin by etching the substrate using the patterned hard mask layer and the dielectric layer collectively as an etching mask.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: August 27, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Tzung-Yi Tsai, Yen-Ming Chen, Dian-Hau Chen, Han-Ting Tsai, Tsung-Lin Lee, Chia-Cheng Ho, Ming-Shiang Lin
  • Publication number: 20190258156
    Abstract: A photomask includes a pattern region and a plurality of defects in the pattern region. The photomask further includes a first fiducial mark outside of the pattern region, wherein the first fiducial mark includes identifying information for the photomask, the first fiducial mark has a first size and a first shape. The photomask further includes a second fiducial mark outside of the pattern region. The second fiducial mark has a second size different from the first size, or a second shape different from the first shape.
    Type: Application
    Filed: April 30, 2019
    Publication date: August 22, 2019
    Inventors: Hsin-Chang LEE, Chia-Jen CHEN, Chih-Cheng LIN, Ping-Hsun LIN
  • Publication number: 20190258770
    Abstract: A method of manufacturing an integrated circuit (IC) includes receiving a layout of the IC having a first region interposed between two second regions. The layout includes a first layer having first features and second and third layer having second and third features in the first region. The second and third features collectively form cut patterns for the first features. The method further includes modifying the second and third features by a mask house tool, resulting in modified second and third features, which collectively form modified cut patterns for the first features. The modifying of the second and third features meets at least one of following conditions: total spacing between adjacent modified second (third) features is greater than total spacing between adjacent second (third) features, and total length of the modified second (third) features is smaller than total length of the second (third) features.
    Type: Application
    Filed: May 6, 2019
    Publication date: August 22, 2019
    Inventors: Yun-Lin Wu, Cheng-Cheng Kuo, Chia-Ping Chiang, Chih-Wei Hsu, Hua-Tai Lin, Kuei-Shun Chen, Yuan-Hsiang Lung, Yan-Tso Tsai