Abstract: A circuit structure includes a flexible substrate, an inorganic barrier layer, a first wire, a second wire, a third wire, a fourth wire, an organic dielectric layer, a first conductive via, and a second conductive via. The inorganic barrier layer is disposed over the flexible substrate. The first and second wires are disposed on the inorganic barrier layer and contact the inorganic barrier layer. The first and second wires are separated from each other. The organic dielectric layer is disposed over the first and second wires. The third wire is disposed in the organic dielectric layer. The fourth wire is disposed above the organic dielectric layer. The first conductive via is disposed in the organic dielectric layer and contacts the first and third wires. The second conductive via is disposed in the organic dielectric layer and contacts the second and fourth wires.

Abstract: A foldable display device includes a display panel having two flat portions and a bend portion between the two flat portions; a hinge substantially aligned with and beneath the bend portion of the display panel; a plurality of slidable platforms between the hinge and a bottom surface of the bend portion of the display panel; and a repeatable adhering component between one of the slidable platforms and the bottom surface of the bend portion of the display panel, wherein the repeatable adhering component comprises a self-adhesive pad or a weak adhesive.

Abstract: An electronic device package includes a carrying board, an electronic device, a first insulating layer, and a barrier layer. The carrying board includes a central area, an inner edge area, and an outer edge area. The inner edge area is located between the central area and the outer edge area. The electronic device is located in the central area. The first insulating layer is located on the carrying board and overlapped with the electronic device and extends from the central area to the inner edge area. The barrier layer is located on the carrying board. Here, the barrier layer includes a sidewall contact portion and an extending portion. The sidewall contact portion surrounds a side surface of the first insulating layer, and the extending portion extends from the sidewall contact portion to the outer edge area in a direction away from the first insulating layer.

Abstract: A pixel structure includes data lines disposed along a first direction, scan lines disposed along a second direction and pixel units periodically disposed along the first and the second directions. In a first pixel unit, a first switch element is coupled to a first scan line and a first data line, the second switch element is coupled to the first scan line, and a third switch element is coupled to the first scan line. In a second pixel unit, a fourth switch element is coupled to a second scan line, the first data line and the second switch element, and a fifth switch element is electrically coupled to the second scan line and the third switch element. In a third pixel unit, a sixth switch element is coupled to a third scan line, the first data line and the fifth switch element.

Abstract: A flexible electronic device has a display region and a package region surrounding the display region. The flexible electronic device includes a substrate, a first protection film, a first adhesive layer, a display medium layer, and a flexible auxiliary layer. The first protection film is disposed to be opposite to the substrate. The first adhesive layer is disposed between the substrate and the first protection film, and at least located within the package region. The display medium layer is disposed between the substrate and the first protection film, and located within the display region. The flexible auxiliary layer is disposed on a surface of the first protection film, and located within the package region, wherein the flexible auxiliary layer overlaps the first adhesive layer in a thickness direction.

Abstract: A foldable display device includes a holding structure and a flexible display panel. The holding structure includes a soft outer housing, a first inner housing, a second inner housing, a first supporting stage, a second supporting stage, a first hinge, a first spring element, a second hinge, and a second spring element. The first hinge is connected to a same side of the first inner housing and the first supporting stage. The first spring element is connected to another same side of the first inner housing and the first supporting stage. The second hinge is connected to a same side of the second inner housing and the second supporting stage. The second spring element is connected to another same side of the second inner housing and the second supporting stage. The flexible display panel is located on the first and second supporting stages.

Abstract: A foldable display device includes a display panel having two flat portions and a bend portion between the two flat portions; a hinge substantially aligned with and beneath the bend portion of the display panel; a plurality of slidable platforms between the hinge and a bottom surface of the bend portion of the display panel; and a repeatable adhering component between one of the slidable platforms and the bottom surface of the bend portion of the display panel, wherein the repeatable adhering component comprises a self-adhesive pad or a weak adhesive.

Abstract: A circuit structure includes a flexible substrate, an inorganic barrier layer, a first wire, a second wire, a third wire, a fourth wire, an organic dielectric layer, a first conductive via, and a second conductive via. The inorganic barrier layer is disposed over the flexible substrate. The first and second wires are disposed on the inorganic barrier layer and contact the inorganic barrier layer. The first and second wires are separated from each other. The organic dielectric layer is disposed over the first and second wires. The third wire is disposed in the organic dielectric layer. The fourth wire is disposed above the organic dielectric layer. The first conductive via is disposed in the organic dielectric layer and contacts the first and third wires. The second conductive via is disposed in the organic dielectric layer and contacts the second and fourth wires.

Abstract: A flexible laminated structure includes a first protective layer, a plurality of patterned structures, and a second protective layer. The patterned structures are disposed on the first protective layer and expose a portion of the first protective layer. Each of the patterned structures has a first width adjacent to the first protective layer and a second width away from the first protective layer, and the first width is smaller than the second width. The second protective layer is disposed on the first protective layer and covers the patterned structures and the first protective layer.

Abstract: A flexible laminated structure includes a first protection layer, a second protection layer directly contacting the first protection layer and a flexible material layer. The second protection layer having a plurality of openings, which are used to expose a portion of the first protection layer. The flexible material layer is disposed on the second protection layer and extends into the openings, and directly contacts the first protection layer exposed by the openings. An adhesion between the flexible material layer and the first protection layer is greater than an adhesion between the second protection layer and the first protection layer.

Abstract: A carrier apparatus is adapted to carry a flexible substrate. The carrier apparatus includes two carrier plates, two adhesive layers, and two supporting units. The carrier plates have a gap with respect to each other, and each of the carrier plates has a first region and a second region, wherein the second regions of the carrier plates are adjacent to each other and are located between the first regions. The adhesive layers are respectively disposed in the first regions of the carrier plates. The supporting units are respectively disposed in the second regions of the carrier plates and are coplanar with the adhesive layers, wherein the flexible substrate is fixed on the carrier plates through the adhesive layers, and the supporting units are detachably attached to a bending zone of the flexible substrate by attractive force. A display including the carrier apparatus and a flexible display panel is provided.

Abstract: A foldable display device includes a holding structure and a flexible display panel. The holding structure includes a soft outer housing, a first inner housing, a second inner housing, a first supporting stage, a second supporting stage, a first hinge, a first spring element, a second hinge, and a second spring element. The first hinge is connected to a same side of the first inner housing and the first supporting stage. The first spring element is connected to another same side of the first inner housing and the first supporting stage. The second hinge is connected to a same side of the second inner housing and the second supporting stage. The second spring element is connected to another same side of the second inner housing and the second supporting stage. The flexible display panel is located on the first and second supporting stages.

Abstract: A pixel structure includes data lines disposed along a first direction, scan lines disposed along a second direction and pixel units periodically disposed along the first and the second directions. In a first pixel unit, a first switch element is coupled to a first scan line and a first data line, the second switch element is coupled to the first scan line, and a third switch element is coupled to the first scan line. In a second pixel unit, a fourth switch element is coupled to a second scan line, the first data line and the second switch element, and a fifth switch element is electrically coupled to the second scan line and the third switch element. In a third pixel unit, a sixth switch element is coupled to a third scan line, the first data line and the fifth switch element.

Abstract: An electronic device package includes a carrying board, an electronic device, a first insulating layer, and a barrier layer. The carrying board includes a central area, an inner edge area, and an outer edge area. The inner edge area is located between the central area and the outer edge area. The electronic device is located in the central area. The first insulating layer is located on the carrying board and overlapped with the electronic device and extends from the central area to the inner edge area. The barrier layer is located on the carrying board. Here, the barrier layer includes a sidewall contact portion and an extending portion. The sidewall contact portion surrounds a side surface of the first insulating layer, and the extending portion extends from the sidewall contact portion to the outer edge area in a direction away from the first insulating layer.

Abstract: A metal oxide thin film transistor (TFT) includes a gate electrode, a gate insulating layer, a metal oxide active layer, a source electrode, and a drain electrode. The gate electrode is formed on a substrate. The gate insulating layer is formed on the substrate and covers the gate electrode. The metal oxide active layer is formed on the gate insulating layer. The drain electrode and the source electrode are formed on two opposite ends of the metal oxide active layer in a spaced-apart manner, in which at least one of the orthographic projection of the source electrode and the orthographic projection of the drain electrode on the substrate does not overlap the gate electrode.

Abstract: A touch display panel including an active device array substrate, an opposite substrate and a liquid crystal layer is provided. The active device array substrate includes a first substrate, a black matrix, a touch-sensing device layer, a dielectric layer and an active device array layer. The black matrix is disposed on the first substrate. The touch-sensing device layer is disposed on the first substrate to cover a portion of the black matrix. The dielectric layer covers the touch-sensing device layer. The active device array layer is disposed on the dielectric layer. The touch-sensing device layer and the active device array substrate are located at two opposite sides of the dielectric layer. The liquid crystal layer is disposed between the active device array layer and the opposite substrate. Moreover, a fabricating method of the touch display panel is also provided.

Abstract: A semiconductor sensing device that includes a nanowire conductive layer, a semiconductor sensing layer, and a conductive layer is provided. The nanowire conductive layer includes a plurality of connected conductive nanowires, and gaps are formed between the conductive nanowires. The semiconductor sensing layer is electrically connected to the nanowire conductive layer. The conductive layer is electrically connected to the semiconductor sensing layer. The semiconductor sensing layer is located between the nanowire conductive layer and the conductive layer. A manufacturing method of a semiconductor sensing device is also provided.

Abstract: Disclosed herein is a method for manufacturing an array substrate. The method includes forming a source electrode and a drain electrode on a substrate. A semiconductor layer, an organic insulating layer, and a gate electrode layer are sequentially formed to cover the substrate, the source electrode, and the drain electrode. A patterned photoresist layer is formed on the gate electrode layer. The exposed portion of the gate electrode layer, and a portion of the organic insulative layer and a portion of the semiconductor layer thereunder are removed to form a gate electrode. An organic passivation layer is formed on the gate electrode, the source electrode, and the drain electrode. The organic passivation layer has a contact window to expose a portion of the drain electrode. A pixel electrode is formed on the organic passivation layer and the exposed portion of the drain electrode.

Abstract: A pixel structure located on a periphery of a display module includes a substrate, a flexible circuit board and a plurality of LED chips. The substrate has at least one scribing tolerance reserving zone and a display unit mounting zone. The flexible circuit board is disposed on the display unit mounting zone of the substrate. The LED chips are mounted on the flexible circuit board.

Abstract: A vertical transistor and a manufacturing method thereof are provided herein. The manufacturing method includes forming a first patterned conductive layer on a substrate; forming a patterned metal oxide layer on the first patterned conductive layer, in which the patterned metal oxide layer includes a first patterned insulator layer, a second patterned insulator layer, and a second patterned conductive layer; forming a semiconductor layer; and forming a third patterned conductive layer. The first patterned insulator layer, the second patterned insulator layer, and the second patterned conductive layer are made by using a single metal oxide material. The oxygen concentration of the second patterned conductive layer is different from the oxygen concentrations of the first patterned insulator layer and the second patterned insulator layer.