Abstract: A semiconductor device includes a first semiconductor structure having a first active region pattern density. The semiconductor device further includes a second semiconductor structure having a second active region pattern density, wherein the second semiconductor structure comprises a first resistive element. The semiconductor device further includes a third semiconductor structure having a third active region pattern density, wherein the third semiconductor structure includes a second resistive element. The second semiconductor structure is adjacent to the first semiconductor structure and adjacent to the third semiconductor structure. The first semiconductor structure, the second semiconductor structure and the third semiconductor structure do not overlap.

Abstract: A hidden-lock door panel for use in a container includes a door panel body, a covering lid, a first lock, and a second lock. The door panel body includes a hidden space. The covering lid is disposed corresponding to the hidden space and slidably connected to the door panel body. The first lock and the second lock are both disposed in the hidden space. The first lock is an electronic lock and is used to control whether the covering lid can be released to slide. The second lock is used to control the door panel body to be unlocked or locked with respect to the container. Accordingly, unknowing persons are prevented from opening or breaking the door lock.

Abstract: An equipment cabinet and a slidable-and-rotatable rack assembly are provided. The equipment cabinet includes a housing and a rack assembly. The rack assembly is disposed in the receiving space of the housing. The rack assembly comprises a first slidable tray, at least two first rail assemblies, a frame, and a first rotation shaft assembly. The first rail assemblies are connected with the first slidable tray and the housing respectively and configured for allowing the first slidable tray to be moved relative to the housing. The frame is carried by the first slidable tray and has a base plate. The first rotation shaft assembly is coupled with the base plate of the frame and the first slidable tray and configured for allowing the frame to be rotated relative to the first slidable tray after the frame carried by the first slidable tray is drawn out.

Abstract: In some embodiments, a method includes providing an input voltage to a level-shifting circuit, where the input voltage is in a first power domain, shifting the input voltage to an output voltage using the level-shifting circuit, where the output voltage is in a second power domain different from the first power domain, and where the level-shifting circuit is coupled to power supply voltages in the second power domain. The method further includes in response to an electrostatic discharge (ESD) event, turning off a first transistor coupled between a first node of the level-shifting circuit and a reference low voltage level of the second power domain.

Abstract: A hinge device includes a housing comprising two half-housings, a first extending module comprising two half-members disposed in the housing, a second extending module comprising two half sliding members and disposed on an outer side of the first extending module, a sliding device disposed between the first extending module and the second extending module, an elastic member disposed between the two half housings, and a stop sheet disposed between the half-housings and having one end facing a bottom of the second extending module.

Abstract: A device includes a first power transistor, a second power transistor electrically connected in series with the first power transistor, a first electrostatic discharge (ESD) detection circuit, and a first control circuit electrically connected to the first ESD detection circuit and the first power transistor.

Abstract: One or more semiconductor arrangements having a stacked configuration and electrostatic discharge (ESD) protection are provided. The semiconductor arrangements include a first substrate, a second substrate, an ESD pad, an ESD device and a first interlayer via connecting the first substrate and the second substrate. The first substrate includes a first PMOS device and a first device and the second substrate includes a first NMOS device and a second device. Alternatively, the first substrate includes a first PMOS device and a first NMOS device and the second substrate includes a first device and a second device.

Abstract: A circuit, a multiple power domain circuit, and a method are disclosed. An embodiment is a circuit including an input circuit having a first output and a second output, the input circuit being coupled to a first power supply voltage, and a level-shifting circuit having a first input coupled to the first output of the input circuit and a second input coupled to the second output of the input circuit, the level-shifting circuit being coupled to a second power supply voltage. The circuit further includes a first transistor coupled between a first node of the level-shifting circuit and the second power supply voltage, and a control circuit having an output coupled to a gate of the first transistor, the control circuit being coupled to the second power supply voltage.

Abstract: A dual shaft hinge device includes a first shaft including a first expansion portion; a second shaft including a second expansion portion; a pair of securing plates joined to the first shaft and the second shaft respectively and connected to a display device and a main body of an electronic device respectively; torque elements connected to the first shaft and the second shaft; a limiting mechanism connected to the first shaft and the second shaft; a first helical gear formed on the first expansion portion; a second helical gear formed on the second expansion portion; a base including two through holes for the first shaft and the second shaft extending therethrough, two extending plates separated by a distance, two transverse through holes formed on the extending plates and two depressed portions formed on a back side of the base; and a middle gear rotatably disposed between the extending plates and engaging the first helical gear and the second helical gear.

Abstract: A semiconductor device includes a first semiconductor structure having a first active region pattern density. The semiconductor device further includes a second semiconductor structure having a second active region pattern density, wherein the second semiconductor structure comprises a first resistive element. The semiconductor device further includes a third semiconductor structure having a third active region pattern density, wherein the third semiconductor structure includes a second resistive element. The second semiconductor structure is adjacent to the first semiconductor structure and adjacent to the third semiconductor structure. The first semiconductor structure, the second semiconductor structure and the third semiconductor structure do not overlap.

Abstract: A hinge structure includes a housing comprising two half-housings disposed opposite, an opening formed on a top thereof, an inner space formed by the half-housings, a cover plate configured to cover a portion of the top and a lifting member disposed in an electronic device to cover the other portion of the top, wherein a gap is formed between the cover plate and the lifting member, each of the half housing comprises a depression and a guiding groove formed in front of the depression, and the two depressions form the inner space; two half-driving members opposite disposed, mounted in the inner space and connected to the lifting member so that the half-driving members are assembled to each other and actuate in the inner space; and a sandwiched torque member disposed between the half-driving members and comprising a guiding rod having two ends movably inserted into the half-driving members and an axial torque tube having a preset notch, wherein the axial torque tube is tightly fitted to a shaft connected to the

Abstract: A driving circuit includes a common well. The driving circuit further includes a first output buffer having a bulk connected to the common well, the first output buffer having a first terminal configured to receive a first signal, and having a second terminal connected to the common well. The driving circuit further includes a second output buffer having a bulk connected to the common well, the second output buffer having a first terminal configured to receive the first signal, wherein a second terminal of the second output buffer is disconnected from the common well.

Abstract: A hinge structure for connecting an electronic device and a stand includes a housing mounted to the housing, a cover covering the housing and a lifting member mounted to the stand, wherein a gap is formed between the lifting member and the cover, the lifting member includes an eccentric block movably disposed in the housing, a guiding member is disposed on one end of the eccentric block and includes a arced groove through which a pin movably extending, a positioning pin is positioned in a limiting groove; in another embodiment, the lifting member includes an eccentric block having a arced plate movably disposed in a rear groove and a lateral groove of the housing, whereby the hinge structure is smoothly operated in a small gap.

Abstract: An integrated circuit structure includes first and second integrated circuit devices disposed on a interposer. Each integrated circuit device has electrostatic discharge (ESD) protection circuitry therein connected to an internal ESD bus. The first and second integrated circuit devices communicate with one another through the interposer. The interposer includes an ESD bus electrically connected to the ESD busses of the first and second integrated circuit devices for providing cross-device ESD protection for the integrated circuit devices.

Abstract: An integrated circuit structure includes first and second integrated circuit devices disposed on a interposer. Each integrated circuit device has electrostatic discharge (ESD) protection circuitry therein connected to an internal ESD bus. The first and second integrated circuit devices communicate with one another through the interposer. The interposer includes an ESD bus electrically connected to the ESD busses of the first and second integrated circuit devices for providing cross-device ESD protection for the integrated circuit devices.

Abstract: A dual-frequency bistable liquid crystal display and the liquid crystal mixture thereof includes liquid crystal cell filled with a liquid crystal mixture which contains dual-frequency liquid crystal, chiral compound, and nematic liquid crystal mixture. The liquid crystal mixture has the characteristics of both the dual-frequency liquid crystal and cholesteric liquid crystal. The dual-frequency bistable liquid crystal display is driven in a frequency modulation mode and can be switched between two optical states by taking advantage of the dielectric anisotropy of the liquid crystal, which results in a short switching time and sharp contrast between two optical states. Furthermore, the maintaining of the two optical states requires no voltage, which does not require the use of a high voltage to destabilize the helical structure of the cholesteric liquid crystal, and does not have to go through a metastable stage. Hence, power consumption and switching time are reduced.

Abstract: A transmission mechanism including a first shaft and a second shaft extending rotatably through a first positioning plate and a second positioning plate. The second positioning plate is spaced apart from the first positioning plate. A first gear is mounted on the first shaft between the first positioning plate and the second positioning plate, and has a first helical tooth portion. A second gear is mounted on the second shaft between the first positioning plate and the second positioning plate, and has a second helical tooth portion having a same tooth profile and helix angle as the first helical tooth portion. A middle gear is located between the first gear and the second gear and has a transmitting helical tooth portion engaging the first helical tooth portion and the second helical tooth portion. The middle gear rotates about an axis perpendicular with the first shaft and the second shaft.

Abstract: One or more semiconductor arrangements having a stacked configuration and electrostatic discharge (ESD) protection are provided. The semiconductor arrangements include a first substrate, a second substrate, an ESD pad, an ESD device and a first interlayer via connecting the first substrate and the second substrate. The first substrate includes a first PMOS device and a first device and the second substrate includes a first NMOS device and a second device. Alternatively, the first substrate includes a first PMOS device and a first NMOS device and the second substrate includes a first device and a second device.

Abstract: An integrated circuit includes two or more substrates stacked one over another and a first set of electrical components on one or more of the two or more substrates. The two or more substrates include a first substrate having a first predetermined doping type and a second substrate having the first predetermined doping type. The first set of electrical components is configured to form a first circuit. The integrated circuit further includes a first ground reference rail electrically connected to the first circuit, a first common ground reference rail, and a first ESD conduction element electrically connected between the first ground reference rail and the first common ground reference rail. The first ESD conduction element includes a first diode on the first substrate and a second diode on the second substrate. The first diode and the second diode are electrically connected in parallel and have opposite polarities.

Abstract: An operating method for dynamically adjusting a touch apparatus is disclosed herein. The touch apparatus includes a storage component and a touch component. The storage component is configured to store at least one application, and a plurality of weights of touch motion modes and touch motion modes corresponding to the application. The operating method includes determining whether execution of the application has started. When execution of the application has started, a plurality of touch motions corresponding to the executed application are received through the touch component. At least one of the weights of touch motion modes corresponding to the executed application is adjusted according to the touch motions. At least one of touch parameters is adjusted according to the weights of touch motion modes corresponding to the executed application.