Patents by Inventor Chia-Hung Liu

Chia-Hung Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10937610
    Abstract: A keyboard includes a plurality of keyswitch structures and an adjusting plate movably disposed under the keyswitch structures. Each of the keyswitch structures includes a tactile feedback member. The adjusting plate includes a plate body and a plurality of adjusting bars protruding from the plate body toward the keyswitch structures and respectively corresponding to the tactile feedback members of the keyswitch structures. When the adjusting plate moves relative to the keyswitch structures, the adjusting bars drive the tactile feedback members to change tactile feedback of the keyswitch structures.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: March 2, 2021
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Yung-Chih Wang, Chia-Hung Liu, Yu-Chun Hsieh, Chen Yang, Chih-Yao Chi
  • Patent number: 10930451
    Abstract: A keyswitch structure includes a base having a positioning means, an cover combined with the base, a plunger with an cam portion movably coupling with the cover relative to the base, a restoring unit disposed between the base and the plunger to provide a restoring force to enable the plunger to move along a direction away from the base, a tactile feedback member having a positioning portion positioned by the positioning means and an extending arm extending across a moving path of the cam portion, and an adjusting unit being movable to drive the positioning portion to shift, so that the tactile feedback member has a first deformation or a second deformation, and a pressing force required for the cam portion to pass the extending arm when the plunger moves toward the base is changed.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: February 23, 2021
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Yung-Chih Wang, Chia-Hung Liu, Yu-Chun Hsieh, Chen Yang
  • Patent number: 10928743
    Abstract: Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: February 23, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Chien-Hua Lai, Chia-Hung Kao, Hsiu-Jen Wang, Shih-Hao Kuo, Yi-Sheng Liu, Shih-Hsien Lee, Ching-Chang Chen, Tsu-Hui Yang
  • Publication number: 20210029062
    Abstract: A network packet receiving device that includes packet queues, a credit allocation circuit and a credit management circuit is provided. Each of the packet queues corresponds to a packet transmission channel and receives packets. The credit allocation circuit calculates packet amount of each of the packet queues to control the descriptor credit of each of the packet queues within a credit range. The credit management circuit points each of public entries of a public link list to one of descriptors in a single descriptor buffer. The credit management circuit further receives a credit requesting command from the packet queues to assign the descriptors to the packet queues through the public entries under the condition that the descriptor credit is within a credit range such that a DMA circuit performs a DMA operation on the packets according to the descriptors.
    Type: Application
    Filed: July 23, 2020
    Publication date: January 28, 2021
    Inventors: Xi-Cheng SHAN, Jie WANG, Chang-Chun LI, Chia-Hung LIN, Guan-Yu LIU, Shan CHE, Jian-Jun WANG, Jun-Da SHI
  • Publication number: 20200410198
    Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.
    Type: Application
    Filed: September 10, 2020
    Publication date: December 31, 2020
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo, Ying-Cheng Tseng
  • Patent number: 10866640
    Abstract: A keyswitch with adjustable tactile feedback is adjusted by an adjusting method. The keyswitch includes a baseplate, an upper housing, an upper bushing component, a lower bushing component, a keycap and a recovering component. The baseplate has an electrode module, the upper housing is disposed on the baseplate, the upper bushing component is movably disposed on the upper housing, the lower bushing component is movably located between the baseplate and the upper housing, and the keycap is connected to a connecting portion of the upper bushing component. The lower bushing component can rotate relative to the baseplate to switch between a first position and a second position. The lower bushing component has a first lateral surface and a second lateral surface with different shapes. The recovering component is disposed between the baseplate and the lower bushing component to upwardly push the lower bushing component.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: December 15, 2020
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Chen Yang, Chia-Hung Liu, Yung-Chih Wang, Yu-Chun Hsieh
  • Patent number: 10868178
    Abstract: Embodiments disclosed herein relate generally to forming an ultra-shallow junction having high dopant concentration and low contact resistance in a p-type source/drain region. In an embodiment, a method includes forming a source/drain region in an active area on a substrate, the source/drain region comprising germanium, performing an ion implantation process using gallium (Ga) to form an amorphous region in the source/drain region, performing an ion implantation process using a dopant into the amorphous region, and subjecting the amorphous region to a thermal process.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: December 15, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Su-Hao Liu, Kuo-Ju Chen, Chun-Hung Wu, Chia-Cheng Chen, Liang-Yin Chen, Huicheng Chang, Ying-Lang Wang
  • Publication number: 20200381362
    Abstract: A semiconductor package includes a first wafer, a second wafer, and an interconnect. The first wafer includes a first die, a first encapsulating material encapsulating the first die, and a first redistribution structure disposed over the first die and the first encapsulating material. The second wafer includes a second die, a second encapsulating material encapsulating the second die, and a second redistribution structure disposed over the second die and the second encapsulating material, wherein the second redistribution structure faces the first redistribution structure. The interconnect is disposed between the first wafer and the second wafer and electrically connecting the first redistribution structure and the second redistribution structure, wherein the interconnect includes a substrate and a plurality of through vias extending through the substrate for connecting the first redistribution structure and the second redistribution structure.
    Type: Application
    Filed: May 30, 2019
    Publication date: December 3, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ying-Cheng Tseng, Hao-Yi Tsai, Tin-Hao Kuo, Chia-Hung Liu, Chi-Hui Lai
  • Publication number: 20200365526
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate having a first surface and a second surface opposite thereto, wherein the substrate includes a wiring structure, and a first semiconductor die disposed over the first surface of the substrate and electrically coupled to the wiring structure. The package further includes a second semiconductor die disposed over the first surface of the substrate and electrically coupled to the wiring structure, wherein the first semiconductor die and the second semiconductor die are separated by a molding material. A first hole and a second hole are formed on the second surface of the substrate. Finally, a frame is disposed over the first surface of the substrate, wherein the frame surrounds the first semiconductor die and the second semiconductor die.
    Type: Application
    Filed: August 3, 2020
    Publication date: November 19, 2020
    Inventors: Tzu-Hung LIN, Chia-Cheng CHANG, I-Hsuan PENG, Nai-Wei LIU
  • Patent number: 10795447
    Abstract: A keyswitch with adjustable tactile feedback is adjusted by an adjusting method. The keyswitch includes a baseplate, an upper housing, an upper bushing component, a lower bushing component, a keycap and a recovering component. The baseplate has an electrode module, the upper housing is disposed on the baseplate, the upper bushing component is movably disposed on the upper housing, the lower bushing component is movably located between the baseplate and the upper housing, and the keycap is connected to a connecting portion of the upper bushing component. The lower bushing component can rotate relative to the baseplate to switch between a first position and a second position. The lower bushing component has a first lateral surface and a second lateral surface with different shapes. The recovering component is disposed between the baseplate and the lower bushing component to upwardly push the lower bushing component.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: October 6, 2020
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Chen Yang, Chia-Hung Liu, Yung-Chih Wang, Yu-Chun Hsieh
  • Patent number: 10784211
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate having a first surface and a second surface opposite thereto. The substrate includes a wiring structure. The semiconductor package structure also includes a first semiconductor die disposed over the first surface of the substrate and electrically coupled to the wiring structure. The semiconductor package structure further includes a second semiconductor die disposed over the first surface of the substrate and electrically coupled to the wiring structure. The first semiconductor die and the second semiconductor die are separated by a molding material. In addition, the semiconductor package structure includes a first hole and a second hole formed on the second surface of the substrate.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: September 22, 2020
    Assignee: MEDIATEK INC.
    Inventors: Tzu-Hung Lin, Chia-Cheng Chang, I-Hsuan Peng, Nai-Wei Liu
  • Publication number: 20200294912
    Abstract: A package structure includes a die, a TIV, a first encapsulant, a RDL structure, a thermal dissipation structure and a second encapsulant. The die has a first surface and a second surface opposite to each other. The TIV is laterally aside the die. The first encapsulant encapsulates sidewalls of the die and sidewalls of the TIV. The RDL structure is disposed on the first surface of the die and on the first encapsulant, electrically connected to the die and the TIV. The thermal dissipation structure is disposed over the second surface of die and electrically connected to the die through the TIV and the RDL structure. The second encapsulant encapsulates sidewalls of the thermal dissipation structure.
    Type: Application
    Filed: March 15, 2019
    Publication date: September 17, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 10762319
    Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: September 1, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo, Ying-Cheng Tseng
  • Patent number: 10764551
    Abstract: A method for configuring image-recording settings includes receiving an image source, determining whether the image source is the high dynamic range (HDR) image. If a HDR image source is received, a step is performed for determining whether a recording device supports recording an image with a HDR format, and a step is performed for adding a HDR recording option if the recording device supports recording the image with the HDR format.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: September 1, 2020
    Assignee: AVERMEDIA TECHNOLOGIES, INC.
    Inventors: Hsiang-Yi Ma, Pin-Feng Chiu, Nian-Ying Tsai, Po-Yang Yao, Chia-Hung Liu
  • Publication number: 20200274033
    Abstract: A semiconductor device includes a semiconductor layered structure, an electrode unit, and an anti-adsorption layer. The electrode unit is disposed on an electrode connecting region of the semiconductor layered structure. The anti-adsorption layer is disposed on a top surface of the electrode unit opposite to the semiconductor layered structure and is electrically connected to the electrode unit. The anti-adsorption layer has an adsorption capacity for at least one of gaseous contaminants and particulate contaminants which is lower than that of the electrode unit. Also disclosed herein is a light-emitting system including the semiconductor device.
    Type: Application
    Filed: May 12, 2020
    Publication date: August 27, 2020
    Inventors: Gong CHEN, Chuan-gui LIU, Ting-yu CHEN, Su-hui LIN, Ling-yuan HONG, Sheng-hsien HSU, Kang-wei PENG, Chia-hung CHANG
  • Publication number: 20200244261
    Abstract: A keyswitch includes a circuit board, a bottom board abutting against the circuit board, a cap, a light receiver and a light emitter disposed on the circuit board and opposite to each other, a base disposed on the circuit board, a cover disposed on the base, a first elastic member disposed through the cover and the base, a support device, and a second elastic member fixed to the base and having a flexible rod. The support device is movably connected to the cap and bottom board and has a sheet structure. When the cap is pressed, the sheet structure blocks light transmission between the light emitter and the light receiver to generate a triggering signal. When the cap is pressed to make the flexible rod deform downward with the sheet structure and then cross the sheet structure, the flexible rod is released to collide with the cover to make sound.
    Type: Application
    Filed: January 20, 2020
    Publication date: July 30, 2020
    Inventors: Yu-Chun Hsieh, Chen Yang, Chia-Hung Liu
  • Publication number: 20200171706
    Abstract: A slurry sprayer for supplying a slurry to a wire saw during ingot slicing is disclosed. The slurry sprayer includes a main body and a cover plate that is detachable from the main body for cleaning the slurry sprayer. In some embodiments, the slurry sprayer includes an adjustable support that allows the incline angle of the sprayer to be adjusted and allows the vertical and horizontal position of the slurry sprayer to be adjusted. In some embodiments, the slurry sprayer includes two feed openings to allow the slurry pressure to be more equalized across the slurry sprayer.
    Type: Application
    Filed: November 27, 2019
    Publication date: June 4, 2020
    Inventors: Chia Ming Liu, Chien Ming Chen, Jui Hung Wang, Hao Chen
  • Publication number: 20200135541
    Abstract: Various embodiments of the present application are directed towards a method for forming a semiconductor-on-insulator (SOI) substrate with a thick device layer and a thick insulator layer. In some embodiments, the method includes forming an insulator layer covering a handle substrate, and epitaxially forming a device layer on a sacrificial substrate. The sacrificial substrate is bonded to a handle substrate, such that the device layer and the insulator layer are between the sacrificial and handle substrates, and the sacrificial substrate is removed. The removal includes performing an etch into the sacrificial substrate until the device layer is reached. Because the device layer is formed by epitaxy and transferred to the handle substrate, the device layer may be formed with a large thickness. Further, because the epitaxy is not affected by the thickness of the insulator layer, the insulator layer may be formed with a large thickness.
    Type: Application
    Filed: January 2, 2020
    Publication date: April 30, 2020
    Inventors: Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuan-Liang Liu, Shih-Pei Chou, Yu-Hung Cheng, Yeur-Luen Tu
  • Patent number: 10637470
    Abstract: An optical keyswitch includes a casing having a movable portion, a shaft movably disposed on the casing, a resilient member accommodated in the casing, and a switch module including a circuit board, an emitter, and a receiver. The emitter emits an optical signal along an optical path to the receiver. When the shaft is at a non-pressed position, the movable portion has a first spatial relation with the optical path, and the receiver receives the optical signal of a first intensity. When the shaft moves, in response to a pressing force, to a pressed position, the shaft compresses the resilient member and pushes the movable portion to move, so the movable portion no longer has the first spatial relation with the optical path, the optical signal received by the receiver has a second intensity different from the first intensity, and the switch module is triggered to generate a triggering signal.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: April 28, 2020
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Yung-Chih Wang, Yu-Chun Hsieh, Chen Yang, Chia-Hung Liu
  • Patent number: 10629972
    Abstract: A radio-frequency switching circuit includes a first diode, a second diode, a first inductor, a second inductor, a first capacitor, and a second capacitor. Cathodes of the first diode and the second diode are configured to receive a first reference voltage. A first inductor is coupled with an anode of the first diode, and configured to receive a first control voltage. A second inductor is coupled with an anode of the second diode, and configured to receive a second control voltage. The first capacitor is coupled with the first node of the first inductor. The second capacitor is coupled with the first node of the second inductor. When the first control voltage is lower than the first reference voltage, the first diode is switched off. When the second control voltage is lower than the first reference voltage, the second diode is switched off.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: April 21, 2020
    Assignee: PEGATRON CORPORATION
    Inventors: Yu-Jeng Kuo, Wei-Chun Tsao, Chia-Hung Liu