Abstract: A package structure and a method of manufacturing the same are provided. The package structure includes a die, a redistribution layer (RDL) structure, a through integrated fan-out via (TIV) and a first connector. The RDL structure is connected to the die and includes a plurality of RDLs. The TIV is aside the die and penetrates through the RDL structure. The first connector is in electrical contact with the TIV and electrically connected to the die. The TIV is in electrical contact with the RDLs of the RDL structure.

Abstract: A semiconductor package includes an encapsulated semiconductor device, a redistribution structure, and a protection layer. The encapsulated semiconductor device includes a semiconductor device and an encapsulating material encapsulating the semiconductor device. The redistribution structure is disposed on the encapsulated semiconductor device and includes a dielectric layer and a redistribution circuit layer electrically connected to the semiconductor device. The protection layer at least covers the dielectric layer, wherein an oxygen permeability or a water vapor permeability of the protection layer is substantially lower than an oxygen permeability or a vapor permeability of the dielectric layer.

Abstract: A method for configuring image-recording settings includes receiving an image source, determining whether the image source is the high dynamic range (HDR) image. If a HDR image source is received, a step is performed for determining whether a recording device supports recording an image with a HDR format, and a step is performed for adding a HDR recording option if the recording device supports recording the image with the HDR format.

Abstract: A package structure including a semiconductor die, an insulating encapsulant, and a redistribution layer is provided. The semiconductor die includes a semiconductor substrate, a plurality of metallization layers disposed on the semiconductor substrate, and a passivation layer disposed on the plurality of metallization layers. The passivation layer has a first opening that partially expose a topmost layer of the plurality of metallization layers. The insulating encapsulant is encapsulating the semiconductor die. The redistribution layer includes at least a first dielectric layer and a first conductive layer stacked on the first dielectric layer. The first dielectric layer has a second opening that overlaps with the first opening, and a width ratio of the second opening to the first opening is in a range of 2.3:1 to 12:1. The first conductive layer is electrically connected to the topmost layer of the plurality of metallization layers through the first and second openings.

Abstract: A button switch connected to a cap and includes a base having a pillar, a flexible acoustic member having fixing and flexible rods, a sleeve, an upward-force-applying member abutting against the sleeve and the base, a resilient arm, and a cover disposed on the base. The sleeve rotatably jackets the pillar, passes through the cover to be connected to the cap, and has first and second convex portions, first and second concave portions, and a protruding edge located between the second convex portion and the second concave portion. The resilient arm selectively abuts against a first or second position on the first convex portion. When the resilient arm abuts against the first position and the protruding edge is located above the flexible rod, the flexible rod crosses the protruding edge and then collides with the cover to make a sound when the sleeve receives an external force to move downward.

Abstract: A button switch includes a base having a pillar, a cover disposed on the base, a sleeve, an arm adjacent to the pillar and an elastic member having upward-force-applying, extending-rod, and flexible-rod portions. The sleeve jackets the pillar, passes through the cover, and has first and second ribs. The upward-force-applying portion jackets the pillar and abuts against the sleeve and the base to drive the sleeve to move away from the base. The extending-rod portion extends from the upward-force-applying portion to be connected to the flexible-rod portion located under the first rib. When the sleeve is located at a high position, the second rib biases the arm to deform. When the sleeve is located at a low position, the second rib is misaligned with the arm. The flexible-rod portion crosses the first rib to be released and then collides with the cover to make sound as the sleeve is pressed.

Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.

Abstract: A semiconductor package includes an encapsulated semiconductor device, a redistribution structure, and a protection layer. The encapsulated semiconductor device includes a semiconductor device and an encapsulating material encapsulating the semiconductor device. The redistribution structure is disposed on the encapsulated semiconductor device and includes a dielectric layer and a redistribution circuit layer electrically connected to the semiconductor device. The protection layer at least covers the dielectric layer, wherein an oxygen permeability or a water vapor permeability of the protection layer is substantially lower than an oxygen permeability or a vapor permeability of the dielectric layer.

Abstract: An optical keyswitch includes a casing having a movable portion, a shaft movably disposed on the casing, a resilient member accommodated in the casing, and a switch module including a circuit board, an emitter, and a receiver. The emitter emits an optical signal along an optical path to the receiver. When the shaft is at a non-pressed position, the movable portion has a first spatial relation with the optical path, and the receiver receives the optical signal of a first intensity. When the shaft moves, in response to a pressing force, to a pressed position, the shaft compresses the resilient member and pushes the movable portion to move, so the movable portion no longer has the first spatial relation with the optical path, the optical signal received by the receiver has a second intensity different from the first intensity, and the switch module is triggered to generate a triggering signal.

Abstract: An optical keyswitch includes a keycap, a supporting mechanism having a protrusion disposed under the keycap to support the keycap to move downward or upward, and a switch module including a circuit board, an emitter, and a receiver. The emitter and the receiver are electrically connected to the circuit board. The emitter emits an optical signal to the receiver. When the keycap is not pressed, the receiver receives the optical signal of a first intensity. When the keycap is pressed, the protrusion moves along with the keycap, and the protrusion changes the optical signal received by the receiver to have a second intensity different from the first intensity, so the switch module is triggered to generate a triggering signal.

Abstract: A button switch connected to a cap and includes a base having a pillar, a flexible acoustic member having fixing and flexible rods, a sleeve, an upward-force-applying member abutting against the sleeve and the base, a resilient arm, and a cover disposed on the base. The sleeve rotatably jackets the pillar, passes through the cover to be connected to the cap, and has first and second convex portions, first and second concave portions, and a protruding edge located between the second convex portion and the second concave portion. The resilient arm selectively abuts against a first or second position on the first convex portion. When the resilient arm abuts against the first position and the protruding edge is located above the flexible rod, the flexible rod crosses the protruding edge and then collides with the cover to make a sound when the sleeve receives an external force to move downward.

Abstract: A keyswitch includes a cap, internal and external sleeves, a resilient arm, a base having a pillar, and an elastic member abutting against the internal sleeve and the base. The internal sleeve jackets the pillar, abuts against the cap and has a first outer annular surface with a transverse slot. The external sleeve jackets the internal sleeve and has a protruding block movably inserted into the transverse slot for guiding the external sleeve to rotate and a second outer annular surface having concave and convex portions and an arc-shaped bar. When the resilient arm abuts against a second position on the convex portion and the cap presses the external sleeve, the resilient arm crosses the arc-shaped bar. When the resilient arm abuts against a first position on the convex portion and the cap presses the external sleeve, the resilient arm does not need to cross the arc-shaped bar.

Abstract: A keyswitch with adjustable tactile feedback is adjusted by an adjusting method. The keyswitch includes a baseplate, an upper housing, an upper bushing component, a lower bushing component, a keycap and a recovering component. The baseplate has an electrode module, the upper housing is disposed on the baseplate, the upper bushing component is movably disposed on the upper housing, the lower bushing component is movably located between the baseplate and the upper housing, and the keycap is connected to a connecting portion of the upper bushing component. The lower bushing component can rotate relative to the baseplate to switch between a first position and a second position. The lower bushing component has a first lateral surface and a second lateral surface with different shapes. The recovering component is disposed between the baseplate and the lower bushing component to upwardly push the lower bushing component.

Abstract: A keyswitch with adjustable tactile feedback is adjusted by an adjusting method. The keyswitch includes a baseplate, an upper housing, an upper bushing component, a lower bushing component, a keycap and a recovering component. The baseplate has an electrode module, the upper housing is disposed on the baseplate, the upper bushing component is movably disposed on the upper housing, the lower bushing component is movably located between the baseplate and the upper housing, and the keycap is connected to a connecting portion of the upper bushing component. The lower bushing component can rotate relative to the baseplate to switch between a first position and a second position. The lower bushing component has a first lateral surface and a second lateral surface with different shapes. The recovering component is disposed between the baseplate and the lower bushing component to upwardly push the lower bushing component.

Abstract: A semiconductor package includes an encapsulated semiconductor device, a redistribution structure, and a protection layer. The encapsulated semiconductor device includes a semiconductor device and an encapsulating material encapsulating the semiconductor device. The redistribution structure is disposed on the encapsulated semiconductor device and includes a dielectric layer and a redistribution circuit layer electrically connected to the semiconductor device. The protection layer at least covers the dielectric layer, wherein an oxygen permeability or a water vapor permeability of the protection layer is substantially lower than an oxygen permeability or a vapor permeability of the dielectric layer.

Abstract: A radio-frequency switching circuit includes a first diode, a second diode, a first inductor, a second inductor, a first capacitor, and a second capacitor. Cathodes of the first diode and the second diode are configured to receive a first reference voltage. A first inductor is coupled with an anode of the first diode, and configured to receive a first control voltage. A second inductor is coupled with an anode of the second diode, and configured to receive a second control voltage. The first capacitor is coupled with the first node of the first inductor. The second capacitor is coupled with the first node of the second inductor. When the first control voltage is lower than the first reference voltage, the first diode is switched off. When the second control voltage is lower than the first reference voltage, the second diode is switched off.

Abstract: A package structure and a method of manufacturing the same are provided. The package structure includes a die, a redistribution layer (RDL) structure, a through integrated fan-out via (TIV) and a first connector. The RDL structure is connected to the die and includes a plurality of RDLs. The TIV is aside the die and penetrates through the RDL structure. The first connector is in electrical contact with the TIV and electrically connected to the die. The TIV is in electrical contact with the RDLs of the RDL structure.

Abstract: An illuminated keyswitch includes a base, a keycap, a lift mechanism, and a light source. The keycap includes a cap body and a light guiding rod. The lift mechanism is connected to between the light guiding rod and the base, such that the keycap can vertically move relative to the base through the lift mechanism. The light source is disposed between the light guiding rod and the base and emits light toward the light guiding rod. The light enters the light guiding rod through an end portion of the light guiding rod and then emits out the light guiding rod from another end portion of the light guiding rod and a side surface adjacent to the another end portion toward the cap body. Thereby, the whole cap body can receives relatively uniform back light.

Abstract: A keyswitch uses a combination of springs connected in serial for providing a return force to a keycap of the keyswitch. When the keycap moves toward a base of the keyswitch beyond a transition position, one of the springs stops continuously deforming. It leads to an increment of the elastic coefficient of the combination of springs and an increment of the elastic stored energy by the combination of springs. Therefore, during a pressing on the keycap, the keycap can provide a light force feedback and then a heavy force feedback to a user. Further, the keyswitch can use a switch with a lateral motion, which can reduce influence of a resilient force produced by the switch on the up and down movement of the keycap. The keyswitch also can use an elastic piece disposed beside the keycap, which can provide a tactile feedback to the user.

Abstract: A keyswitch includes a base having a pillar, a cap having a rib and movable relative to the base, a sleeve rotatably sleeving the pillar and having first and second top surfaces and convex and concave portions, an elastic member abutting against the sleeve and the base, and a resilient arm abutting against a first or second position on the convex portion with rotation of the sleeve. When the resilient arm abuts against the first position, the rib abuts against the first top surface to prepress the elastic member for generating a first preload. When the cap is pressed for moving the sleeve downward, the resilient arm moves from the first or second position to the concave portion. When the resilient arm abuts against the second position, the rib abuts against the second top surface to prepress the elastic member for generating a second preload larger than the first preload.