Patents by Inventor Chia-Nan Pai

Chia-Nan Pai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120234590
    Abstract: A printed circuit board includes first to sixth layers, and first to third traces. The first trace is arranged on the first layer. The second trace is arranged on the third layer. The third trace is arranged on the sixth layer. The second trace is electrically connected to the first trace through a first vertical interconnection access (via). The second trace is electrically connected to the third trace through a second via.
    Type: Application
    Filed: April 28, 2011
    Publication date: September 20, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: MING WEI, NING LI, CHIA-NAN PAI, SHOU-KUO HSU
  • Patent number: 8255864
    Abstract: A computing device and a method selects a signal transmission line from a circuit board, computes an actual length of each line segment of the selected signal transmission line, and computes an actual distance between each line segment of the selected signal transmission line and a corresponding line segment of each neighboring signal transmission line. If each actual length is less than or equal to a corresponding reference length and each actual distance is more than or equal to a corresponding reference distance, the device and method determines a design of the selected signal transmission line satisfies the design standards. Otherwise, if any actual length is more than a corresponding reference length, or if any actual distance is less than a corresponding reference distance, the device and method determines the design of the signal transmission line does not satisfy the design standards.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: August 28, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Jia-Lu Ye, Shi-Piao Luo, Chia-Nan Pai, Shou-Kuo Hsu
  • Patent number: 8255866
    Abstract: A computing device and a method involves selection of one or more transmission lines from a printed circuit board (PCB) layout file, reading a transmission line from the one or more selected transmission lines, and determining neighboring anti-pads of the read transmission line in the PCB layout file. The computing device and method further determine an actual distance between the read transmission line and a neighboring anti-pad. If the actual distance is less than a preset standard distance, the computing device and method determine that the read transmission line and the neighboring anti-pad do not satisfy design requirements, and highlight the read transmission line and the neighboring anti-pad, to prompt a user to amend design of the read transmission line and the neighboring anti-pad.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: August 28, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Han-Long Chen, Shi-Piao Luo, Cheng-Hsien Lee, Chia-Nan Pai, Shou-Kuo Hsu
  • Patent number: 8247704
    Abstract: A motherboard interconnection device includes a top layer, a bottom layer, a first and a third electronic elements positioned on the top layer, and a second and a fourth electronic elements positioned on the bottom layer. A first end of the first electronic element on the top layer is connected to the first end of the second electronic element on the bottom layer with a first via hole, and the first end of the third electronic element on the top layer is connected to the first end of the fourth electronic element on the bottom layer with a second via hole. The second ends of the two electronic elements on the top layer are connected to a first part, and the second ends of the two electronic elements on the bottom layer are connected to a second part.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: August 21, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chia-Nan Pai, Han-Long Chen, Ning Li, Shou-Kuo Hsu
  • Patent number: 8243466
    Abstract: A printed circuit board includes first and second layers, a control chip, bonding pads, and several electronic elements. The bonding pads can be selectively applied to interconnect the first and second layers, and the control chip with any of the electronic elements in a simple layout.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: August 14, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Shi-Piao Luo, Chia-Nan Pai, Shou-Kuo Hsu
  • Publication number: 20120185819
    Abstract: In a method for verifying a printed circuit board (PCB) layout using a computing device, a PCB simulation file is obtained from a storage device of the computing device, and a PCB image is displayed on a display device according to the PCB simulation file. The PCB image includes multiple signal lines and switching voltage regulator nodes (SVRN). A SVRN to be checked is selected from the PCB image, and all signal lines around the SVRN are searched. The method calculates a layout distance between the selected SVRN and each of the searched signal lines, and generates a graphical window interface to position a signal line whose layout distance is equal to or less than the minimum distance. The method further modifies the layout of the positioned signal line to satisfy a layout design specification by increasing the layout distance to the minimum distance.
    Type: Application
    Filed: September 25, 2011
    Publication date: July 19, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: ZHENG SHAN, SHI-PIAO LUO, CHIA-NAN PAI, SHOU-KUO HSU
  • Publication number: 20120167027
    Abstract: An electronic device and a method for checking layout distance of a printed circuit board (PCB) including presetting a checking condition to determine a reference layer. A high speed signal path is selected from a PCB design file, and a layer where the selected high speed signal path is located can be determined A reference layer of the determined layer is determined according to the checking condition, and a split line of the reference layer is determined. A shortest distance between each segment of the selected high speed signal path and the split line is calculated. If the shortest distance between a segment and the split line is less than the standard distance, layout of the segment is determined to be invalid.
    Type: Application
    Filed: June 30, 2011
    Publication date: June 28, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: YA-LING HUANG, SHI-PIAO LUO, CHIA-NAN PAI, SHOU-KUO HSU
  • Patent number: 8194412
    Abstract: A printed circuit board includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the signal transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path. A length of a first axis, perpendicular to the signal transmission line, of the void satisfies a following equation: W 1 ? 8 ? Wpad + 10 ? T 0.8 ? Wtrace + T , wherein Wpad is a width of the pad, Wtrace is a width of the transmission line, T is the height of the pad.
    Type: Grant
    Filed: December 25, 2009
    Date of Patent: June 5, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hua-Li Zhou, Chia-Nan Pai, Shou-Kuo Hsu
  • Patent number: 8146048
    Abstract: A system and method for removing T-point elements with unused stubs from a printed circuit board (PCB) layout design obtains each signal line including one or more T-point elements in the PCB layout design, divides the obtained signal line into a plurality of lines according to the one or more T-point elements with unused stubs, and obtains properties of each of the plurality of lines. The system and method further deletes the original layout of the signal line and reconnects the plurality of lines according to the properties of each of the plurality of lines to generate a reconnected signal line, and outputs the reconnected signal line on a display device.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: March 27, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Han-Long Chen, Chia-Nan Pai, Shou-Kuo Hsu
  • Publication number: 20120048610
    Abstract: A printed circuit board (PCB) includes two layers, two signal transmission traces, and a vertical interconnect access (via). The signal transmission traces are respectively arranged on the layers. The signal transmission traces are electrically connected to each other through the via. A centerline of the via with a vertical line of the layers form an acute angle ?, the angle ? is less than cos?1[(Lv2?Lt2)/(Lv2+Lt2)]. Wherein Lt is loss of the two signal transmitting traces in a unit length, and Lv is loss of the via in a unit length.
    Type: Application
    Filed: September 3, 2010
    Publication date: March 1, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHOU-KUO HSU, YUNG-CHIEH CHEN, HSIEN-CHUAN LIANG, WEN-LAING TSENG, SHEN-CHUN LI, CHIA-NAN PAI
  • Patent number: 8110747
    Abstract: A flexible printed circuit board (FPCB) includes a signal layer, upper and lower ground layers, and two dielectric layers. The signal layer includes a differential pair comprising two transmission lines to transmit a pair of differential signals. The dielectric layers are located on and under the signal layer to sandwich the signal layer. The upper ground layer is attached to the dielectric layer on the signal layer, opposite to the signal layer. The lower ground layer is attached to the dielectric layer under the signal layer, opposite to the signal layer. Each ground layer includes a grounded sheet made of conductive material. Two voids are defined in each ground layer and located at opposite sides of the corresponding grounded sheet. Distances between the middle line of the grounded sheet of each ground layer and middle lines of the two transmission lines are equal.
    Type: Grant
    Filed: April 27, 2009
    Date of Patent: February 7, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Shou-Kuo Hsu, Chia-Nan Pai
  • Publication number: 20120030639
    Abstract: A computing device and a method selects a signal transmission line from a circuit board, computes an actual length of each line segment of the selected signal transmission line, and computes an actual distance between each line segment of the selected signal transmission line and a corresponding line segment of each neighboring signal transmission line. If each actual length is less than or equal to a corresponding reference length and each actual distance is more than or equal to a corresponding reference distance, the device and method determines a design of the selected signal transmission line satisfies the design standards. Otherwise, if any actual length is more than a corresponding reference length, or if any actual distance is less than a corresponding reference distance, the device and method determines the design of the signal transmission line does not satisfy the design standards.
    Type: Application
    Filed: December 7, 2010
    Publication date: February 2, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: JIA-LU YE, SHI-PIAO LUO, CHIA-NAN PAI, SHOU-KUO HSU
  • Publication number: 20120026707
    Abstract: A printed circuit board includes first and second layers, a control chip, bonding pads, and several electronic elements. The bonding pads can be selectively applied to interconnect the first and second layers, and the control chip with any of the electronic elements in a simple layout.
    Type: Application
    Filed: August 31, 2010
    Publication date: February 2, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: SHI-PIAO LUO, CHIA-NAN PAI, SHOU-KUO HSU
  • Publication number: 20120017191
    Abstract: A computing device and a method involves selection of one or more transmission lines from a printed circuit board (PCB) layout file, reading a transmission line from the one or more selected transmission lines, and determining neighboring anti-pads of the read transmission line in the PCB layout file. The computing device and method further determine an actual distance between the read transmission line and a neighboring anti-pad. If the actual distance is less than a preset standard distance, the computing device and method determine that the read transmission line and the neighboring anti-pad do not satisfy design requirements, and highlight the read transmission line and the neighboring anti-pad, to prompt a user to amend design of the read transmission line and the neighboring anti-pad.
    Type: Application
    Filed: April 12, 2011
    Publication date: January 19, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    Inventors: HAN-LONG CHEN, SHI-PIAO LUO, CHENG-HSIEN LEE, CHIA-NAN PAI, SHOU-KUO HSU
  • Publication number: 20120007688
    Abstract: A printed circuit board includes an insulation layer and a signal layer attached to the insulation layer. The signal layer includes a pair of differential transmission lines. Width W of each of the differential transmission lines is changed according to change of space S between the differential transmission lines, based on the following formula: W = C ? ? 1 × H × ( C ? ? 2 × H 0.8 ? W 0 + T ) C ? ? 3 × ? C ? ? 4 × S 0 H - 1 1 - C ? ? 3 × ? C ? ? 4 × S H - 1.25 ? T In above formula, C1=7.475, C2=5.98, C3=0.48, C4=?0.96, H is a thickness of the insulation layer, W0 is an original width of each of the differential transmission lines, and S0 is an original space between the differential transmission lines, and T is a thickness of each of the differential transmission lines.
    Type: Application
    Filed: December 3, 2010
    Publication date: January 12, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: HUA-LI ZHOU, MING WEI, CHIA-NAN PAI, SHOU-KUO HSU
  • Patent number: 8058557
    Abstract: An exemplary PCB includes a first reference layer, a first signal layer, a second signal layer, and a third signal layer in that order, a first differential pair is arranged in the first signal layer in edge-coupled structure and references the first reference layer, a distance between the first signal layer and the second signal layer is greater than a distance between the first reference layer and the first signal layer, a second differential pair is arranged in the second signal layer and the third signal layer in broad-coupled structure. The PCB has a high density layout of transmission lines.
    Type: Grant
    Filed: December 15, 2007
    Date of Patent: November 15, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chien-Hung Liu, Shou-Kuo Hsu, Chia-Nan Pai
  • Publication number: 20110094783
    Abstract: A printed circuit board (PCB) includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path.
    Type: Application
    Filed: December 25, 2009
    Publication date: April 28, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HUA-LI ZHOU, CHIA-NAN PAI, SHOU-KUO HSU
  • Publication number: 20110094782
    Abstract: A printed circuit board includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the signal transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path. A length of a first axis, perpendicular to the signal transmission line, of the void satisfies a following equation: W 1 ? 8 ? Wpad + 10 ? T 0.8 ? Wtrace + T , wherein Wpad is a width of the pad, Wtrace is a width of the transmission line, T is the height of the pad.
    Type: Application
    Filed: December 25, 2009
    Publication date: April 28, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HUA-LI ZHOU, CHIA-NAN PAI, SHOU-KUO HSU
  • Publication number: 20110055796
    Abstract: A system and method for removing T-point elements with unused stubs from a printed circuit board (PCB) layout design obtains each signal line including one or more T-point elements in the PCB layout design, divides the obtained signal line into a plurality of lines according to the one or more T-point elements with unused stubs, and obtains properties of each of the plurality of lines. The system and method further deletes the original layout of the signal line and reconnects the plurality of lines according to the properties of each of the plurality of lines to generate a reconnected signal line, and outputs the reconnected signal line on a display device.
    Type: Application
    Filed: February 3, 2010
    Publication date: March 3, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HAN-LONG CHEN, CHIA-NAN PAI, SHOU-KUO HSU
  • Patent number: 7843281
    Abstract: A circuit topology for multiple loads is provided. In an embodiment, the circuit topology includes a driving terminal (50), a first node (A), a first receiving terminal (10), and a second receiving terminal (20). The driving terminal is coupled to the first node via a main transmission line (11), the first node is respectively coupled to the first and second receiving terminals via a first branch transmission line (13) and a second branch transmission line (12). A first resistor (R2) is mounted on the second branch transmission line, a distance the signal travels from the driving terminal to the second receiving terminal via the main transmission line and the second branch transmission line is greater than a distance the signal travels from the driving terminal to the first receiving terminal via the main transmission and the first branch transmission line.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: November 30, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Shou-Kuo Hsu, Chia-Nan Pai, Hsiao-Chuan Tu