Abstract: A transparent conductive film and a touch panel comprising the same are disclosed. The transparent conductive film comprises a substrate and a conductive mesh film disposed on the substrate. The conductive mesh film comprises a plurality of cross-bonded silver nanowires, and a rate of change of resistance of the conductive mesh film is smaller than 1% after bending the transparent conductive film over 250,000 times.

Abstract: According to certain embodiments, the present disclosure provides bispecific antigen-binding molecules comprising a first antigen-binding domain that specifically binds a target antigen and a second antigen binding domain that binds a complement component. In certain embodiments, the bispecific antigen-binding molecules of the present disclosure are capable of binding to the target antigen with an EC50 of about 10 nM or less, and/or are capable of promoting complement deposition on the target antigen with an EC50 of about 10 nM. In certain embodiments, the bispecific antigen-binding molecules of the disclosure are useful for treating diseases in which inhibition or reduction of the growth of an infectious agent or cancer cell is desired and/or therapeutically beneficial.

Abstract: A semiconductor device package and a method of forming the same are provided. The semiconductor device package includes a substrate, a first package component, a second package component, and at least one dummy die. The first and second package components are disposed over and bonded to the substrate. The first and second package components are different types of electronic components that provide different functions. The dummy die is disposed over and attached to the substrate. The dummy die is located between the first and second package components and is electrically isolated from the substrate.

Abstract: The present disclosure provides a charging gun including a cable, an outer casing and a strain relief structure. The outer casing includes a first case and a second case, wherein the first case is detachably assembled with the second case. The strain relief structure includes a first portion, a second portion and a plurality of first ring-shaped protrusions. The first portion is detachably assembled with the second portion, the first portion is disposed on the first housing, and the second portion is disposed on the second housing. When the first case is assembled and connected with the second case, the first portion is assembled and connected with the second portion, and at least a part of a surface of the cable is covered by the strain relief structure, and the strain relief structure is clamped between the cable and the outer casing.

Abstract: A cable clamping assembly includes a cable clamp and a supporting base. The cable clamp includes a protruding base and two bendable arms. The protruding base has an opening disposed on the center of a top surface. The two bendable arms respectively include a plurality of first latching components and a plurality of second latching components. The supporting base includes a concave portion. A guiding slope and a positioning portion are disposed within the concave portion. When the cable clamp clamps a cable, the two bendable arms respectively slide downwardly along two ends of the guiding slope to surround the cable, until one of the two bendable arms is stopped by the positioning portion. The protruding base is deformed in response to a pressing force, so that the bendable arms tie the cable closely, and the plurality of first latching components lock with the plurality of second latching components.

Abstract: A stack structure includes: a substrate, a copper layer disposed on the substrate, a migration-proof layer disposed on the copper layer, and a silver-nanowire layer disposed on the migration-proof layer, wherein the migration-proof layer is made of materials between copper and silver in galvanic series. A touch sensor includes the stack structure.

Abstract: A FinFET device structure and method for forming the same are provided. The fin field effect transistor (FinFET) device structure includes a fin structure formed over a substrate and a gate structure traversing over the fin structure. The gate structure includes a gate electrode layer which includes an upper portion above the fin structure and a lower portion below the fin structure. The upper portion has a top surface with a first width, the lower portion has a bottom surface with a second width, and the first width is greater than the second width.

Abstract: A minimally invasive surgical device includes a main body, a buffer assembly and a cutter bit. The main body includes an inner tube and an outer tube, wherein the inner tube is disposed in the outer tube. An end of the buffer assembly is connected to the inner tube. The cutter bit is connected to another end of the buffer assembly, wherein the cutter bit has a cutting portion. When the cutting portion is in contact with an object, the buffer assembly is adapted to enable the cutter bit to move relatively to the inner tube to decrease a cutting force between the cutting portion and the object, and is adapted to enable the cutting portion to be tilted with a surface of the object.

Abstract: A transparent conductive film and method for making transparent conductive film and touch panel are disclosed. The transparent conductive film includes a substrate and a conductive mesh film. The substrate has a first surface. The conductive mesh film is formed on the first surface of substrate, and the conductive mesh film includes a plurality of silver nanowires. The conductive mesh film includes a plurality of meshes, and the meshes comprise a plurality of traces and a plurality of blank areas. The sheet resistance of the conductive mesh film is 5 ?/sq to 30 ?/sq, the width of each of the traces is 1 ?m to 10 ?m, and a transparency of the conductive mesh film to visible light is greater than 85%.

Abstract: A method of forming a semiconductor device includes: forming a first conductive feature in a first dielectric layer disposed over a substrate; forming a second dielectric layer over the first dielectric layer; etching the second dielectric layer using a patterned mask layer to form an opening in the second dielectric layer, where the opening exposes the first conductive feature; performing an ashing process to remove the patterned mask layer after the etching; wet cleaning the opening after the ashing process, where the wet cleaning enlarges a bottom portion of the opening; and filling the opening with a first electrically conductive material.

Abstract: A photosensitive electrically conductive structure includes: a substrate; a releasing photosensitizing resin layer disposed on the substrate; a nano silver layer disposed on the releasing photosensitizing resin layer; and a photosensitive electrically conductive layer disposed on an edge of the nano silver layer. A visible region is defined in the photosensitive electrically conductive structure where the nano silver layer is not covered by the photosensitive electrically conductive layer and a peripheral wiring region is defined in the photosensitive electrically conductive structure where the nano silver layer is covered by the photosensitive electrically conductive layer. The releasing photosensitizing resin layer has an average molecular weight (Mn) greater than 3,000 but less than 100,000, and the releasing photosensitizing resin layer, the nano silver layer, and the photosensitive electrically conductive layer are patterned.

Abstract: The present invention provides a wireless device including a first wireless module and a second wireless module is disclosed. The first wireless module is configured to transmit data periodically, the second wireless module is configured to communicate with an electronic device, and the second wireless module and the first wireless module perform data transmission/reception based on a time-division multiplexing method. In addition, the second wireless module determines a wake interval and a doze interval based on traffic characteristics of the first wireless module.

Abstract: The present disclosure generally relates to providing indicators of distance. For example, display of a visual distance indicator that indicates the distance between a computer system and an entity is provided.

Abstract: Systems, methods, and articles that improve video playback on various devices by dynamically modifying the operation of a video decoder. The operation of a video decoder is dynamically simplified under certain conditions during video playback to provide higher decoding speeds that require less computing resources.

Abstract: Various implementations include systems for processing audio signals. In particular implementations, a system for processing audio signals includes: an accessory device that includes a first processor for running a machine learning model on an input signal, where the machine learning model includes a classifier configured to generate metadata associated with the input signal; and a wearable audio device configured for wireless communication with the accessory device, the wearable audio device including a second processor that utilizes the metadata from the accessory device to process a source audio signal and output a processed audio signal.

Abstract: A device includes a source/drain (S/D) in a substrate and adjacent to a gate structure, wherein the S/D comprises a protrusion extending from a top surface of the S/D, and the protrusion has a tapered profile. The device further includes a contact plug electrically connected to the protrusion.

Abstract: An embodiment is package structure including a first integrated circuit die, a redistribution structure bonded to the first integrated circuit die, the redistribution structure including a first metallization pattern in a first dielectric layer, the first metallization pattern including a plurality of first conductive features, each of the first conductive features including a first conductive via in the first dielectric layer and first conductive line over the first dielectric layer and electrically coupled to the respective first conductive via, each of the first conductive lines comprising a curve in a plan view, a second dielectric layer over the first dielectric layer and the first metallization pattern, and a second metallization pattern in the second dielectric layer, the second metallization pattern including a plurality of second conductive via in the second dielectric layer, each of the second conductive vias being over and electrically coupled to a respective first conductive line.

Abstract: The present disclosure provides computed-implemented method and computing device for predicting cancer. The computing device: retrieves an electronic medical record of a user from a database; transform the electronic medical record into a matrix; and determine a cancer prediction result corresponding to the matrix according to a cancer prediction model.

Abstract: A package structure and a method of forming the same are provided. The package structure includes an integrated circuit die and a redistribution structure bonded to the integrated circuit die. The redistribution structure includes a first insulating layer, a second insulating layer interposed between the first insulating layer and the integrated circuit die, and a first metallization pattern in the first insulating layer and the second insulating layer. The first metallization pattern includes a first conductive line and a first conductive via coupled to the first conductive line. The first conductive line is in the second insulating layer. The first conductive via is in the first insulating layer. The first conductive line includes a first conductive pad coupled to the first conductive via, a second conductive pad, and a curved portion connecting the first conductive pad to the second conductive pad.