Abstract: Provided are a package structure and a method of forming the same. The package structure includes a package substrate, a first die, and a stiffener ring. The first die is disposed on the package substrate and has a first sidewall and a second sidewall opposite to each other. The stiffener ring is disposed on the package substrate to surround the first die. The stiffener ring has an inner sidewall facing the first die, and the inner sidewall at least has a slant sidewall facing the first sidewall of the first die.

Abstract: A package structure and a formation method of a package structure are provided. The method includes forming a recess in a circuit substrate, and the recess has a first sidewall and a second sidewall. The second sidewall is between the first sidewall and a bottommost surface of the circuit substrate, and the second sidewall is steeper than the first sidewall. The method also includes forming a die package, and the die package has a semiconductor die. The method further includes bonding the die package to the circuit substrate through bonding structures such that a portion of the semiconductor die enters the recess of the circuit substrate. In addition, the method includes forming an underfill material to surround the bonding structures and to fill the recess.

Abstract: A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a first chip structure over the wiring substrate. The chip package structure includes a heat-spreading lid over the wiring substrate and covering the first chip structure. The heat-spreading lid includes a ring structure and a top plate. The ring structure surrounds the first chip structure. The top plate covers the ring structure and the first chip structure. The first chip structure has a first sidewall and a second sidewall opposite to the first sidewall, a first distance between the first sidewall and the ring structure is less than a second distance between the second sidewall and the ring structure, the top plate has a first opening, the first opening has a first inner wall and a second inner wall facing each other.

Abstract: The present disclosure relates to IL2 agonists with improved therapeutic profiles.

Abstract: The present disclosure relates to IL12 receptor agonists with improved therapeutic profiles.

Abstract: In some embodiments, an electronic device displays a plurality of content items in a messaging conversation. In some embodiments, the electronic device displays user interfaces associated with one or more content items in a messaging conversation.

Abstract: A method for making a semiconductor device includes patterning at least one dielectric layer disposed over a conductive cap layer to form a via opening penetrating through the at least one dielectric layer to expose the conductive cap layer and to form a top portion of the conductive cap layer into a metal oxide layer; converting the metal oxide layer to a metal oxynitride layer by a soft ashing process using a processing gas containing nitrogen gas; removing the metal oxynitride layer from a remaining portion of the conductive cap layer; and forming a via contact in the via opening to electrically connect the remaining portion of the conductive cap layer.

Abstract: Various implementations include systems for processing audio signals to remove artifacts introduced by a machine learning system in challenging environments. In particular implementations, a method includes generating a processed audio signal for a hearing assistance device in which the processed audio signal is intended to perceptually dominate a user auditory experience, including: processing an unprocessed audio signal received by the hearing assistance device, wherein the processing includes utilizing a machine learning (ML) system to generate an ML enhanced audio signal; determining a mixing coefficient from an environmental noise assessment; mixing the ML enhanced audio signal with the unprocessed audio signal using the mixing coefficient to generate the processed audio signal; and outputting the processed audio signal.

Abstract: A package structure is provided. The package structure includes a redistribution structure and a semiconductor die over the redistribution structure, and bonding elements below the redistribution structure. The semiconductor die has a first sidewall and a second sidewall connected to each other. The bonding elements include a first row of bonding elements and a second row of bonding elements. In a plan view, the second row of bonding elements is arranged between the first row of bonding elements and an extending line of the second sidewall. A minimum distance between the second row of bonding elements and the first sidewall is greater than the minimum distance between the first row of bonding elements and the first sidewall.

Abstract: A package structure is provided. The package structure includes a first conductive pad in an insulating layer, a first under bump metallurgy structure under the first insulating layer, and a first conductive via in the insulating layer. The first conductive via is vertically connected to the first conductive pad and the first under bump metallurgy structure. In a plan view, a first area of the first under bump metallurgy structure is confined within a second area of the first conductive pad.

Abstract: The present disclosure relates to a fusion protein comprising an antigen-binding moiety that binds specifically to human PD-1 and an IL2 moiety, and methods of use thereof.

Abstract: The present disclosure provides a method for manufacturing a porous film, including: preparing a polymer mixture solution, wherein the polymer mixture solution includes polycaprolactone and at least one hydrophobic polymer; adding solid particles as a dispersing agent to the polymer mixture solution and mixing the solid particles with the polymer mixture solution, wherein the amount of solid particles added is enough to convert the polymer mixture solution into a solid mixture; drying the solid mixture to form a film; and washing the film with a washing fluid to remove the solid particles from the film to form the porous film, wherein the weight ratio of the polycaprolactone to the at least one hydrophobic polymer is about 1:0.1-10, and wherein the weight ratio of the polycaprolactone and the at least one hydrophobic polymer to the solid particles is about 1:0.01-250.

Abstract: graphite composite laminated heat-dissipating structure and a manufacturing method thereof are disclosed. The structure includes a metal substrate and a graphite heat-dissipating layer. The metal substrate has a first surface having a roughness ranging between 0.01 and 10 ?m. The graphite heat-dissipating layer is composed of pure graphite and is directly formed on the first surface by means of physical vapor deposition using a carbon sputtering target. The graphite heat-dissipating layer has a thickness ranging between 0.05 and 2 ?m. The manufacturing method includes S1: directly forming a graphite heat-dissipating layer on a first surface of a metal substrate by means of physical vapor deposition using a carbon sputtering target after the metal substrate has received plasma treatment or infrared heating; and S2: stopping the physical vapor deposition when the graphite heat-dissipating layer has a thickness ranging between 0.05 and 2 ?m.

Abstract: A cognitive assessment system includes a computing device, a server coupled to the computing device and an eye tracking device coupled to the computing device. The computing device includes a cognitive assessment program with at least one cognitive assessment task for assessing at least one cognitive function of a user. The server includes a database. The database stores a historical task performance data of the user, a historical task performance model of the user, task performance data of a healthy population, and task performance data of a patient population. The eye tracking device is for capturing the eye movement data of the user.

Abstract: A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer, and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution is 1:0.01-1. Moreover, the second polymer solution is composed of a second hydrophilic solution.

Abstract: In some embodiments, an electronic device displays a plurality of content items in a messaging conversation. In some embodiments, the electronic device displays user interfaces associated with one or more content items in a messaging conversation.

Abstract: In some embodiments, an electronic device displays a plurality of content items in a messaging conversation. In some embodiments, the electronic device displays user interfaces associated with one or more content items in a messaging conversation.

Abstract: A warpage-reducing semiconductor structure includes a wafer. The wafer includes a front side and a back side. Numerous semiconductor elements are disposed at the front side. A silicon oxide layer is disposed at the back side. A UV-transparent silicon nitride layer covers and contacts the silicon oxide layer. The refractive index of the UV-transparent silicon nitride layer is between 1.55 and 2.10.