Abstract: A semiconductor structure and a method of manufacturing a semiconductor structure are provided. The method includes forming a conductive layer on a precursor memory structure, in which the precursor memory structure includes a plurality of transistors and a plurality of contact plugs disposed on and connected to the transistors. The conductive layer in a TEG region is then patterned to form a first patterned conductive layer on the precursor memory structure. The first patterned conductive layer is then patterned to form a plurality of first landing pads extending along a first direction, in which the first landing pads are separated from each other in a second direction that is different from the first direction and are electrically connected to each other through the contact plugs and the transistors.

Abstract: The present application discloses a semiconductor device with a protruding contact and a method for fabricating the semiconductor device with the protruding contact. The semiconductor device includes a substrate, a capacitor contact structure protruding from the substrate, and a landing pad layer covering a portion of a top surface of the capacitor contact structure and an upper portion of a sidewall of the capacitor contact structure.

Abstract: The disclosure provides a method of manufacturing a semiconductor device including bonding a second device wafer to a first device wafer, such that a first bonding interface including a dielectric-to-dielectric bonding interface and a metal-to-metal bonding interface is formed between the first device wafer and the second device wafer, wherein the second device wafer is electrically coupled to the first device wafer, and a function of the first device wafer and the second device wafer are the same kind of device wafer. A semiconductor device is also provided.

Abstract: The disclosure provides a method of manufacturing a semiconductor device including bonding a second device wafer to a first device wafer, such that a first bonding interface including a fusion-bonding interface is formed between the first device wafer and the second device wafer, wherein the first device wafer and the second device wafer are the same kind of device wafer. A semiconductor device is also provided.

Abstract: A DRAM including a silicon substrate, buried word lines, and active areas is provided. The silicon substrate has a carrier surface. The buried word lines are buried in the silicon substrate. The active areas are located on the carrier surface. The buried word lines intersect the active area. Each of the buried word lines has a first width in one of the active area, and has a second width outside the active areas, and the first width is larger than the second width. A manufacturing method of DRAM is also provided.

Abstract: A DRAM including a silicon substrate, buried word lines, and active areas is provided. The silicon substrate has a carrier surface. The buried word lines are buried in the silicon substrate. The active areas are located on the carrier surface. The buried word lines intersect the active area. Each of the buried word lines has a first width in one of the active area, and has a second width outside the active areas, and the first width is larger than the second width. A manufacturing method of DRAM is also provided.

Abstract: A fuse array structure includes first and second active areas, first and second line contacts, first and second gate contacts and a common gate layer formed across the first and second active areas. The first line contact and the first gate contact are formed on the first active area. The second line contact and the second gate contact are formed on the second active area. The common gate layer is between the first active area and the first gate contact and is between the second active area and the second gate contact. The first active area, the first line contact, the first gate contact and the common gate layer form a first fuse. The second active area, the second line contact, the second gate contact and the common gate layer form a second fuse.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure comprises a substrate having a first top surface. An active region is surrounded by an isolation region in the substrate. A buried power line and a buried signal line are disposed within the substrate and in the active region. A first circuit layer is disposed on the first top surface of the substrate to cover the buried power line and the buried signal line. A second circuit layer is disposed on the first top surface of the substrate and separated from the first circuit layer. A cell capacitor is disposed on and electrically coupled to the first circuit layer.

Abstract: A DRAM including a silicon substrate, buried word lines, and active areas is provided. The silicon substrate has a carrier surface. The buried word lines are buried in the silicon substrate. The active areas are located on the carrier surface. The buried word lines intersect the active area. Each of the buried word lines has a first width in one of the active area, and has a second width outside the active areas, and the first width is larger than the second width. A manufacturing method of DRAM is also provided.

Abstract: The present application discloses a semiconductor device with a protruding contact and a method for fabricating the semiconductor device with the protruding contact. The semiconductor device includes a substrate, a capacitor contact structure protruding from the substrate, and a landing pad layer covering a portion of a top surface of the capacitor contact structure and an upper portion of a sidewall of the capacitor contact structure.

Abstract: The present application discloses a method for fabricating a semiconductor device with a protruding contact. The method includes providing a substrate; forming a bit line structure on the substrate; forming a capacitor contact structure next to the bit line structure; recessing a top surface of the bit line structure; and forming a landing pad layer covering a portion of a top surface of the capacitor contact structure and an upper portion of a sidewall of the capacitor contact structure.

Abstract: The present disclosure provides a method of manufacturing a semiconductor device. The method includes forming an interconnect layer on a semiconductor component, wherein the interconnect layer contains at least one metal pad electrically coupled to the semiconductor component; depositing an insulating layer on the interconnect layer; depositing a bonding dielectric on the insulating layer; and forming a re-routing layer penetrating through the bonding dielectric and the insulating layer and contacting the interconnect layer.

Abstract: A semiconductor structure includes a substrate and a bit line. The substrate has a plurality of active areas and isolation areas. Each isolation area is located between immediately-adjacent two of the active areas to isolate the active areas from each other. The first bit line is formed on a first active area of the active areas. A bottom portion of the first bit line extends within the first active area. The extending bottom portion is surrounded by the first active area.

Abstract: A method of forming a semiconductor structure includes following steps. A first wafer is bonded to a second wafer, in which the first wafer includes a first substrate and a first conductive pad above a first surface of the first substrate, and the second wafer comprises a second substrate and a second conductive pad above a second surface of the second substrate. A mask layer is formed above the first substrate. The mask layer and the first substrate are etched to form a first opening in the first substrate. A sacrificial spacer is formed in the first substrate at a sidewall of the first opening. The first conductive pad is etched to form a second opening communicated to the first opening. A conductive material is filled in the first opening and the second opening to form a conductive structure interconnecting the first and second conductive pads.

Abstract: A method of forming a semiconductor structure includes following steps. A first wafer is bonded to a second wafer, in which the first wafer includes a first substrate and a first conductive pad above a first surface of the first substrate, and the second wafer comprises a second substrate and a second conductive pad above a second surface of the second substrate. A mask layer is formed above the first substrate. The mask layer and the first substrate are etched to form a first opening in the first substrate. A sacrificial spacer is formed in the first substrate at a sidewall of the first opening. The first conductive pad is etched to form a second opening communicated to the first opening. A conductive material is filled in the first opening and the second opening to form a conductive structure interconnecting the first and second conductive pads.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure comprises a substrate having a first top surface. An active region is surrounded by an isolation region in the substrate. A buried power line and a buried signal line are disposed within the substrate and in the active region. A first circuit layer is disposed on the first top surface of the substrate to cover the buried power line and the buried signal line. A second circuit layer is disposed on the first top surface of the substrate and separated from the first circuit layer. A cell capacitor is disposed on and electrically coupled to the first circuit layer.

Abstract: The present disclosure provides a method for manufacturing a semiconductor structure. The method includes providing a substrate having a first top surface; forming an isolation region in the substrate to surround an active region; forming a recess in the active region; disposing a first conductive material within the recess to form a buried power line and a buried signal line; forming a first circuit layer and a second circuit layer on the first top surface of the substrate, wherein the first circuit layer covers the buried power line and the buried signal line, and the second circuit layer is separated from the first circuit layer; and forming a cell capacitor over the first circuit layer.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor component, a re-routing layer, a bonding dielectric and an insulating layer. The re-routing layer is disposed over the semiconductor component and electrically coupled to the semiconductor component. The bonding dielectric is disposed over the semiconductor component to surround a top portion of the re-routing layer. The insulating layer is disposed between the semiconductor component and the bonding dielectric to surround a bottom portion of the re-routing layer.

Abstract: A semiconductor structure including silicon substrate, buried word lines, active areas, isolating areas, and nitride pillars is provided. The silicon substrate has a carrier surface. The buried word lines are buried in the silicon substrate. The active areas and the isolating areas are located on the carrier surface. The nitride pillars are disposed in the isolating areas respectively. The active areas and the isolating areas are arranged along a first direction. The buried word lines are extended along a second direction. The nitride pillars are located below the buried word lines in the isolating areas. A manufacturing method of semiconductor structure is also provided.

Abstract: A semiconductor structure and a method of manufacturing thereof are provided. The semiconductor includes a semiconductor integrated circuit device and a redistribution layer structure. The semiconductor integrated circuit device has a top surface and an electrode on the top surface. The redistribution layer structure is formed on the top surface. The redistribution layer structure includes an oxide layer, a nitride layer, a dielectric layer, a groove and a through via. The oxide layer and the nitride layer are formed on the top surface. The dielectric layer is formed on the nitride layer. The groove is formed at a topside of the dielectric layer and overlaps the electrode. The through via is formed at a bottom of the groove and extends within the electrode through the dielectric layer, the nitride layer and the oxide layer. The through via and the groove are filled with a conductive material.