Abstract: The instant disclosure relates to a raw data compression method for the fabrication process. The method includes the steps of: inputting into a signal converter a collection of raw data points representing operational parameter of a semiconductor equipment within a predetermined time period; obtaining an approximation of the raw data points with a Fourier series; computing the Fourier coefficients and the residuals between the raw data points and the corresponding predicted values predicted by the Fourier series; determining if the residuals exceed an error threshold; recording and storing the Fourier coefficients as the compressed data if none of the residuals exceeds the error threshold; and recording the raw data point as abnormal data point if the corresponding residual exceeds the error threshold before recording and storing the Fourier coefficients and the abnormal data point as the compressed data.

Abstract: A fault detection method of semiconductor manufacturing processes is disclosed. The method includes the steps of providing a storage device, collecting a fault detection and classification(FDC) parameter by the storage device, setting up a measurement site for measuring an online measurement parameter, collecting a wafer acceptance test(WAT) in correspondence to the FDC parameter, establishing a first relationship equation between the FDC parameter and the online measurement parameter, establishing a second relationship equation of the online measurement parameter and the WAT by using the first relationship equation, establishing a third relationship equation between the FDC parameter and the WAT, establishing a waning region of the manufacturing processes by using the first, second, and third relationship equations, and determining the situation of generating wafer defects according to the warning region. The present invention discloses a system architecture for the method.

Abstract: A specification establishing method for controlling semiconductor process, the steps includes: sampling a plurality of sample groups from a population, each sample group being a non-normal distribution; filtering the sample groups; summarizing the filtered sample groups to form a non-normal distribution diagram; getting a value-at-risk and a median by calculating from the non-normal distribution diagram; getting a critical value by calculating the value-at-risk and the median with a critical formula; getting a plurality of state values by calculating the filtered sample groups with a proportion formula; and getting an index value by calculating the non-normal distribution diagram with the proportion formula. Thus, the state values indicate the states of the sample groups are abnormal or not by comparing the state values to the index value.

Abstract: A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of embedded conductive circuits embedded therein and arranged to form a predetermined embedded circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer to cover the embedded conductive circuits. The second coating layer has a touching surface formed on the top side thereof, and the touching surface allows an external object (such as user's finger or touch pen) to touch.

Abstract: A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of conductive circuits arranged to form a predetermined circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer. The second coating layer has a touching surface formed on the top side thereof for an external object to touch. The second coating layer is substantially formed by mixing silicon oxide, aluminum oxide, lithium oxide and Teflon.

Abstract: A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes two transparent conductive films stacked on top of each other and a plurality of embedded conductive circuits formed between the two transparent conductive films and arranged to form a predetermined embedded circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer. The second coating layer has a touching surface on the top side thereof for an external object to touch.

Abstract: A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of embedded conductive circuits embedded into the first coating layer and arranged to form a predetermined embedded circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer. The second coating layer has a touching surface formed on the top side thereof, and the touching surface allows an external object (such as user's finger, any type of touch pen, or etc.) to touch.

Abstract: A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of conductive circuits arranged to form a predetermined circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer to cover the conductive circuits. The second coating layer has a touching surface formed on the top side thereof, and the touching surface allows an external object (such as user's finger, any type of touch pen, or etc.) to touch.

Abstract: A method for assessing data worth for analyzing yield rate includes: getting measured data with data points that corresponds to control variables of semiconductor manufacturing; transforming the data points into a distance matrix with matrix distances corresponding to differences of the data points under the control variables; expressing sample differences recorded in the distance matrix by two-dimension vectors and calculating similarity degrees of the two-dimension vectors and the distance matrix so as to take loss information as a conversion error value; calculating discriminant ability of the transformed two-dimension data and expressing the discriminant ability by an error rate of discriminant; and taking the conversion error value and the error rate of discriminant as penalty terms and calculating a quality score corresponding to the measured data.

Abstract: A ball movement path measuring method includes the steps of: preparing an operating unit and a measurement unit, mounting the triaxial accelerometer in the object to be measured for enabling the triaxial accelerometer to define XYZ triaxial space coordinates, obtaining the data of a initial position of the XYZ axes at a first measuring time and the data of a reference position of the XYZ axes at a second measuring time and transmitting the obtained data to the operating unit, and comparing the reference position to the initial position and calculating the XYZ acceleration data, XYZ vector components of force and torsion force relative to each of XYZ axes after receipt of force subject to the contained angle between the coordinates data of the reference position and the coordinate data of the initial position and then using the XYZ acceleration data and the data of the weight and size of the object to calculate the force experienced by the object, initial velocity, flight duration, flight height, flight distan

Abstract: A method of adjusting wafer process sequence includes steps of collecting production parameters for a plurality of lots; selecting a plurality of key parameters from the production parameters, wherein the key parameters at least includes a processing sequence; defining a formula to obtain an epsilon value; categorizing the lots into groups according to the epsilon value and the minimum point number by using density-based spatial clustering of application with noise (DBSCAN); and adjusting the processing sequences of the lots in the groups. Thereby, the lots with the same process recipe can be continuously or simultaneously sent into a machine, thereby reducing replacement of process recipes or shortening machine idle time.

Abstract: A transparent conductive structure includes a substrate unit, a first coating unit, a diffusion barrier structure, a second coating unit, a third coating unit and a conductive unit. The substrate unit includes a plastic substrate. The first coating unit includes a first coating layer formed on the plastic substrate. The diffusion barrier structure is formed on the first coating layer. The diffusion barrier structure includes a first oxide unit having a plurality of first oxide layers and a second oxide unit having a plurality of second oxide layers. The first oxide layers and the second oxide layers are stacked on top of each other alternately. The second coating unit includes a second coating layer formed on the diffusion barrier structure. The third coating unit includes a third coating layer formed on the second coating layer. The conductive unit includes a transparent conductive film formed on the third coating layer.

Abstract: A transparent conductive structure includes a substrate unit and a conductive unit. The substrate unit includes at least one plastic substrate. The conductive unit includes at least one transparent conductive film and at least one nanometer conductive group formed at the same time, wherein the transparent conductive film is formed on the plastic substrate, and the nanometer conductive group includes a plurality of conductive nanowire filaments mixed or embedded in the transparent conductive film. In other words, both the transparent conductive film and the nanometer conductive group in the instant disclosure can be respectively formed by two different forming methods (such as sputtering and vaporing) at the same time, and the conductive nanowire filaments of the nanometer conductive group can be formed inside the transparent conductive film.

Abstract: A specification establishing method for controlling semiconductor process, the steps includes: providing a database and choosing a population from the database; sampling a plurality of sample groups from the population, each sample group being a non-normal distribution and having a plurality of samples; filtering the sample groups; summarizing the filtered sample groups to form a non-normal distribution diagram; getting a value-at-risk and a median by calculating from the non-normal distribution diagram; getting a critical value by calculating the value-at-risk and the median with a critical formula; getting a plurality of state values by calculating the filtered sample groups with a proportion formula; and getting an index value by calculating the non-normal distribution diagram with the proportion formula. Thus, the state values indicate the states of the sample groups are abnormal or not by comparing the state values to the index value.

Abstract: A manufacturing method of conductive circuits of a touch panel includes the following steps: providing a substrate with a conductive area thereon; providing at least one hard coating layer on the conductive area of the substrate; forming a plurality of grooves on the hard coating layer; forming a metal layer on the hard coating layer and in the grooves; and heating the metal layer so as to condense the metallic materials thereof in the grooves due to surface tension, thus forming a plurality of conductive circuits.

Abstract: A ball game training apparatus includes a positioning device, a first pivot device connected to the positioning device and turnable relative to the positioning device in X-axis direction, a second pivot device connected to the first pivot device and turnable relative to the first pivot device in Y-axis direction, and a driven device connected to the second pivot device and turnable relative to the second pivot device and having a force-receiving ball disposed remote from the second pivot device and strikable to move by an external force.

Abstract: A ball movement path measuring method includes the steps of: preparing an operating unit and a measurement unit, mounting the triaxial accelerometer in the object to be measured for enabling the triaxial accelerometer to define XYZ triaxial space coordinates, obtaining the data of a initial position of the XYZ axes at a first measuring time and the data of a reference position of the XYZ axes at a second measuring time and transmitting the obtained data to the operating unit, and comparing the reference position to the initial position and calculating the XYZ acceleration data, XYZ vector components of force and torsion force relative to each of XYZ axes after receipt of force subject to the contained angle between the coordinates data of the reference position and the coordinate data of the initial position and then using the XYZ acceleration data and the data of the weight and size of the object to calculate the force experienced by the object, initial velocity, flight duration, flight height, flight distan

Abstract: A ball game training apparatus includes a positioning device, a first pivot device connected to the positioning device and turnable relative to the positioning device in X-axis direction, a second pivot device connected to the first pivot device and turnable relative to the first pivot device in Y-axis direction, and a driven device connected to the second pivot device and turnable relative to the second pivot device and having a force-receiving ball disposed remote from the second pivot device and strikable to move by an external force.

Abstract: A projector includes a projection unit located in a shell provided on a vehicle. The projection unit includes a light, a screen, a convex-convex lens and a plane-convex lens. The screen is located in front of the light. The convex-convex lens is located in front of and separated from the screen. The plane-convex lens is located in front of and separated from the convex-convex lens. The light casts light onto the ground in an area beside the vehicle through the screen so that a sign is shown on the ground.

Abstract: A method of detecting variance by regression model has the following steps. Step 1 is preparing the FDC data and WAT data for analysis. Step 2 is figuring out what latent variable effect of WAT data by Factor Analysis Step 3 is utilizing Principal Component Analysis to reduce the number of FDC variables to a few independent principal components. Step 4 is demonstrating how the tools and FDC data affect WAT data by Analysis of covariance model, and constructing interrelationship among FDC, WAT and tools. The interrelationship can point out which parameter effect WAT significantly. By the method, when WAT abnormal situation happened, it is easier for engineers to trace where the problem is.