Patents by Inventor Chieh Chu

Chieh Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110251708
    Abstract: A method for planning a production schedule of equipment includes: receiving information about a material replacement of the equipment; and determining a target production schedule of the equipment according to the information about the material replacement of the equipment, wherein the target production schedule includes an idle period, and during the idle period, the equipment stops manufacturing under a normal state.
    Type: Application
    Filed: May 19, 2010
    Publication date: October 13, 2011
    Inventors: Wei-Jun Chen, Yun-Zong Tian, Yij-Chieh Chu, Yi-Feng Lee
  • Publication number: 20110221558
    Abstract: A coil of a transformer has two side conducting brackets and at least one middle conducting bracket. The middle conducting bracket is elongated or spiral-shaped and has two terminals respectively connected to the side conducting brackets. The side conducting brackets and the at least one middle conducting bracket of some specific type are connected to form different numbers of loops or different types of circuits (series circuits or parallel circuits). Therefore, design and fabrication of the coil is flexible and materials and manufacturing costs are saved. Moreover, the side conducting brackets and the at least one middle conducting bracket require only two or four soldered joints so number of soldered joints required is limited and efficiency of the transformer is improved.
    Type: Application
    Filed: February 25, 2011
    Publication date: September 15, 2011
    Applicant: ACBEL POLYTECH INC.
    Inventors: Kuo-Chu YEH, Shu-Wei Yeh, Chun-Chieh Chu, Wei-Liang Lin
  • Publication number: 20110153660
    Abstract: A method of searching for the key semiconductor operation with randomization for wafer position, comprising: recording the wafer position and the wafer yields of a plurality of wafer ID respectively corresponding to a plurality of semiconductor operations; establishing a matrix model which describes the matrix set for wafer yields of the plurality of wafer ID; analyzing the matrix model, further computing the matrix set for wafer yields of the wafer ID, thereby acquiring the weightings of the randomized wafer positions in such semiconductor operations; and searching for a key semiconductor operation among the plurality of semiconductor operations; herein, by using a local regression model to estimate the wafer position effect, computing the weighting of the position effect in each semiconductor operation based on the estimated position effect and the randomized wafer yield, higher weighting thereof indicates the key semiconductor operation having greater position effect in the aforementioned semiconductor pro
    Type: Application
    Filed: March 4, 2011
    Publication date: June 23, 2011
    Applicant: INOTERA MEMORIES, INC.
    Inventors: YIJ CHIEH CHU, CHUN CHI CHEN, YUN-ZONG TIAN, CHENG-HAO CHEN
  • Publication number: 20110137595
    Abstract: A yield loss prediction method includes: performing a plurality of types of defect inspections upon a plurality of batches of wafers which begin to be processed during different periods to generate defect inspection data, respectively; for a specific batch of wafers different from the plurality of batches of wafers, calculating defect prediction data of at least one type of defect inspection according to the defect inspection data of at least the type of defect inspections; and predicting a yield loss of the specific batch of wafers according to at least the defect prediction data.
    Type: Application
    Filed: March 16, 2010
    Publication date: June 9, 2011
    Inventors: Yij-Chieh Chu, Yun-Zong Tian, Shih-Chang Kao, Wei-Jun Chen, Cheng-Hao Chen
  • Publication number: 20110093226
    Abstract: A fault detection and classification (FDC) method for wafer acceptance test (WAT) parameters includes the following steps. A plurality of fault detection and classification parameters is collected. A plurality of wafer acceptance test parameters that are corresponded by the fault detection and classification parameters is collected. The fault detection and classification parameters are grouped. A contingency table of the wafer acceptance test parameters corresponding to the fault detection and classification parameters is built. A probability model of the contingency table is built. Finally, a safety range of the probability model is determined.
    Type: Application
    Filed: December 27, 2010
    Publication date: April 21, 2011
    Applicant: INOTERA MEMORIES, INC.
    Inventors: YIJ CHIEH-CHU, CHUN CHI CHEN, YUN-ZONG TIAN, CHENG-HAO CHEN
  • Patent number: 7883358
    Abstract: A connection-sensing DC plug has an insulative body, a connection portion, two power terminals, a conductive sheet and a retractable pin. The connecting portion is adapted to electronically connect to a target device and has an isolation layer and a ground layer. The conductive sheet is mounted in the insulative body and contacts either the isolation layer or the ground layer. The retractable pin is movably mounted in the insulative housing parallel to the connecting portion, with one end securely engaging the conductive sheet and the other end protruding from the insulative body. When the DC plug is connected to the target device, the retractable pin is pressed and moves inward to bend the conductive sheet, turning the conductive sheet to a floating state and resulting in a trigger signal.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: February 8, 2011
    Assignee: Acbel Polytech Inc.
    Inventors: Chun-Chieh Chu, Wei-Liang Lin, Chun-Ho Hua
  • Publication number: 20100268501
    Abstract: A method for assessing data worth for analyzing yield rate includes: getting measured data with data points that corresponds to control variables of semiconductor manufacturing; transforming the data points into a distance matrix with matrix distances corresponding to differences of the data points under the control variables; expressing sample differences recorded in the distance matrix by two-dimension vectors and calculating similarity degrees of the two-dimension vectors and the distance matrix so as to take loss information as a conversion error value; calculating discriminant ability of the transformed two-dimension data and expressing the discriminant ability by an error rate of discriminant; and taking the conversion error value and the error rate of discriminant as penalty terms and calculating a quality score corresponding to the measured data.
    Type: Application
    Filed: July 8, 2009
    Publication date: October 21, 2010
    Inventors: Yij Chieh Chu, Chun Chi Chen, Yun-Zong Tian, Shih Chang Kao, Cheng-Hao Chen
  • Publication number: 20100256792
    Abstract: A method of adjusting wafer process sequence includes steps of collecting production parameters for a plurality of lots; selecting a plurality of key parameters from the production parameters, wherein the key parameters at least includes a processing sequence; defining a formula to obtain an epsilon value; categorizing the lots into groups according to the epsilon value and the minimum point number by using density-based spatial clustering of application with noise (DBSCAN); and adjusting the processing sequences of the lots in the groups. Thereby, the lots with the same process recipe can be continuously or simultaneously sent into a machine, thereby reducing replacement of process recipes or shortening machine idle time.
    Type: Application
    Filed: June 2, 2009
    Publication date: October 7, 2010
    Applicant: INOTERA MEMORIES, INC.
    Inventors: YUN-ZONG TIAN, CHUN CHI CHEN, YI FENG LEE, WEI JUN CHEN, SHIH CHANG KAO, YIJ CHIEH CHU, CHENG-HAO CHEN
  • Publication number: 20100236761
    Abstract: A liquid cooled heat sink has a thermal conduction plate and a liquid cooling module. The liquid cooling module is attached securely to the thermal conduction plate and has a distribution tank, a collection tank and a pipe assembly. The pipe assembly has multiple pipes of at least two different gauges and each pipe has a pipe inlet and a pipe outlet respectively secured to the distribution tank and the collection tank. Since a sum of the gauges is increased and each pipe need not to be coiled, an extra strong pumping system is not needed and design complexity is reduced.
    Type: Application
    Filed: September 21, 2009
    Publication date: September 23, 2010
    Inventors: Chien-An Chou, Wen-Hsiung Chen, Chia-Hao Lin, Chun-Chieh Chu
  • Publication number: 20100223027
    Abstract: A monitoring method for multi tools is disclosed. The method includes the steps of providing a plurality of measurement tools for measuring the testing points of standard wafers, calculating a vector for representing a measurement tool, calculating the angle between every two of the vectors and determining the measurement tools having the same performance or not. Thereby, the measurement tools can be efficiently grouped and the measuring stability of the measurement tool is analyzed.
    Type: Application
    Filed: May 26, 2009
    Publication date: September 2, 2010
    Applicant: INOTERA MEMORIES, INC.
    Inventors: YIJ CHIEH CHU, CHUN CHI CHEN, YUN-ZONG TIAN, SHIH CHANG KAO, CHENG-HAO CHEN
  • Publication number: 20100093114
    Abstract: A method of searching for the key semiconductor operation with randomization for wafer position, comprising: recording the wafer position and the wafer yields of a plurality of wafer ID respectively corresponding to a plurality of semiconductor operations; establishing a matrix model which describes the matrix set for wafer yields of the plurality of wafer ID; analyzing the matrix model, further computing the matrix set for wafer yields of the wafer ID, thereby acquiring the weightings of the randomized wafer positions in such semiconductor operations; and searching for a key semiconductor operation among the plurality of semiconductor operations; herein, by using a local regression model to estimate the wafer position effect, computing the weighting of the position effect in each semiconductor operation based on the estimated position effect and the randomized wafer yield, higher weighting thereof indicates the key semiconductor operation having greater position effect in the aforementioned semiconductor pro
    Type: Application
    Filed: December 9, 2008
    Publication date: April 15, 2010
    Applicant: INOTERA MEMORIES, INC.
    Inventors: YIJ CHIEH CHU, CHUN CHI CHEN, YUN-ZONG TIAN, CHENG-HAO CHEN
  • Publication number: 20100049355
    Abstract: A method for determining manufacturing tool production quality includes providing a table with manufacturing process data. The table is analyzed and a contingency table is established. The contingency table comprises several manufacturing tools, manufacturing processes, and the number of occurrences of bad lots. Split the contingency table up into a plurality of sub-tables. Use Cochran-Mantel-Haenszel test for determining the number of bad lots produced by the manufacturing tools and getting a plurality of statistics. Translate the statistics into a plurality of P-values. Sort the P-values for examining data automatically. Draw a line chart for detecting substandard manufacturing tools. As a result, users can diagnose the quality of the manufacturing tools.
    Type: Application
    Filed: November 24, 2008
    Publication date: February 25, 2010
    Applicant: INOTERA MEMORIES, INC.
    Inventors: YIJ CHIEH CHU, CHUN CHI CHEN, YUN-ZONG TIAN, CHENG-HAO CHEN
  • Publication number: 20100010763
    Abstract: A method of detecting variance by regression model is disclosed. Said method comprising: preparing the FDC and WAT data for analysis, figuring out what latent variable effect WAT by Factor Analysis, utilizing Principal Component Analysis to reduce the number of FDC variables to a few independent principal components, demonstrating how the tool and FDC affect WAT by Analysis of covariance model, and constructing interrelationship among FDC, WAT and tools. The interrelationship can point out which parameter effect WAT significantly. By the method, when WAT abnormal situation happened, it is easier for engineers to trace where the problem is.
    Type: Application
    Filed: September 2, 2008
    Publication date: January 14, 2010
    Applicant: INOTERA MEMORIES INC.
    Inventors: YIJ CHIEH CHU, CHUN CHI CHEN, YUN-ZONG TIAN, YI FENG LEE
  • Publication number: 20100004882
    Abstract: A fault detection and classification (FDC) method for wafer acceptance test (WAT) parameters includes the following steps. A plurality of fault detection and classification parameters is collected. A plurality of wafer acceptance test parameters that are corresponded by the fault detection and classification parameters is collected. The fault detection and classification parameters are grouped. A contingency table of the wafer acceptance test parameters corresponding to the fault detection and classification parameters is built. A probability model of the contingency table is built. Finally, a safety range of the probability model is determined.
    Type: Application
    Filed: August 29, 2008
    Publication date: January 7, 2010
    Applicant: INOTERA MEMORIES, INC.
    Inventors: YIJ CHIEH CHU, CHUN CHI CHEN, YUN-ZONG TIAN, CHENG-HAO CHEN
  • Patent number: 7246654
    Abstract: A heat dissipating device includes multiple self-aligning, interconnecting fins linked together. Each self-aligning, interconnecting fin has a first side edge, a second side edge, an inside surface, an outside surface, multiple alignment arms, and multiple outer connecting tabs. The alignment arms perpendicularly extend respectively from the first side edge and the second side edge and have distal ends and multiple inclined edges. The inclined edges press respectively against inclined edges of corresponding alignment arms on an adjacent fin. Then the outer connecting tabs are bent inward against the inside surface of the adjacent fin to hold the fins together securely.
    Type: Grant
    Filed: January 3, 2005
    Date of Patent: July 24, 2007
    Inventor: Yun-Chieh Chu
  • Patent number: 7207707
    Abstract: The back light module of LCD device of the present invention is to use the two ends of reflecting plate to roll up and cover light generating units and reaching the function of lamp reflector. Also, the problem of EMI (electric magnetic interference) can be overcome by covering a shell with an EMI protection function on the roll up ends and/or coating or covering the metal with an EMI protection function on one surface of the reflecting plate.
    Type: Grant
    Filed: April 28, 2004
    Date of Patent: April 24, 2007
    Assignee: AU Optronics Corporation
    Inventors: Hsin-Tao Huang, Chun-Chieh Chu
  • Publication number: 20070029068
    Abstract: A heat sink has a base and multiple fins. The fins are attached to the base, and each fin has a radiating surface and a conducting surface. The conducting surface is formed on the radiating surface and has at least one side abutting the base. The base is attached to an integrated circuit to dissipate heat from the integrated circuit. Because at least one of the two sides of the conducting surfaces is in full contact with the base, more heat is conducted from the base to the fins. Therefore the heat sink can cool the integrated circuit effectively.
    Type: Application
    Filed: August 3, 2005
    Publication date: February 8, 2007
    Inventors: Ming-Jen Cheng, Yuh-Chieh Chu
  • Publication number: 20060276306
    Abstract: A treadmill includes a base, a motion assembly and a pedometer system. The pedometer system has a sensor mounted on the base to monitor a speed of an element of the motion assembly, such as a motor, a transmission device, rollers or a running belt, a processor mounted on the base to detect instant variations of the speed of the element of the motion and count the instant variations, and a display mounted on the base to show a number of the instant variations. As a result, people running or walking on the treadmill of the present invention is informed the number of steps of running or walking.
    Type: Application
    Filed: June 6, 2005
    Publication date: December 7, 2006
    Inventors: Francis Pan, Yen-Hwa Liao, Fu-Chin Chuang, Chin-Chieh Chu
  • Patent number: 7125153
    Abstract: The present invention relates to a sheet-like light source device, including a light-conducting plate having at least one convex portion disposed on the lateral portion thereof; at least one light-source unit disposed on one side of the light-conducting plate, which includes a light source and a reflecting sheet; and a housing having a chassis and at least one frame; in which the frame is mounted on the edges of the chassis, and a concave portion corresponding to the convex portion of the light-conducting plate to hold the convex portion and a plurality of light-guiding mechanisms are formed on the frame. The present invention further has a housing for a sheet-like light source device, including a chassis and a frame mounted on the edges of the chassis, in which a concave portion and a plurality of light-guiding mechanisms are formed on the frame.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: October 24, 2006
    Assignee: Quanta Display, Inc.
    Inventors: Tzu-Fong Huang, Chun-Chieh Chu
  • Publication number: 20060170830
    Abstract: A projection-type television is provided. The projection-type television includes a housing, a frame device, a projection screen and a connecting device. The connecting device cooperates with the frame device to fix the projector screen. The projector screen at least includes a first fringe portion and a second fringe portion, and the frame device at least includes a first frame component, a second frame component and a connector. The first fringe portion is disposed in a first slot formed in the first frame component. The second fringe portion is disposed in a second slot formed in the second frame component. The connector connects the first frame component with the second frame component. The frame device facilitates fixing the projection screen, and then the projection screen can be disposed at desirable positions according to a user's need.
    Type: Application
    Filed: January 27, 2006
    Publication date: August 3, 2006
    Inventor: Chun-Chieh Chu