Abstract: An antenna module is provided. The antenna module includes a circuit board, a conductive layer, and a spiral coil. The circuit board has a first surface and a second surface opposite to each other. The circuit board further includes a first block and a second block connected to each other. The conductive layer is disposed on the first block. The spiral coil is disposed in the second block of the circuit board. The conductive layer at least partially surrounds the spiral coil.

Abstract: The present disclosure provides a tracking system and method thereof. The tracking system comprises a trackable device with an appearance including a feature pattern and a tracking device. The tracking device comprises an optical sensor module configured to capture a first image which covers the trackable device. The tracking device further comprises a processor coupled to the optical sensor module. The processor is configured to retrieve a region of interest (ROI) of the first image based on the feature pattern, and locate a position of each of a plurality of feature blocks in the ROI, where each feature block contains a portion of the feature pattern. The processor further calculates a pose data of the trackable object according to the positions of the feature blocks.

Abstract: A mesh material for fabricating hunting blinds, tents, and other similar flexible structures. The material is durable, water-resistant, and partially light-transmissive such that persons or objects inside or behind the structures are not easily seen from outside the structures. The material is also semi-permeable to air flow for ventilation purposes. The mesh material is fabricated from an interwoven polyester fabric that is coated with acrylic and a mixture of silicone and ethylene vinyl acetate (EVA). Patterns and/or colors are printed on both sides of the fabric with a heat transfer paper printing process to provide a desired level of light transmissivity.

Abstract: A tracking system is provided. The tracking system comprises a trackable device which comprises a first illuminating module and the first illuminating module emits an infrared (IR) light and a tracking device which comprises an optical sensing module and a processor. The optical module is configured to sense an IR spectrum to capture a first image and sense a visible spectrum to capture a second image, and the IR light is in the IR spectrum. The processor is coupled to the optical sensing module. The processor is configured to search in the first image a first region corresponding to the IR light, locate in the second image a second region associated with the first region in the first image, and calculate a spatial status of the trackable device according to the second region in the second image.

Abstract: A ceramic substrate component suitable for high-power chips includes a ceramic substrate body and at least one raised metal pad. The ceramic substrate body has an upper surface and a lower surface opposite to the upper surface. The raised metal pad includes a base portion and a top layer. The base portion, which is attached to the upper surface of the ceramic substrate body, has a thickness between 10 and 300 micrometers, and a thermal expansion coefficient greater than the ceramic substrate body. The top layer is formed on the base portion and adapted to install a high-power chip thereon. The top layer extends an area less than the base portion but greater than the high-power chip, and has a thermal expansion coefficient greater than the ceramic substrate body. As such, damages due to thermal stress occurring between the base portion and the ceramic substrate body can be mitigated.

Abstract: A ceramic substrate component suitable for high-power chips includes a ceramic substrate body and at least one raised metal pad. The ceramic substrate body has an upper surface and a lower surface opposite to the upper surface. The raised metal pad includes a base portion and a top layer. The base portion, which is attached to the upper surface of the ceramic substrate body, has a thickness between 10 and 300 micrometers, and a thermal expansion coefficient greater than the ceramic substrate body. The top layer is formed on the base portion and adapted to install a high-power chip thereon. The top layer extends an area less than the base portion but greater than the high-power chip, and has a thermal expansion coefficient greater than the ceramic substrate body. As such, damages due to thermal stress occurring between the base portion and the ceramic substrate body can be mitigated.

Abstract: A mesh material for fabricating hunting blinds, tents, and other similar flexible structures. The material is durable, water-resistant, and partially light-transmissive such that persons or objects inside or behind the structures are not easily seen from outside the structures. The material is also semi-permeable to air flow for ventilation purposes. The mesh material is fabricated from an interwoven polyester fabric that is coated with acrylic and a mixture of silicone and ethylene vinyl acetate (EVA). Patterns and/or colors are printed on both sides of the fabric with a heat transfer paper printing process to provide a desired level of light transmissivity.

Abstract: A solar cell testing system including a lower electrode, a solar cell, an encapsulation material, a sodium-containing template, an upper electrode, a voltage source and a measuring circuit is provided. The solar cell is disposed on the lower electrode. The encapsulation material is disposed on the solar cell. The sodium-containing template is disposed on the encapsulation material, wherein the sodium-containing template has a sodium ion content ranging between 9-39%. The upper electrode is disposed on the sodium-containing template. The voltage source is connected between the upper electrode and the lower electrode. The measuring circuit is connected between the solar cell and the lower electrode for measuring a shunt resistance of the solar cell.

Abstract: The present invention relates to a phosphor, a method for preparing the phosphor, an optoelectronic component, and a method for producing the optoelectronic component. The phosphor has the following general formula: La3(1?x)Ga1?yGe5(1?z)O16: 3xA3+, yCr3+, 5zB4+, where x, y, and z do not equal to 0 simultaneously; A represents at least one of Gd and Yb; B represents at least one of Sn, Nb, and Ta. For the phosphor, its emission spectrum is within a red visible light region and a near-infrared region when excited by blue visible light, purple visible light or ultraviolet light; and it has a wide reflection spectrum and a high radiant flux. Therefore, it can be used in optoelectronic components such as LEDs to meet requirements of current medical testing, food composition analysis, security cameras, iris/facial recognition, virtual reality, gaming notebook and light detection and ranging applications.

Abstract: A motor control device with built-in shunt resistor and power transistor is disclosed, comprising a high-thermally conductive substrate; an electrically conductive circuit which is thermo-conductively installed on the high-thermally conductive substrate and includes a first thermal connection pad portion and a second thermal connection pad portion mutually spaced apart; a high power transistor conductively connected to the electrical conducive circuit; and a shunt resistor conductively connected to the high power transistor, respectively including a body whose thermal expansion coefficient is greater than that of the high-thermally conductive substrate, as well as a pair of welding portions extending from the body, in which the body has a prescribed width, and the width of the welding portion is greater than the prescribed width, and the body and the high-thermally conductive substrate are spaced apart such that, upon welding the welding portion to the first thermal connection pad portion and the second therm

Abstract: The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip scale package (CSP) light emitting element and a shading layer, where the CSP light emitting element includes a light emitting chip, and the light emitting chip includes an electrode group located on a bottom surface of the light emitting chip, the shading layer is disposed on a bottom surface and/or a side surface of the CSP light emitting element. An LED package structure according to the present disclosure solves a problem that the blue light leaking from the bottom surface of the LED chip interferes with the emission color of the CSP emitting device, and reduces the luminous efficiency of the emitting device.

Abstract: A sole assembly for an article of footwear has a first portion having a lower ground engaging surface, an upper surface, and a recess formed in the upper surface. A second portion is seated in the recess in the first portion and has an upper surface. The second portion is formed from a first foam material prepared by a reaction product of a composition having about 10 to about 100 phr of a hydrogenated copolymer and about 10 to about 90 phr of a copolymer of ethlylene and an alpha olefin, the alpha olefin having up to 20 carbon atoms. The first foam material has a hardness of 25 to 45 Asker C and a density of less than 0.18 g/cm3.

Abstract: A positioning system and method thereof are provided in this disclosure. The positioning method includes steps of: emitting a radiation from a first electronic apparatus to a second electronic apparatus and starting to accumulate a time count; sensing the radiation on the second electronic apparatus and sending a first ultrasonic signal from the second electronic apparatus to the first electronic apparatus; sensing the first ultrasonic signal by a plurality of ultrasound sensors on the first electronic apparatus and calculating a plurality of first time periods started from the radiation is emitted until the first ultrasonic signal is sensed by the ultrasound sensors; calculating a plurality of first relative distances between the ultrasound sensors and a first ultrasound emitter on the second electronic apparatus; and locating a first relative position of the second electronic apparatus relative to the first electronic apparatus according to the first relative distances.

Abstract: Various examples described herein provide for a management controller that includes a virtual universal serial bus (USB) host controller that can emulate an actual USB host controller to a central processor. A particular endpoint from a number of endpoints is associated with a virtual USB device that is coupled to the virtual USB host controller. The particular endpoint is to refer to a location in a management memory.

Abstract: A proximity sensing device which is disposed under the OLED panel and has an emitting module and a receiving module, is provided. The emitting module can emit an invisible light which has a peak wavelength not less than 1000 nm. The receiving module is disposed adjacent to the emitting module and can receive a reflecting light from the reflected invisible light. Therefore, the invisible light passing through the OLED panel will not cause a bright spot on the panel.

Abstract: Technical solutions are described for fabricating a semiconductor wafer. An example method includes generating a process assumption band for an element of the wafer. The process assumption band depicts a shape of the element based on a set of process variations in a photolithographic process used for fabricating the wafer. The method also includes generating a process variation band for the element of the wafer based on optical process correction simulation of the photolithographic process using design rules associated with the wafer. The method also includes determining a deviation between the process assumption band and the process variation band, and recalculating one or more design rules from the design rules associated with the wafer based on the deviation. The method also includes updating the design of the wafer in response to the process variation band not being changeable to match the process assumption band, after recalculating the design rules.

Abstract: A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.

Abstract: The invention, in some aspects relates to compositions and methods for imaging biological systems and physiological activity and conditions in cells.

Abstract: A light-emitting device includes a semiconductor structure including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a via penetrating the second semiconductor layer and the active layer to expose a surface of the first semiconductor layer; a first electrode formed in the via and on the second semiconductor layer; a second electrode formed on the second semiconductor layer; and an insulating structure covering the first electrode, the second electrode and the semiconductor structure and including a first opening to expose the first electrode and a second opening to expose the second electrode, wherein the first electrode and the second electrode respectively include a metal layer contacting the insulating layer, the metal layer includes a material including a surface tension value larger than 1500 dyne/cm and a standard reduction potential larger than 0.3 V.

Abstract: A printed circuit board with built-in vertical heat dissipation ceramic block, and an electrical assembly are disclosed. The electrical assembly includes the board and a plurality of electronic components. The printed circuit boards includes a dielectric material layer defining at least one through hole, at least one ceramic block corresponding to the through hole, at least one fixing portion for joining the ceramic block to the through hole of the dielectric material layer, a metal circuit layer provided on upper surfaces of the dielectric material layer and the ceramic block, and a high thermal conductivity layer provided on lower surfaces of the dielectric material layer and the ceramic block. The printed circuit board allows the location and size of the ceramic block to be modified according to requirements, so as to implement complicated circuit designs, achieve good effect of thermal conduction, control thermal conduction path, and reduce manufacturing cost.