Patents by Inventor Chieh Yu

Chieh Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10317321
    Abstract: The invention provides a method termed protein retention ExM (proExM), in which proteins, rather than labels, are anchored to the swellable gel, using a cross-linking molecule. This proExM strategy can be used to perform nanoscale imaging of immunostained cells and tissues as well as samples expressing various FPs as fluorescent signals from genetically encoded fluorescent proteins and/or conventional fluorescently labeled secondary antibodies and streptavidin that are directly anchored to the gel are preserved even when subjected to the nonspecific proteolytic digestion.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: June 11, 2019
    Assignee: Massachusetts Institute of Technology
    Inventors: Paul Warren Tillberg, Fei Chen, Edward Stuart Boyden, Chih-Chieh Yu
  • Patent number: 10288890
    Abstract: A system for removably attaching a portable display to a headpiece is described that includes an attachment device configured to receive the portable display. The attachment device includes a mounting base configured to mount to a longitudinal frame member of the headpiece. The mounting base includes a receptacle for receiving a mounting protrusion of the portable display. The attachment device further includes one or more opposing hooks connected to the mounting base. The hooks are configured to receive opposing ends of an elastic band when the elastic band is connected between the hooks and around the longitudinal frame member.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: May 14, 2019
    Assignee: Garmin Switzerland GmbH
    Inventors: David F. Lammers-Meis, Sheng-Kai Chang, Ssu-Chieh Yu
  • Patent number: 10279238
    Abstract: The utility model discloses a width-adjustable skate with an interchangeable function, including a shell, a toe cap, a width adjustment screw, and a width adjustment moving part. The bottom of the shell is provided with a replaceable sliding assembly. By means of the replaceable sliding assembly, a user can mount a blade-type sliding assembly or a roller-type sliding assembly as required, thus implementing interchange. Moreover, the width of the skate is adjustable, such that the user feels more comfortable when wearing it.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: May 7, 2019
    Inventor: Juei-Chieh Yu
  • Publication number: 20190081389
    Abstract: An antenna module is provided. The antenna module includes a circuit board, a conductive layer, and a spiral coil. The circuit board has a first surface and a second surface opposite to each other. The circuit board further includes a first block and a second block connected to each other. The conductive layer is disposed on the first block. The spiral coil is disposed in the second block of the circuit board. The conductive layer at least partially surrounds the spiral coil.
    Type: Application
    Filed: September 6, 2018
    Publication date: March 14, 2019
    Inventors: Chien-Hung TSAI, Kuo-Chu LIAO, Wei-Cheng LO, Te-Li LIEN, Hsuan-Chi TSAI, Ming-Shan WU, Yung-Chieh YU
  • Publication number: 20190072846
    Abstract: Technical solutions are described for fabricating a semiconductor wafer. An example method includes generating a process assumption band for an element of the wafer. The process assumption band depicts a shape of the element based on a set of process variations in a photolithographic process used for fabricating the wafer. The method also includes generating a process variation band for the element of the wafer based on optical process correction simulation of the photolithographic process using design rules associated with the wafer. The method also includes determining a deviation between the process assumption band and the process variation band, and recalculating one or more design rules from the design rules associated with the wafer based on the deviation. The method also includes updating the design of the wafer in response to the process variation band not being changeable to match the process assumption band, after recalculating the design rules.
    Type: Application
    Filed: November 21, 2017
    Publication date: March 7, 2019
    Inventors: CHIEH-YU LIN, DONGBING SHAO, KEHAN TIAN, ZHENG XU
  • Publication number: 20190072845
    Abstract: Technical solutions are described for fabricating a semiconductor wafer. An example method includes generating a process assumption band for an element of the wafer. The process assumption band depicts a shape of the element based on a set of process variations in a photolithographic process used for fabricating the wafer. The method also includes generating a process variation band for the element of the wafer based on optical process correction simulation of the photolithographic process using design rules associated with the wafer. The method also includes determining a deviation between the process assumption band and the process variation band, and recalculating one or more design rules from the design rules associated with the wafer based on the deviation. The method also includes updating the design of the wafer in response to the process variation band not being changeable to match the process assumption band, after recalculating the design rules.
    Type: Application
    Filed: September 6, 2017
    Publication date: March 7, 2019
    Inventors: CHIEH-YU LIN, DONGBING SHAO, KEHAN TIAN, ZHENG XU
  • Publication number: 20190044036
    Abstract: The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip scale package (CSP) light emitting element and a shading layer, where the CSP light emitting element includes a light emitting chip, and the light emitting chip includes an electrode group located on a bottom surface of the light emitting chip, the shading layer is disposed on a bottom surface and/or a side surface of the CSP light emitting element. An LED package structure according to the present disclosure solves a problem that the blue light leaking from the bottom surface of the LED chip interferes with the emission color of the CSP emitting device, and reduces the luminous efficiency of the emitting device.
    Type: Application
    Filed: August 3, 2018
    Publication date: February 7, 2019
    Inventors: KE-HAO PAN, SHENG-WEI CHOU, YI-SHENG LAN, CHIA-FONG CHOU, CHUNG-CHUAN HSIEH, JEN-HAO PAN, HAO-YU YANG, CHIEH-YU KANG, TZU-LUN TSENG
  • Publication number: 20190026904
    Abstract: The present disclosure provides a tracking system and method thereof. The tracking system comprises a trackable device with an appearance including a feature pattern and a tracking device. The tracking device comprises an optical sensor module configured to capture a first image which covers the trackable device. The tracking device further comprises a processor coupled to the optical sensor module. The processor is configured to retrieve a region of interest (ROI) of the first image based on the feature pattern, and locate a position of each of a plurality of feature blocks in the ROI, where each feature block contains a portion of the feature pattern. The processor further calculates a pose data of the trackable object according to the positions of the feature blocks.
    Type: Application
    Filed: July 24, 2018
    Publication date: January 24, 2019
    Inventors: Yuan-Tung CHEN, Tzu-Chieh YU
  • Publication number: 20190017867
    Abstract: The invention provides a light emitting sensing device and a manufacturing method thereof. The light emitting sensing device comprises: a non-translucent substrate having a first surface with at least one recess formed on the first surface; a light emitting element disposed in the at least one recess; a light sensing element disposed on the first surface; a first transparent material disposed in the at least one recess and covering the light emitting element; and a second transparent material disposed on the first surface and covering the light sensing element. The light emitting sensing device provided in this embodiment solves the problem in the prior art, the infrared light emitted by the light emitting chip irradiates into the sensing chip and causes the sensing chip to be interfered by the light of the light emitting chip resulting in reduced sensing accuracy.
    Type: Application
    Filed: July 12, 2018
    Publication date: January 17, 2019
    Applicant: Everlight Electronics Co., Ltd.
    Inventors: SHIH-WEN LAI, CHIH-HAO HSU, YI-HUI LIAO, JIAN-HONG LAI, YI-TING HUANG, KUAN-YU CHEN, SHU-WEI CHEN, CHIEH-YU KANG
  • Patent number: 10180558
    Abstract: An image module and an electronic device using the same are provided. The image module includes a connecting element and a lens structure. The connecting element includes an inner ring, an outer ring and a connecting portion. The connecting portion connects the inner ring and the outer ring. The lens structure is mounted in the inner ring.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: January 15, 2019
    Assignee: ABILITY ENTERPRISE CO., LTD.
    Inventors: Yen-Min Chang, Chien-Hsin Lien, Chih-Chieh Yu, Cheng-En Lu, Hsien-Feng Lin
  • Patent number: 10177290
    Abstract: This disclosure discloses a light-emitting device includes a semiconductor stack, an electrode, an electrode post, a reflective insulating layer, an extending electrode, and a supporting structure. The electrode is disposed on a lower surface of the semiconductor stack, and electrically connected to the semiconductor stack. The electrode post is disposed on the electrode. The reflective insulating layer surrounds the electrode post, and has a bottom surface which is coplanar with the electrode post. The extending electrode is disposed on an upper surface of the semiconductor stack. The supporting structure is located on the extending electrode.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: January 8, 2019
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Jen-Chieh Yu, Wei-Fan Ke
  • Publication number: 20180374997
    Abstract: The present invention provides a package support structure and a light emitting device including same. The package support structure includes: a housing which comprises a light emitting surface, a backlight surface, a bottom surface and a groove; a conductive support which is partially covered by the housing and includes a first lead and a second lead that are separated from each other, where each of the first lead and the second lead includes an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing; where one of the first lead and the second lead further includes a heat radiation portion, the heat radiation portion extend outward from the electrode portion and is exposed from the backlight surface of the housing.
    Type: Application
    Filed: June 27, 2018
    Publication date: December 27, 2018
    Applicant: Everlight Electronics Co., Ltd.
    Inventors: Chien-Nan Liu, Teng-Wei Chen, Chieh-Yu Kang, Hao-Yu Yang, Yu-Da Lee
  • Patent number: 10157596
    Abstract: An image controlling apparatus in a digital photo frame includes a base defining an accommodating space, a pivot shaft, a conducting member on the pivot shaft and switching contact points in a circle with a radius of the conducting member. The pivot shaft and the conducting member are received in the accommodating space, and the conducting member can rotate under gravity, when two of the plurality of switching contact points are connected by the conducting member, the image controlling apparatus sends a predetermined controlling signal to control display orientation of an image. The digital photo frame is further disclosed.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: December 18, 2018
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Xin Yang, Chieh-Yu Lee
  • Publication number: 20180352646
    Abstract: A printed circuit board with built-in vertical heat dissipation ceramic block, and an electrical assembly are disclosed. The electrical assembly includes the board and a plurality of electronic components. The printed circuit boards includes a dielectric material layer defining at least one through hole, at least one ceramic block corresponding to the through hole, at least one fixing portion for joining the ceramic block to the through hole of the dielectric material layer, a metal circuit layer provided on upper surfaces of the dielectric material layer and the ceramic block, and a high thermal conductivity layer provided on lower surfaces of the dielectric material layer and the ceramic block. The printed circuit board allows the location and size of the ceramic block to be modified according to requirements, so as to implement complicated circuit designs, achieve good effect of thermal conduction, control thermal conduction path, and reduce manufacturing cost.
    Type: Application
    Filed: June 1, 2018
    Publication date: December 6, 2018
    Inventors: Ho-Chieh Yu, Cheng-Lung Liao, Chun-Yu Lin, Jason An-Cheng Huang
  • Publication number: 20180332240
    Abstract: A tracking system is provided. The tracking system comprises a trackable device which comprises a first illuminating module and the first illuminating module emits an infrared (IR) light and a tracking device which comprises an optical sensing module and a processor. The optical module is configured to sense an IR spectrum to capture a first image and sense a visible spectrum to capture a second image, and the IR light is in the IR spectrum. The processor is coupled to the optical sensing module. The processor is configured to search in the first image a first region corresponding to the IR light, locate in the second image a second region associated with the first region in the first image, and calculate a spatial status of the trackable device according to the second region in the second image.
    Type: Application
    Filed: May 14, 2018
    Publication date: November 15, 2018
    Inventors: Yuan-Tung CHEN, Hsu-Hong FENG, Tzu-Yin CHANG, Wei-Ta WANG, Tzu-Chieh YU
  • Publication number: 20180300532
    Abstract: A tracking system includes a trackable device and a tracking device. The trackable device has a three-dimensional shape. The trackable device includes a first orientation sensor for sensing a first orientation of the trackable device. The tracking device is communicated with the trackable device. The tracking device includes a second orientation sensor, an image sensor and a processing circuit. The second orientation sensor is configured to sense a second orientation of the trackable device. The image sensor configured to capture an image. The processing circuit is coupled with the second orientation sensor and the image sensor. The processing circuit is operable to calculate a two-dimensional silhouette corresponding to the three-dimensional shape according to the first orientation and the second orientation, and utilize the two-dimensional silhouette to search the image captured by the image sensor for allocating coordinates of the trackable device within the image.
    Type: Application
    Filed: April 13, 2018
    Publication date: October 18, 2018
    Inventors: Yuan-Tung CHEN, Chieh-Yu TSENG
  • Publication number: 20180302596
    Abstract: An electronic device which can physically move according to vocal instructions includes a control device, a voice device, and a driving device. The control device responds to user instructions. The voice device is used for performing voice interaction between the electronic device and a user. The driving device drives the electronic device to move. When the voice device receives a voice instruction from the user, the control device recognizes the voice instruction. If a voice instruction includes a destination position, the control device recognizes same and transmits a moving control instruction to the driving device, the driving device drives the electronic device to move to that destination position.
    Type: Application
    Filed: October 31, 2017
    Publication date: October 18, 2018
    Inventors: ZHAN-SHENG LU, CHAO-FEI LUO, CHIEH-YU LEE
  • Publication number: 20180293408
    Abstract: In one implementation, a system for peripheral device security includes a hardware interface coupled to an out-of-band manager, and the out-of-band manager is to: authorize a peripheral device via the hardware interface; and load instructions from the peripheral device to a host interface.
    Type: Application
    Filed: May 11, 2015
    Publication date: October 11, 2018
    Inventors: Erik L YOUNG, Andrew C CARTES, Richard Wei Chieh YU
  • Publication number: 20180247615
    Abstract: An image controlling apparatus in a digital photo frame includes a base defining an accommodating space, a pivot shaft, a conducting member on the pivot shaft and switching contact points in a circle with a radius of the conducting member. The pivot shaft and the conducting member are received in the accommodating space, and the conducting member can rotate under gravity, when two of the plurality of switching contact points are connected by the conducting member, the image controlling apparatus sends a predetermined controlling signal to control display orientation of an image. The digital photo frame is further disclosed.
    Type: Application
    Filed: June 15, 2017
    Publication date: August 30, 2018
    Inventors: XIN YANG, CHIEH-YU LEE
  • Publication number: 20180239728
    Abstract: Various examples described herein provide for a management controller that includes a virtual universal serial bus (USB) host controller that can emulate an actual USB host controller to a central processor. A particular endpoint from a number of endpoints is associated with a virtual USB device that is coupled to the virtual USB host controller. The particular endpoint is to refer to a location in a management memory.
    Type: Application
    Filed: February 17, 2017
    Publication date: August 23, 2018
    Inventors: Theodore F. Emerson, David F. Heinrich, Richard Wei Chieh Yu, Robert L. Noonan, Christopher J. Frantz, Sze Hau Loh