Patents by Inventor Chien Chih Chen

Chien Chih Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220085141
    Abstract: An electronic device is provided and includes a first voltage trace, a second voltage trace, a first region electrode, a second region electrode, and a voltage source module. The second voltage trace is electrically insulated from the first voltage trace, the first region electrode is electrically connected to the first voltage trace, and the second region electrode is electrically connected to the second voltage trace. The voltage source module provides a first driving voltage to the first voltage trace and provides a second driving voltage to the second voltage trace, in which the first driving voltage is different from the second driving voltage. In a top-view direction of the electronic device, the first voltage trace is separated from the second voltage trace, and the first voltage trace and the second voltage trace are formed of a conductive layer.
    Type: Application
    Filed: November 29, 2021
    Publication date: March 17, 2022
    Applicant: InnoLux Corporation
    Inventors: Shu-Hui Yang, Chien-Chih Chen, Ming-Che Chiang, Hong-Pin Ko
  • Patent number: 11276568
    Abstract: In a method of manufacturing a semiconductor device, an underlying structure is formed. A surface grafting layer is formed on the underlying structure. A photo resist layer is formed on the surface grafting layer. The surface grafting layer includes a coating material including a backbone polymer, a surface grafting unit coupled to the backbone polymer and an adhesion unit coupled to the backbone polymer.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: March 15, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Ling Chang Chien, Chien-Chih Chen, Chin-Hsiang Lin, Ching-Yu Chang, Yahru Cheng
  • Patent number: 11233361
    Abstract: A connector assembly is provided which includes a shielding shell, a receptacle connector and a heat sink. The shielding shell has a top wall, a receiving cavity positioned inside, an inserting opening which is positioned at a front end of the shielding shell and communicated with the receiving cavity and a window which is formed to the top wall, extends rearwardly and is communicated with the receiving cavity. The receptacle connector is provided to a rear segment of the receiving cavity. The heat sink is provided to the top wall and includes a heat dissipating base. A bottom face of the heat dissipating base downwardly enters the receiving cavity via the window and directly faces a top face of the receptacle connector. The bottom face of the heat dissipating base facing the receptacle connector is provided with a front stopping portion which is adapted to stop a mating module.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: January 25, 2022
    Assignee: Molex, LLC
    Inventor: Chien-Chih Chen
  • Publication number: 20220022317
    Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.
    Type: Application
    Filed: August 19, 2021
    Publication date: January 20, 2022
    Applicant: Unimicron Technology Corp.
    Inventors: Yu-Shen Chen, I-Ta Tsai, Chien-Chih Chen
  • Patent number: 11217655
    Abstract: An electronic device is provided and includes a first voltage trace, a second voltage trace, a first region electrode, a second region electrode, and a voltage source module. The second voltage trace is electrically insulated from the first voltage trace, the first region electrode is electrically connected to the first voltage trace, and the second region electrode is electrically connected to the second voltage trace. The voltage source module provides a first driving voltage to the first voltage trace and provides a second driving voltage to the second voltage trace, in which the first driving voltage is different from the second driving voltage.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: January 4, 2022
    Assignee: InnoLux Corporation
    Inventors: Shu-Hui Yang, Chien-Chih Chen, Ming-Che Chiang, Hong-Pin Ko
  • Publication number: 20210405534
    Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.
    Type: Application
    Filed: July 2, 2021
    Publication date: December 30, 2021
    Inventors: Shih-Ming Chang, Wen Lo, Chun-Hung Liu, Chia-Hua Chang, Hsin-Wei Wu, Ta-Wei Ou, Chien-Chih Chen, Chien-Cheng Chen
  • Publication number: 20210389670
    Abstract: A method of manufacturing a semiconductor device includes forming a photoresist layer over a substrate. The photoresist layer includes a photoresist composition includes a polymer. The polymer includes a monomer unit having a pendant sensitizer and crosslinking group, and a monomer unit having a pendant acid labile group. The photoresist layer is selectively exposed to actinic radiation, and the selectively exposed photoresist layer is developed.
    Type: Application
    Filed: April 15, 2021
    Publication date: December 16, 2021
    Inventor: Chien-Chih CHEN
  • Patent number: 11199736
    Abstract: An electronic device is disclosed, which includes a first substrate structure, a flexible substrate and a first recess. The flexible substrate is disposed on the first substrate structure. The first recess is disposed on a first surface of the flexible substrate, and the first surface is close to the first substrate structure, wherein the first recess at least overlaps the first substrate structure.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: December 14, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Kuan-Jen Wang, Chien-Chih Chen, Chih-Chieh Fan, Chin-Der Chen, Cheng-Fu Wen, Chin-Lung Ting
  • Publication number: 20210375199
    Abstract: A display panel and a spliced display are provided. The display panel includes a substrate, a plurality of light-emitting elements, a driving circuit, and an optical sensor. The substrate includes a through hole, and the through hole includes a hole. The plurality of the light-emitting elements are disposed on the substrate. The through hole is located in a region between two of the plurality of the light-emitting elements. The driving circuit is disposed on the substrate and electrically connected to the plurality of the light-emitting elements. The optical sensor is disposed corresponding to the through hole and receives sensing light through the hole. The width W of the hole meets the equation of H?W<D. H is the depth of the hole, and D is the distance between the two of the plurality of the light-emitting elements.
    Type: Application
    Filed: May 4, 2021
    Publication date: December 2, 2021
    Applicant: Innolux Corporation
    Inventors: Chin-Lung Ting, Chien-Chih Chen, Ti Chung Chang, Chih-Chieh Wang, Jenhung Li
  • Patent number: 11187851
    Abstract: A display device is provided. The display device includes a display panel that has a polarizer, a light source assembly, a first spacer, and a second spacer. The first spacer is disposed on the first side of the display panel near the light source assembly. The first spacer is located between the display panel and the light source assembly. The second spacer is disposed on the second side of the display panel, away from the light source assembly. The thickness of the first spacer is different than that of the second spacer.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: November 30, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Chien-Chih Chen, Chia-Chun Yang, Chin-Cheng Kuo
  • Publication number: 20210364922
    Abstract: A method of manufacturing a semiconductor device includes forming a photoresist underlayer over a semiconductor substrate. The photoresist underlayer includes a polymer, including a main polymer chain having pendant target groups, and pendant organic groups or photoacid generator groups. The main polymer chain is a polystyrene, a polyhydroxystyrene, a polyacrylate, a polymethylacrylate, a polymethylmethacrylate, a polyacrylic acid, a polyvinyl ester, a polymaleic ester, a poly(methacrylonitrile), or a poly(methacrylamide). Pendant target groups are selected from the group consisting of a substituted or unsubstituted: C2-C30 diol group, C1-C30 aldehyde group, and C3-C30 ketone group. Pendant organic groups are C3-C30 aliphatic or aromatic groups having at least one photosensitive functional group, and pendant photoacid generator groups are C3-050 substituted aliphatic or aromatic groups. A photoresist layer is formed over the photoresist underlayer.
    Type: Application
    Filed: April 15, 2021
    Publication date: November 25, 2021
    Inventor: Chien-Chih CHEN
  • Patent number: 11173661
    Abstract: A 3D printing head having a carrier, a pair of nozzle assemblies, a swing arm and a driving mechanism is provided. The nozzle assemblies are arranged on the carrier. Each nozzle assembly has a nozzle and a reset elastic member. Each nozzle is connected to the carrier and up-down movable relative to the carrier. The reset elastic members are connected between the carrier and the respective corresponding nozzles. The swing arm is pivoted on the carrier and able to swing one end thereof between the nozzles to selectively press one of the nozzles down. The driving mechanism is connected with the swing arm to rotate the swing arm. The swing arm can be rotated by the driving mechanism to press the operated nozzle down for printing, and a height difference between the nozzles is thereby formed to prevent the product from being scratched by the idle nozzle when printing.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: November 16, 2021
    Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC.
    Inventors: Chien-Chih Chen, Shih-Wei Huang, Yang-Teh Lee
  • Patent number: 11175354
    Abstract: A method for scanning artificial structure, wherein a scanning artificial structure apparatus comprises four magnetic-field sensors, the four magnetic-field sensors are non-coplanar configured, the method comprises following steps of: moving the scanning artificial structure apparatus along a scanning path within a to-be-tested area, in the meantime, measuring magnetic field by the four magnetic-field sensors, and recording a position sequence when measuring magnetic field, wherein four magnetic-field measurement sequences are measured by the four magnetic-field sensors; and calculating a magnetic-field variation distribution from the four magnetic-field measurement sequences and the position sequence, wherein the magnetic-field variation distribution is corresponding to at least one artificial structure distribution.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: November 16, 2021
    Assignee: NATIONAL CENTRAL UNIVERSITY
    Inventors: Chien-Chih Chen, Yi-Chen Chu, Yung-Chieh Chuang
  • Publication number: 20210319693
    Abstract: Various aspects of methods, systems, and use cases include a robotic system and control or use of the robotic system. A method for autonomous movement of the robotic system may include receiving a target location, identifying robotic components of the robotic system that are in contact with a surface, and determining a robotic component of the robotic components to activate to cause the robotic system to move closer to the target location. The method may include activating, based on the determination, a motor of the robotic component to push against the surface to cause the robotic system to move towards the target location.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 14, 2021
    Inventor: Chien-Chih CHEN
  • Patent number: 11134567
    Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: September 28, 2021
    Assignee: Unimicron Technology Corp.
    Inventors: Yu-Shen Chen, I-Ta Tsai, Chien-Chih Chen
  • Patent number: 11062905
    Abstract: A lithography method is provided in accordance with some embodiments. The lithography method includes forming a metal-containing layer on a substrate, the metal-containing layer including a plurality of conjugates of metal-hydroxyl groups; treating the metal-containing layer at temperature that is lower than about 300° C. thereby causing a condensation reaction involving the plurality of conjugates of metal-hydroxyl groups; forming a patterned photosensitive layer on the treated metal-containing layer; and developing the patterned photosensitive layer so as to allow at least about 6% decrease of optimum exposure (Eop).
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: July 13, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chien-Chih Chen, Chien-Wei Wang
  • Patent number: 11054748
    Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: July 6, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Ming Chang, Wen Lo, Chun-Hung Liu, Chia-Hua Chang, Hsin-Wei Wu, Ta-Wei Ou, Chien-Chih Chen, Chien-Cheng Chen
  • Patent number: 11007715
    Abstract: A 3D print head includes a carrier connected with a horizontal slide rail, a pair of nozzle assemblies disposed on the carrier, a swing arm and a push rod. Each nozzle assembly includes a nozzle and an elastic member, and movably coupled to the carrier and capable of raising and lowering relative to the carrier. Each elastic member is connected between the carrier and the corresponding nozzle to raise the nozzle relative to the carrier. The swing arm is pivoted to the carrier, and one end there of can be moved between the nozzles to push one of the nozzles down. The push rod is extended from the swing arm. While the carrier moving along the horizontal slide rail, the push rod can be pushed to rotate the swing arm to push the print nozzle down, thus the product can be prevented from scratching by another idle nozzle while printing.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: May 18, 2021
    Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC.
    Inventors: Shih-Wei Huang, Chien-Chih Chen, Yang-Teh Lee
  • Patent number: 11003082
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a material layer over a substrate and providing a resist solution. The resist solution includes a plurality of first polymers and a plurality of second polymers, each of the first polymers includes a first polymer backbone, and a first acid-labile group (ALG) with a first activation energy bonded to the first polymer backbone. Each of the second polymers includes a second polymer backbone, and a second acid-labile group with a second activation energy bonded to the second polymer backbone, the second activation energy is greater than the first activation energy. The method includes forming a resist layer over the material layer, and the resist layer includes a top portion and a bottom portion, and the first polymers diffuse to the bottom portion, and the second polymers diffuse to the top portion.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: May 11, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Chih Chen, Yahru Cheng, Ching-Yu Chang
  • Publication number: 20210120701
    Abstract: The present disclosure provides a connector assembly including a receptacle connector, a shielding shell and a heat sink. The shielding shell covers the receptacle connector. The heat sink is assembled to the shielding shell and includes a heat dissipating base plate and a heat dissipating fin soldered on the heat dissipating base plate. The heat dissipating base plate has a soldering region on which solder is provided and a recessed channel provided between a rim of the heat dissipating base plate and an outer periphery of the soldering region. The solder is provided within the soldering region in a manner such that a face of the soldering region is covered by the solder.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 22, 2021
    Applicant: Molex, LLC
    Inventor: Chien-Chih CHEN