Patents by Inventor Chien Chih Chen

Chien Chih Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11054748
    Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: July 6, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Ming Chang, Wen Lo, Chun-Hung Liu, Chia-Hua Chang, Hsin-Wei Wu, Ta-Wei Ou, Chien-Chih Chen, Chien-Cheng Chen
  • Patent number: 11007715
    Abstract: A 3D print head includes a carrier connected with a horizontal slide rail, a pair of nozzle assemblies disposed on the carrier, a swing arm and a push rod. Each nozzle assembly includes a nozzle and an elastic member, and movably coupled to the carrier and capable of raising and lowering relative to the carrier. Each elastic member is connected between the carrier and the corresponding nozzle to raise the nozzle relative to the carrier. The swing arm is pivoted to the carrier, and one end there of can be moved between the nozzles to push one of the nozzles down. The push rod is extended from the swing arm. While the carrier moving along the horizontal slide rail, the push rod can be pushed to rotate the swing arm to push the print nozzle down, thus the product can be prevented from scratching by another idle nozzle while printing.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: May 18, 2021
    Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC.
    Inventors: Shih-Wei Huang, Chien-Chih Chen, Yang-Teh Lee
  • Patent number: 11003082
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a material layer over a substrate and providing a resist solution. The resist solution includes a plurality of first polymers and a plurality of second polymers, each of the first polymers includes a first polymer backbone, and a first acid-labile group (ALG) with a first activation energy bonded to the first polymer backbone. Each of the second polymers includes a second polymer backbone, and a second acid-labile group with a second activation energy bonded to the second polymer backbone, the second activation energy is greater than the first activation energy. The method includes forming a resist layer over the material layer, and the resist layer includes a top portion and a bottom portion, and the first polymers diffuse to the bottom portion, and the second polymers diffuse to the top portion.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: May 11, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Chih Chen, Yahru Cheng, Ching-Yu Chang
  • Publication number: 20210120701
    Abstract: The present disclosure provides a connector assembly including a receptacle connector, a shielding shell and a heat sink. The shielding shell covers the receptacle connector. The heat sink is assembled to the shielding shell and includes a heat dissipating base plate and a heat dissipating fin soldered on the heat dissipating base plate. The heat dissipating base plate has a soldering region on which solder is provided and a recessed channel provided between a rim of the heat dissipating base plate and an outer periphery of the soldering region. The solder is provided within the soldering region in a manner such that a face of the soldering region is covered by the solder.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 22, 2021
    Applicant: Molex, LLC
    Inventor: Chien-Chih CHEN
  • Publication number: 20210082970
    Abstract: An electronic device is provided. The electronic device includes a supporting substrate, a flexible substrate disposed on the supporting substrate, a first conductive layer disposed on the flexible substrate, a second conductive layer disposed on the first conductive layer, a plurality of organic elements disposed between the first conductive layer and the second conductive layer, and an opening passing through the supporting substrate and exposing a portion of the flexible substrate. The first conductive layer alternately contacts the second conductive layer and the plurality of organic elements.
    Type: Application
    Filed: December 2, 2020
    Publication date: March 18, 2021
    Inventors: Ti-Chung CHANG, Chih-Chieh WANG, Chien-Chih CHEN
  • Publication number: 20210078247
    Abstract: A 3D printing head having a carrier, a pair of nozzle assemblies, a swing arm and a driving mechanism is provided. The nozzle assemblies are arranged on the carrier. Each nozzle assembly has a nozzle and a reset elastic member. Each nozzle is connected to the carrier and up-down movable relative to the carrier. The reset elastic members are connected between the carrier and the respective corresponding nozzles. The swing arm is pivoted on the carrier and able to swing one end thereof between the nozzles to selectively press one of the nozzles down. The driving mechanism is connected with the swing arm to rotate the swing arm. The swing arm can be rotated by the driving mechanism to press the operated nozzle down for printing, and a height difference between the nozzles is thereby formed to prevent the product from being scratched by the idle nozzle when printing.
    Type: Application
    Filed: January 15, 2020
    Publication date: March 18, 2021
    Inventors: Chien-Chih CHEN, Shih-Wei HUANG, Yang-Teh LEE
  • Publication number: 20210078246
    Abstract: A 3D print head includes a carrier connected with a horizontal slide rail, a pair of nozzle assemblies disposed on the carrier, a swing arm and a push rod. Each nozzle assembly includes a nozzle and an elastic member, and movably coupled to the carrier and capable of raising and lowering relative to the carrier. Each elastic member is connected between the carrier and the corresponding nozzle to raise the nozzle relative to the carrier. The swing arm is pivoted to the carrier, and one end there of can be moved between the nozzles to push one of the nozzles down. The push rod is extended from the swing arm. While the carrier moving along the horizontal slide rail, the push rod can be pushed to rotate the swing arm to push the print nozzle down, thus the product can be prevented from scratching by another idle nozzle while printing.
    Type: Application
    Filed: January 2, 2020
    Publication date: March 18, 2021
    Inventors: Shih-Wei HUANG, Chien-Chih CHEN, Yang-Teh LEE
  • Patent number: 10950685
    Abstract: A tiled electronic device includes a first electronic device and a second electronic device adjacent to each other. The first electronic device includes a first substrate having a first upper surface, a first lower surface, and a first side surface; and a first flexible substrate including a first upper portion, a first lower portion, and a first connection portion. The first upper portion is disposed corresponding to the first upper surface. The first lower portion is disposed corresponding to the first lower surface. The first connection portion is disposed corresponding to the first side surface. The second electronic device includes a second substrate having a second upper surface, a second lower surface, and a second side surface. The second side surface is opposite and adjacent to the first side surface. The first connection portion is located between the first side surface and the second side surface.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: March 16, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Chien-Chih Chen, Shan-Hung Tsai, Chin-Der Chen, Cheng-Fu Wen, Chin-Lung Ting
  • Publication number: 20210057797
    Abstract: An antenna structure capable of transmitting a WiGig band for a head-mounted wireless transmission display device including a display screen and an overhead device is disclosed. The antenna structure includes at least two body portions, each of the body portions having at least a signal transceiving end, the body portions are respectively arranged at left and right sides of the display screen, and signal transceiving ends of the body portions are extended outward from the left and right sides of the display screen respectively.
    Type: Application
    Filed: November 9, 2020
    Publication date: February 25, 2021
    Applicant: HTC CORPORATION
    Inventors: Sheng Cherng LIN, Hsiao-Ling CHAN, Chen-Hao CHANG, Chien-Chih CHEN
  • Publication number: 20210041784
    Abstract: A method according to the present disclosure includes providing a substrate, depositing an underlayer over the substrate, depositing a photoresist layer over the underlayer, exposing a portion of the photoresist layer and a portion of the underlayer to a radiation source according to a pattern, baking the photoresist layer and underlayer, and developing the exposed portion of the photoresist layer to transfer the pattern to the photoresist layer. The underlayer includes a polymer backbone, a polarity switchable group, a cross-linkable group bonded to the polymer backbone, and photoacid generator. The polarity switchable group includes a first end group bonded to the polymer backbone, a second end group including fluorine, and an acid labile group bonded between the first end group and the second end group. The exposing decomposes the photoacid generator to generate an acidity moiety that detaches the second end group from the polymer backbone during the baking.
    Type: Application
    Filed: December 5, 2019
    Publication date: February 11, 2021
    Inventors: Chien-Chih Chen, Ching-Yu Chang
  • Publication number: 20210035798
    Abstract: A lithography method includes forming a bottom anti-reflective coating (BARC) layer on a substrate, wherein the BARC layer includes an organic polymer and a reactive chemical group having at least one of chelating ligands and capping monomers, wherein the reactive chemical group is bonded to the organic polymer; coating a metal-containing photoresist (MePR) layer on the BARC layer, wherein the MePR being sensitive to an extreme ultraviolet (EUV) radiation; performing a first baking process to the MePR layer and the BARC layer, thereby reacting a metal chemical structure of the MePR layer and the reactive chemical structure of the BARC layer and forming an interface layer between the MePR layer and the BARC layer; performing an exposure process using the EUV radiation to the MePR layer; and developing the MePR layer to form a patterned photoresist layer.
    Type: Application
    Filed: June 4, 2020
    Publication date: February 4, 2021
    Inventor: Chien-Chih Chen
  • Publication number: 20210019616
    Abstract: A separate quantization method of forming a combination of 4-bit and 8-bit data of a neural network is disclosed. When a training data set and a validation data set exist, a calibration manner is used to determine a threshold for activations of each of a plurality of layers of a neural network model, so as to determine how many of the activations to perform 8-bit quantization. In a process of weight quantization, the weights of each layer are allocated to 4-bit weights and 8-bit weights according to a predetermined ratio, so as to make the neural network model have a reduced size and a combination of 4-bit and 8-bit weights.
    Type: Application
    Filed: September 27, 2019
    Publication date: January 21, 2021
    Inventors: TIEN-FU CHEN, CHIEN-CHIH CHEN, JING-REN CHEN
  • Publication number: 20210013679
    Abstract: A connector assembly is provided which includes a shielding shell, a receptacle connector and a heat sink. The shielding shell has a top wall, a receiving cavity positioned inside, an inserting opening which is positioned at a front end of the shielding shell and communicated with the receiving cavity and a window which is formed to the top wall, extends rearwardly and is communicated with the receiving cavity. The receptacle connector is provided to a rear segment of the receiving cavity. The heat sink is provided to the top wall and includes a heat dissipating base. A bottom face of the heat dissipating base downwardly enters the receiving cavity via the window and directly faces a top face of the receptacle connector. The bottom face of the heat dissipating base facing the receptacle connector is provided with a front stopping portion which is adapted to stop a mating module.
    Type: Application
    Filed: July 9, 2020
    Publication date: January 14, 2021
    Applicant: Molex, LLC
    Inventor: Chien-Chih CHEN
  • Patent number: 10886307
    Abstract: The present disclosure is related to an electronic device that includes a display area and a non-display area. The electronic device includes a supporting substrate, a flexible substrate, a first organic insulating layer, a first conductive layer, a second conductive layer, a second organic insulating layer, and a resilient structure. The flexible substrate is disposed on the supporting substrate. The first organic insulating layer is disposed on the flexible substrate. The first conductive layer is disposed on the first organic insulating layer. The second conductive layer is disposed on the first conductive layer. The second organic insulating layer is disposed on the second conductive layer. The resilient structure includes resilient elements disposed between the first conductive layer and the second conductive layer. The first conductive layer alternately contacts the second conductive layer and the resilient elements.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: January 5, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Ti-Chung Chang, Chih-Chieh Wang, Chien-Chih Chen
  • Patent number: 10872873
    Abstract: A method is provided and includes the following steps. A first wafer is coupled to a first support of a bonding tool and a second wafer is coupled to a second support of the bonding tool. The second wafer is bonded to the first wafer with the first wafer coupled to the first support. Whether a bubble is between the bonded first and second wafers in the bonding tool is detected.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: December 22, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chien-Chih Chen, Tsung-Yi Yang, Chung-I Hung, Mu-Han Cheng, Tzu-Shin Chen, Su-Yu Yeh
  • Patent number: 10868352
    Abstract: A method for folding and extending an antenna structure capable of transmitting a WiGig band is provided. The method has the following steps: (1) mounting a WiGig module within a base; (2) pivotally arranging the antenna structure on the base; and (3) folding or extending the antenna structure relative to the base to correspondingly reduce or increase the antenna structure for transmitting and receiving a valid range of a wireless signal. The antenna structure has two body portions, and each of the two body portions has a pivoting end and a signal receiving end opposite to the pivoting end. Each of the pivoting ends is pivotally disposed on the base at a first specific angle with respect to a horizontal plane, and each of the signal receiving ends is inclined downward by a second specific angle with respect to the body portion and disposed away from the body portion.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: December 15, 2020
    Assignee: HTC CORPORATION
    Inventors: Sheng Cherng Lin, Hsiao-Ling Chan, Chen-Hao Chang, Chien-Chih Chen
  • Publication number: 20200388520
    Abstract: In an embodiment, a system includes: a cassette comprising a slit opening configured to house a wafer; a blade configured to move the wafer to and from the slit opening by extending into the slit opening, wherein a blade thickness of the blade is at most ? of a height of the slit opening and wherein the blade is configured to secure the wafer within a pocket on the blade that is at least ? of a wafer thickness of the wafer.
    Type: Application
    Filed: June 22, 2020
    Publication date: December 10, 2020
    Inventors: Chien-Chih Chen, Yao-Min Yu, Ching-Ling Lee, Ren-Dou Lee
  • Patent number: 10825684
    Abstract: Provided is a material composition and method for that includes providing a substrate and forming a resist layer over the substrate. In various embodiments, the resist layer includes a multi-metal complex including an extreme ultraviolet (EUV) absorption element and a bridging element. By way of example, the EUV absorption element includes a first metal type and the bridging element includes a second metal type. In some embodiments, an exposure process is performed to the resist layer. After performing the exposure process, the exposed resist layer is developed to form a patterned resist layer.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: November 3, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shu-Hao Chang, Chien-Chih Chen, Kuo-Chang Kau, Jeng-Horng Chen, Pi-Yeh Chia, Chi-Ren Chen, Ying-Chih Lin
  • Patent number: 10792783
    Abstract: A system, a control method and an apparatus for chemical mechanical polishing (CMP) are introduced in the present application. The CMP apparatus may include a polishing pad, a first sensor, a polishing head and a condition. The polishing pad has a plurality of groves arranged randomly or in a specific pattern. The first sensor is configured to measure the pad profile of the polishing pad, where the pad profile includes the depth of each of the grooves on the polishing pad. The polishing head and the conditioner are operated according to at least one polishing condition, and the at least one polishing condition is tuned according to the pad profile.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: October 6, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiang-Chu Hu, Chun-Hai Huang, Mu-Han Cheng, Yu-Chin Tseng, Chien-Chih Chen, Tzu-Shin Chen
  • Patent number: 10795200
    Abstract: A display device includes a display panel, a light shielding unit and a back plate. The display panel includes a first substrate, a second substrate and an upper polarizer. The first substrate is disposed corresponding to the second substrate. The upper polarizer is disposed on the second substrate. The light shielding unit is connected to the upper polarizer. The first substrate is disposed on the back plate.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: October 6, 2020
    Assignee: INNOLUX CORPORATION
    Inventors: Chien-Chih Chen, Chia-Chun Yang, Chin-Cheng Kuo, Hsin-Tien Wu, Chih-Jen Chang