Abstract: A dodge method of machining path and a machining system is provided. By inserting a flag into an original machining path, an interference between the flag and a suction cup of a support unit is determined. A coding instruction is inserted at the interference to edit the original machining path, thereby generating an edited machining path. Therefore, when a machining equipment executes the edited machining path, the support unit may smoothly dodge a knife of the machining equipment.

Abstract: A system for acceleration adjustment of machine tool at rapid traverse includes a signal measurement module, a signal judgment module and an acceleration optimization module. The machine tool has a servo motor and a working platform. The signal measurement module measures signals while the servo motor drives the working platform from a first specific position to a second specific position, or from the second specific position back to the first specific position. The signal judgment module judges whether the actual maximum current value of the motor is equal to the manufacturer's specification according to the signals; and if negative, the acceleration optimization module calculates and optimizes an axial acceleration till an optimal value is achieved. Then, a curve smoothing time of the optimal acceleration is calculated and optimized by the acceleration optimization module. In addition, a method for acceleration adjustment of machine tool at rapid traverse is provided.

Abstract: A process diagnosis system includes a digital twin calculation unit, a process diagnosis calculation unit, and a remote calculation analysis unit. The digital twin calculation unit obtains a vibration-related parameter and a cutting-related parameter of a processing device, and performs a simulation calculation for the vibration-related parameter, the cutting-related parameter and a three-dimensional model corresponding to the processing device to generate a three-dimensional calculation result. The process diagnosis calculation unit receives a three-dimensional calculation result and displays the three-dimensional calculation result. The remote calculation analysis unit receives the three-dimensional calculation result, and performs a simulation analysis for the three-dimensional calculation result to generate an analysis result.

Abstract: A method for analyzing an overcutting defect of a machining process comprises steps as following. A machining code is executed to generate a cutting face, wherein the cutting face comprises a plurality of machining paths. A specified machining path is defined from the plurality of machining paths and a specified node is set on the specified machining path. A sectional plane passing through the specified node is calculated. A plurality of intersection points between the sectional plane and the other machining paths which are different from the specified machining path are obtained. A first adjacent intersection point a second adjacent intersection point are specified from the intersection points. A connection line located between the first adjacent intersection point and the second adjacent intersection point is obtained. A distance between the specified node and connection line is calculate and the distance is defined as an overcutting amount of the specified node.

Abstract: A light-emitting device includes a substrate including a top surface; a semiconductor stack including a first semiconductor layer, an active layer and a second semiconductor layer formed on the substrate, wherein a portion of the top surface is exposed; a distributed Bragg reflector (DBR) formed on the semiconductor stack and contacting the portion of the top surface of the substrate; a metal layer formed on the distributed Bragg reflector (DBR), contacting the portion of the top surface of the substrate and being insulated with the semiconductor stack; and an insulation layer formed on the metal layer and contacting the portion of the top surface of the substrate.

Abstract: A makeup mirror display with multiple cameras and variable color temperature light source includes an adjustable makeup mirror, a makeup mirror display, at least two cameras, and at least one variable color temperature light source. The makeup mirror display is arranged at one end of the adjustable makeup mirror surface and includes at least one control button and a control circuit arranged therein. The at least two cameras are respectively arranged on a left side and a right side of the makeup mirror display and electrically connected with the makeup mirror display. The at least one variable color temperature light source is disposed on one side of the makeup mirror display and electrically connected with the makeup mirror display. Therefore, the user can perform makeup more efficiently and finish a more perfect makeup, so as to enhance the overall practicability and convenience.

Abstract: A method for reducing vibration of a robot arm includes: a step of mounting at least one inertia actuator and at least one vibration signal capturing unit to a processing end of a robot arm; a step of applying the at least one vibration signal capturing unit to detect a vibration generated at the processing end of the robot arm so as to generate a vibration signal; a step of applying a central processing unit to evaluate the vibration signal and coordinates of the processing end of the robot arm so as to capture at least one set of corresponding control parameters for calculating at least one output force; and, a step of having the inertia actuator to apply the output force to the processing end of the robot arm for counteracting the vibration at the processing end of the robot arm.

Abstract: A light-emitting device includes a substrate including a top surface; a semiconductor stack including a first semiconductor layer, an active layer and a second semiconductor layer formed on the substrate, wherein a portion of the top surface is exposed; a distributed Bragg reflector (DBR) formed on the semiconductor stack and contacting the portion of the top surface of the substrate; a metal layer formed on the distributed Bragg reflector (DBR), contacting the portion of the top surface of the substrate and being insulated with the semiconductor stack; and an insulation layer formed on the metal layer and contacting the portion of the top surface of the substrate.

Abstract: Sensing pixels each store a sensing voltage level. A method for driving the plurality of sensing pixels includes providing a plurality of readout scan signals to the plurality of sensing pixels, and providing a plurality of reset scan signals to the plurality of sensing pixels. One of the plurality of readout scan signals enables one of the plurality of sensing pixels to output the sensing voltage level stored in the one of the plurality of sensing pixels. One of plurality of reset scan signals resets the sensing voltage level stored in one of the plurality of sensing pixels. An nth reset scan signal of the plurality of reset scan signals is started behind an nth readout scan signal of the plurality of readout scan signals in time domain.

Abstract: Sensing pixels each store a sensing voltage level. A method for driving the plurality of sensing pixels includes providing a plurality of readout scan signals to the plurality of sensing pixels, and providing a plurality of reset scan signals to the plurality of sensing pixels. One of the plurality of readout scan signals enables one of the plurality of sensing pixels to output the sensing voltage level stored in the one of the plurality of sensing pixels. One of plurality of reset scan signals resets the sensing voltage level stored in one of the plurality of sensing pixels. One of the plurality of reset scan signals is generated by converting one of the plurality of readout scan signals with a level shift circuit or one of the plurality of readout scan signals is generated by converting one of the plurality of reset scan signals with a level shift circuit.

Abstract: A support mechanism includes a fixed body, a rotating unit, a moving unit and a driving unit. The rotating unit is rotationally mounted to the fixed body. The moving unit, disposed at the fixed body, includes a ball screw spline shaft, a ball screw nut and a ball spline nut. The ball screw nut and the ball spline nut are both rotatably disposed at the ball screw spline shaft moved together with the rotating unit. The driving unit, disposed at the fixed body, includes a first driving member and a second driving member to rotate the ball screw nut and the ball spline nut, respectively. With different rotation pairs of the ball screw nut and the ball spline nut to the ball screw spline shaft, the ball screw spline shaft is driven to move, and the ball screw spline shaft is further to move the rotating unit.

Abstract: A makeup mirror display with multiple cameras and variable color temperature light source includes an adjustable makeup mirror, a makeup mirror display, at least two cameras, and at least one variable color temperature light source. The makeup mirror display is arranged at one end of the adjustable makeup mirror surface and includes at least one control button and a control circuit arranged therein. The at least two cameras are respectively arranged on a left side and a right side of the makeup mirror display and electrically connected with the makeup mirror display. The at least one variable color temperature light source is disposed on one side of the makeup mirror display and electrically connected with the makeup mirror display. Therefore, the user can perform makeup more efficiently and finish a more perfect makeup, so as to enhance the overall practicability and convenience.

Abstract: A method for analyzing an overcutting defect of a machining process comprises steps as following. A machining code is executed to generate a cutting face, wherein the cutting face comprises a plurality of machining paths. A specified machining path is defined from the plurality of machining paths and a specified node is set on the specified machining path. A sectional plane passing through the specified node is calculated. A plurality of intersection points between the sectional plane and the other machining paths which are different from the specified machining path are obtained. A first adjacent intersection point a second adjacent intersection point are specified from the intersection points. A connection line located between the first adjacent intersection point and the second adjacent intersection point is obtained. A distance between the specified node and connection line is calculate and the distance is defined as an overcutting amount of the specified node.

Abstract: A system for acceleration adjustment of machine tool at rapid traverse includes a signal measurement module, a signal judgment module and an acceleration optimization module. The machine tool has a servo motor and a working platform. The signal measurement module measures signals while the servo motor drives the working platform from a first specific position to a second specific position, or from the second specific position back to the first specific position. The signal judgment module judges whether the actual maximum current value of the motor is equal to the manufacturer's specification according to the signals; and if negative, the acceleration optimization module calculates and optimizes an axial acceleration till an optimal value is achieved. Then, a curve smoothing time of the optimal acceleration is calculated and optimized by the acceleration optimization module. In addition, a method for acceleration adjustment of machine tool at rapid traverse is provided.

Abstract: An electronic device is provided. The electronic device includes a first substrate; a second substrate, disposed opposite to the first substrate; a liquid crystal layer, disposed between the first substrate and the second substrate; a sensing circuit, disposed on the first substrate and having a high voltage wire; and a conductor, disposed between the high voltage wire and the liquid crystal layer; wherein the conductor is less than the high voltage wire in voltage value.

Abstract: A method for adjusting a workpiece-supporting module includes: setting initial support position information of a workpiece, the initial support position information including positions of support devices and a spacing value for separating the support devices; according to the initial support position information, applying a finite element method to analyze a CAD file of the workpiece to obtain workpiece deformation information; according to the workpiece deformation information and target workpiece deformation information, realizing support position information corresponding to each support device, the support position information including X-axis coordinates and Y-axis coordinates; according to the support position information and a conversion program, obtaining a Z-axis coordinate and a normal vector of each support devices; and, according to the support position information, the Z-axis coordinate and the normal vector, adjusting the position and the angle of each support device.

Abstract: An adjustable workpiece support system includes an adjustable support apparatus, an analysis support point module, a coordinate post-processing module and a control module. The adjustable support apparatus has a group of support devices for supporting a supported workpiece, the each support device being adjustable in height and angle. The analysis support point module is used to import a computer-aided design file of the supported workpiece, and analyze the computer-aided design file to obtain a group of support points of the supported workpiece. The coordinate post-processing module is configured to calculate the support coordinates of the each support device corresponding to the group of support points. The control module is configured to receive the support coordinates of the each support device, and adjust the height and angle of the each support device to support the supported workpiece, so that the amount of deformation of the supported workpiece is the minimum.

Abstract: A light-emitting device includes a substrate including a top surface; a semiconductor stack including a first semiconductor layer, an active layer and a second semiconductor layer formed on the substrate, wherein a portion of the top surface is exposed; a distributed Bragg reflector (DBR) formed on the semiconductor stack and contacting the portion of the top surface of the substrate; a metal layer formed on the distributed Bragg reflector (DBR), contacting the portion of the top surface of the substrate and being insulated with the semiconductor stack; and an insulation layer formed on the metal layer and contacting the portion of the top surface of the substrate.

Abstract: A distributed computing system uses dynamically calculates a subset size for each of a plurality of load balancers. Each of a plurality of load balancers logs requests from client devices for connections to back-end servers and periodically sends a request report to a traffic aggregator, which aggregates the report requests from the load balancers in the corresponding zone. Each traffic aggregator sends the aggregated request data to a traffic controller, which aggregates the request data to determine a total number of requests received at the system. The total request data is transmitted through each traffic aggregator to each load balancer instance, which calculates a percentage of the total number of requests produced by the load balancer and determines a subset size based on the calculated percentage.

Abstract: A light-emitting device comprises a substrate comprising a sidewall, a first top surface, and a second top surface, wherein the second top surface is closer to the sidewall of the substrate than the first top surface to the sidewall of the substrate; a semiconductor stack formed on the substrate comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a dicing street surrounding the semiconductor stack, and exposing the first top surface and the second top surface of the substrate; a protective layer covering the semiconductor stack; a reflective layer comprising a Distributed Bragg Reflector structure covering the protective layer; and a cap layer covering the reflective layer, wherein the second top surface of the substrate is not covered by the protective layer, the reflective layer, and the cap layer.