Abstract: A light-emitting device comprises a substrate comprising a top surface and a sidewall; a semiconductor stack formed on the top surface of the substrate comprising a first semiconductor layer, an active layer and a second semiconductor layer; a dicing street surrounding the semiconductor stack and exposing the top surface of the substrate; a protective layer covering the semiconductor stack and the dicing street; a reflective layer comprising a Distributed Bragg Reflector structure and covering the protective layer; and a cap layer covering the reflective layer, wherein the reflective layer comprises an uneven portion adjacent to the sidewall of the substrate, and the uneven portion comprises an uneven thickness.

Abstract: A distributed computing system uses dynamically calculates a subset size for each of a plurality of load balancers. Each of a plurality of load balancers logs requests from client devices for connections to back-end servers and periodically sends a request report to a traffic aggregator, which aggregates the report requests from the load balancers in the corresponding zone. Each traffic aggregator sends the aggregated request data to a traffic controller, which aggregates the request data to determine a total number of requests received at the system. The total request data is transmitted through each traffic aggregator to each load balancer instance, which calculates a percentage of the total number of requests produced by the load balancer and determines a subset size based on the calculated percentage.

Abstract: Sensing pixels each store a sensing voltage level. A method for driving the plurality of sensing pixels includes providing a plurality of readout scan signals to the plurality of sensing pixels, and providing a plurality of reset scan signals to the plurality of sensing pixels. One of the plurality of readout scan signals enables one of the plurality of sensing pixels to output the sensing voltage level stored in the one of the plurality of sensing pixels. One of plurality of reset scan signals resets the sensing voltage level stored in one of the plurality of sensing pixels. One of the plurality of reset scan signals is generated by converting one of the plurality of readout scan signals with a level shift circuit or one of the plurality of readout scan signals is generated by converting one of the plurality of reset scan signals with a level shift circuit.

Abstract: The present disclosure provides a display device including a liquid crystal panel, a light source, and an optical sensor. The light source includes two light emitting elements for emitting two lights with different wavelengths to the liquid crystal panel. The optical sensor is for sensing one of the lights, and the light source is disposed between the liquid crystal panel and the optical sensor.

Abstract: A light-emitting device includes a substrate including a top surface; a semiconductor stack including a first semiconductor layer, an active layer and a second semiconductor layer formed on the substrate, wherein a portion of the top surface is exposed; a distributed Bragg reflector (DBR) formed on the semiconductor stack and contacting the portion of the top surface of the substrate; a metal layer formed on the distributed Bragg reflector (DBR), contacting the portion of the top surface of the substrate and being insulated with the semiconductor stack; and an insulation layer formed on the metal layer and contacting the portion of the top surface of the substrate.

Abstract: A light-emitting device comprises a substrate; a first light-emitting unit and a second light-emitting unit formed on the substrate, each of the first light-emitting unit and the second light-emitting unit comprises a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, wherein the first light-emitting unit comprises a first semiconductor mesa and a first surrounding part surrounding the first semiconductor mesa, and the second light-emitting unit comprises a second semiconductor mesa and a second surrounding part surrounding the second semiconductor mesa; a trench formed between the first light-emitting unit and the second light-emitting unit and exposing the substrate; a first insulating layer comprising a first opening on the first surrounding part and a second opening on the second semiconductor layer of the second light-emitting unit; and a connecting electrode comprising a first connecting part on the first

Abstract: A method for reducing vibration of a robot arm includes: a step of mounting at least one inertia actuator and at least one vibration signal capturing unit to a processing end of a robot arm; a step of applying the at least one vibration signal capturing unit to detect a vibration generated at the processing end of the robot arm so as to generate a vibration signal; a step of applying a central processing unit to evaluate the vibration signal and coordinates of the processing end of the robot arm so as to capture at least one set of corresponding control parameters for calculating at least one output force; and, a step of having the inertia actuator to apply the output force to the processing end of the robot arm for counteracting the vibration at the processing end of the robot arm.

Abstract: A method for inspecting defects of a machining path is provided. The method includes the following steps. Firstly, a contour mold with a plurality of surface nodes is generated according to a machining program code. Next, a normal vector of each surface node of the contour mold is calculated. Then, a tangent vector of a block of the machining program code corresponding to the normal vector is calculated. Afterwards, an error information is obtained according to a relation between the normal vector and the tangent vector. When the error information is greater than a predetermined value, a defect information is shown on the contour mold.

Abstract: A light-emitting element includes a semiconductor light-emitting stack including a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed therebetween; a first conductive layer disposed on the second semiconductor layer and electrically connecting the second semiconductor layer; a second conductive layer disposed on the second semiconductor layer and electrically connecting the first semiconductor layer; and a cushion part disposed on and directly contacts the first conductive layer, wherein in a top view, the cushion part is surrounded by and electrically isolated from the second conductive layer.

Abstract: An optoelectronic device includes a first semiconductor layer, a second semiconductor layer and an active layer between the first semiconductor layer and the second semiconductor layer; a first insulating layer on the second semiconductor layer and including a plurality of first openings exposing the first semiconductor layer, wherein the first openings include a first group and a second group; a third electrode on the first insulating layer and including a first extended portion and a second extended portion, wherein the first extended portion and the second extended portion are respectively electrically connected to the first semiconductor layer through the first group of the first openings and the second group of the first openings, and wherein the number of the first group of the first openings is different from the number of the second group of the first openings; and a plurality of fourth electrodes on the second insulating layer and electrically connected to the second semiconductor layer, wherein in a

Abstract: A light-emitting device includes a substrate; a first light-emitting unit and a second light-emitting unit formed on the substrate, each of the first light-emitting unit and the second light-emitting unit includes a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer; a trench formed between the first light-emitting unit and the second light-emitting unit, and exposing the substrate; and a connecting electrode including a first connecting part on the first light-emitting unit and connected to the first semiconductor layer of the first light-emitting unit, a second connecting part on the second light-emitting unit and connected to the second semiconductor layer of the second light-emitting unit, and a third connecting part formed in the trench to connect the first connecting part and the second connecting part.

Abstract: A method for inspecting defects of a machining path is provided. The method includes the following steps. Firstly, a contour mold with a plurality of surface nodes is generated according to a machining program code. Next, a normal vector of each surface node of the contour mold is calculated. Then, a tangent vector of a block of the machining program code corresponding to the normal vector is calculated. Afterwards, an error information is obtained according to a relation between the normal vector and the tangent vector. When the error information is greater than a predetermined value, a defect information is shown on the contour mold.

Abstract: An adjustable workpiece support system includes an adjustable support apparatus, an analysis support point module, a coordinate post-processing module and a control module. The adjustable support apparatus has a group of support devices for supporting a supported workpiece, the each support device being adjustable in height and angle. The analysis support point module is used to import a computer-aided design file of the supported workpiece, and analyze the computer-aided design file to obtain a group of support points of the supported workpiece. The coordinate post-processing module is configured to calculate the support coordinates of the each support device corresponding to the group of support points. The control module is configured to receive the support coordinates of the each support device, and adjust the height and angle of the each support device to support the supported workpiece, so that the amount of deformation of the supported workpiece is the minimum.

Abstract: An optoelectronic device, comprising a first semiconductor layer comprising four boundaries comprising two longer sides and two shorter sides; a second semiconductor layer formed on the first semiconductor layer; and a plurality of first conductive type electrodes formed on the first semiconductor layer, wherein one first part of the plurality of first conductive type electrodes is formed on a corner constituted by one of the two longer sides and one of the two shorter sides, and wherein one fourth part of the plurality of first conductive type electrodes is formed along the one of the two longer sides, the one fourth part of the plurality of first conductive type electrodes comprises a head portion and a tail portion, the head portion comprises a width larger than that of the tail portion.

Abstract: A distributed computing system uses dynamically calculates a subset size for each of a plurality of load balancers. Each of a plurality of load balancers logs requests from client devices for connections to back-end servers and periodically sends a request report to a traffic aggregator, which aggregates the report requests from the load balancers in the corresponding zone. Each traffic aggregator sends the aggregated request data to a traffic controller, which aggregates the request data to determine a total number of requests received at the system. The total request data is transmitted through each traffic aggregator to each load balancer instance, which calculates a percentage of the total number of requests produced by the load balancer and determines a subset size based on the calculated percentage.

Abstract: A light-emitting device includes a substrate including a top surface; a semiconductor stack including a first semiconductor layer, an active layer and a second semiconductor layer formed on the substrate, wherein a portion of the top surface is exposed; a distributed Bragg reflector (DBR) formed on the semiconductor stack and contacting the portion of the top surface of the substrate; a metal layer formed on the distributed Bragg reflector (DBR), contacting the portion of the top surface of the substrate and being insulated with the semiconductor stack; and an insulation layer formed on the metal layer and contacting the portion of the top surface of the substrate.

Abstract: A light-emitting element includes a semiconductor light-emitting stack including a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed therebetween; a first conductive layer disposed on the second semiconductor layer and electrically connecting the second semiconductor layer; a second conductive layer disposed on the second semiconductor layer and electrically connecting the first semiconductor layer; and a cushion part disposed on and directly contacts the first conductive layer, wherein in a top view, the cushion part is surrounded by and electrically isolated from the second conductive layer.

Abstract: A support mechanism includes a fixed body, a rotating unit, a moving unit and a driving unit. The rotating unit is rotationally mounted to the fixed body. The moving unit, disposed at the fixed body, includes a ball screw spline shaft, a ball screw nut and a ball spline nut. The ball screw nut and the ball spline nut are both rotatably disposed at the ball screw spline shaft moved together with the rotating unit. The driving unit, disposed at the fixed body, includes a first driving member and a second driving member to rotate the ball screw nut and the ball spline nut, respectively. With different rotation pairs of the ball screw nut and the ball spline nut to the ball screw spline shaft, the ball screw spline shaft is driven to move, and the ball screw spline shaft is further to move the rotating unit.

Abstract: A simulation method for milling by use of a dynamic position error includes the steps of: (a) generating a milling surface from a numerical control code, the milling surface having a plurality of grid points, the numerical control code having a position command; (b) calculating a normal vector for each of the plurality of grid points on the milling surface; (c) feeding back a position feedback of each of the plurality of grid points by the controller of the machine tool, and deriving a corresponding three-axis dynamic position error of the milling surface according to the position command and the position feedback; (d) calculating a component of the normal vector for the three-axis dynamic position error so as to obtain a normal-vector error value of the corresponding grid point; and, (e) displaying undercutting information of the normal-vector error value of the corresponding grid point on the milling surface.

Abstract: A method of load characteristic identification and acceleration adjustment for a machine tool is provided. A first acceleration of a transmission system is set according to the weight of a workpiece, and the working platform and the workpiece are driven at the first acceleration. A first elastic deformation of the transmission system and an amount of first position error of the transmission system are calculated when transmission system is moved at the first acceleration. A dynamic error is calculated according to the first elastic deformation and the first position error. When the dynamic error is less than or greater than a target error, a second acceleration is set to the transmission system, and a second elastic deformation and a second position error are calculated when the transmission system moves at the second acceleration unit the dynamic error is converged to the target error.