Abstract: A light-emitting element includes: a semiconductor light-emitting stack including a first semiconductor layer with a first conductivity, an active layer, and a second semiconductor layer with a second conductivity; a first conductive layer disposed on the semiconductor light-emitting stack and electrically connecting the second semiconductor layer; a first insulating layer on the first conductive layer; a second conductive layer disposed on the first insulating layer and electrically connecting the first semiconductor layer; a second insulating layer on the second conductive layer; a first pad and a second pad on the second conductive layer; and a cushion part disposed between the first pad and the second pad.

Abstract: A machine tool and a feed saddle structure thereof are provided. The feed saddle structure includes: a fixed column having a first vertical side and a horizontal side adjacent to the first vertical side; a feed saddle having a second vertical side corresponding in position to the first vertical side of the fixed column, and a bottom portion being adjacent to the second vertical side and corresponding in position to the horizontal side of the fixed column; a first guide rail and a second guide rail disposed on the first vertical side and the horizontal side of the fixed column, respectively; and a first slider and a second slider disposed on the second vertical side and the bottom portion of the feed saddle, respectively, and engaged with the first guide rail and the second guide rail, respectively, thereby increasing the dynamic and static rigidity of the machine tool.

Abstract: A light-emitting element includes: a semiconductor light-emitting stack including a first semiconductor layer with a first conductivity, an active layer, and a second semiconductor layer with a second conductivity; a first conductive layer disposed on the semiconductor light-emitting stack and electrically connecting the second semiconductor layer; a first insulating layer on the first conductive layer; a second conductive layer disposed on the first insulating layer and electrically connecting the first semiconductor layer; a second insulating layer on the second conductive layer; a first pad and a second pad on the second conductive layer; and a cushion part disposed between the first pad and the second pad.

Abstract: A structural topology optimization design method is provided. A structural topology optimization question is defined to determine at least one set of load and restriction condition and a parameter of lower limit of volume capacity related to a design space model. This model is divided into mesh grids for performing finite element analysis (FEA). Strain energy of each element after FEA is obtained according to the established load and restriction condition and used as a basis for calculating sensitivity of each element. A part of elements is removed or retained according to the degree of sensitivity of each element, and the structural profile and the total volume capacity and total strain energy of residual elements of the structural profile are recorded after each loop was completed. A display interface is used to sequentially show the structural profile and a relationship diagram of structural volume capacity vs structural strain energy.

Abstract: An optoelectronic device, comprising: a first semiconductor layer comprising four boundaries, a corner formed by two of the neighboring boundaries, a first surface, and a second surface opposite to the first surface; a second semiconductor layer formed on the first surface of the first semiconductor layer; a second conductive type electrode formed on the second semiconductor layer; and two first conductive type electrodes formed on the first surface, wherein the first conductive type electrodes are separated and formed a pattern.

Abstract: A machine tool design method includes: receiving a finite element model of tool-spindle system including a cutting tool, a working spindle speed range, and a target cutting depth; providing a simplified finite element model of main frames of machine tool and initializing its configuration parameters including an equivalent stiffness and an equivalent mass; combining the simplified finite element model of main frames of machine tool with the finite element model of tool-spindle system to construct an equivalent machine tool model; according to a response of the configuration parameters, proceeding a cutting stability prediction of the equivalent machine tool model, and computing an objective function value based on a predicted result; and determining whether the objective function value meets a preset design requirement, if yes, employing the configuration parameters to be references to design a machine tool, if not, updating the configuration parameters and proceeding the cutting stability prediction again.

Abstract: A system and method for aligning a probe, such as a wafer-level test probe, with wafer contacts is disclosed. An exemplary method includes receiving a wafer containing a plurality of alignment contacts and a probe card containing a plurality of probe points at a wafer test system. A historical offset correction is received. Based on the historical offset correct, an orientation value for the probe card relative to the wafer is determined. The probe card is aligned to the wafer using the orientation value in an attempt to bring a first probe point into contact with a first alignment contact. The connectivity of the first probe point and the first alignment contact is evaluated. An electrical test of the wafer is performed utilizing the aligned probe card, and the historical offset correction is updated based on the orientation value.

Abstract: A system and method for aligning a probe, such as a wafer-level test probe, with wafer contacts is disclosed. An exemplary method includes receiving a wafer containing a plurality of alignment contacts and a probe card containing a plurality of probe points at a wafer test system. A historical offset correction is received. Based on the historical offset correct, an orientation value for the probe card relative to the wafer is determined. The probe card is aligned to the wafer using the orientation value in an attempt to bring a first probe point into contact with a first alignment contact. The connectivity of the first probe point and the first alignment contact is evaluated. An electrical test of the wafer is performed utilizing the aligned probe card, and the historical offset correction is updated based on the orientation value.

Abstract: A hydrostatic rail guide includes a guide rail, a guide carriage, a hydrostatic supply device, a measurement device and a controller. The guide carriage is hydrostatically mounted on the guide rail and has a hydrostatic channel filled with oil. The oil keeps the guide carriage and the guide rail at a gap. The hydrostatic supply device is adapted for supplying the oil to the hydrostatic channel and adjusting the pressure of the oil. The measurement device is installed on the guide carriage and adapted for detecting the gap between the guide carriage and the guide rail and for producing a distance signal of the measured gap. The controller is connected to the hydrostatic supply device and the measurement device. The controller is adapted for controlling the hydrostatic supply device, based on the distance signal, in order to adjust the hydrostatic pressure of the oil after being pressurized.

Abstract: The present invention relates to a tool change device, which comprises: a base, being arranged for enabling the same to move reciprocatingly between a first position and a second position; a guiding block, formed with a first engaging part and a second engaging part that are serially connected to each other; a lever, formed with a pivot point, a first end and a second end that are arranged opposite to each other while allowing the pivot point to be arranged therebetween; and a spindle, configured with a drive mechanism to be used for connecting the spindle to a tool, being disposed mounting on the base for allowing the same to move in synchronization with the reciprocating movement of the base; wherein, the lever is pivotally coupled to the base by the pivot point thereof for enabling the lever to move in synchronization with the reciprocating movement of the base.